JPH0423154U - - Google Patents

Info

Publication number
JPH0423154U
JPH0423154U JP1990063195U JP6319590U JPH0423154U JP H0423154 U JPH0423154 U JP H0423154U JP 1990063195 U JP1990063195 U JP 1990063195U JP 6319590 U JP6319590 U JP 6319590U JP H0423154 U JPH0423154 U JP H0423154U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
diode array
array lamp
emitting diodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990063195U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990063195U priority Critical patent/JPH0423154U/ja
Publication of JPH0423154U publication Critical patent/JPH0423154U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Landscapes

  • Dot-Matrix Printers And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
JP1990063195U 1990-06-14 1990-06-14 Pending JPH0423154U (ru)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990063195U JPH0423154U (ru) 1990-06-14 1990-06-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990063195U JPH0423154U (ru) 1990-06-14 1990-06-14

Publications (1)

Publication Number Publication Date
JPH0423154U true JPH0423154U (ru) 1992-02-26

Family

ID=31593029

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990063195U Pending JPH0423154U (ru) 1990-06-14 1990-06-14

Country Status (1)

Country Link
JP (1) JPH0423154U (ru)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006210949A (ja) * 2002-04-12 2006-08-10 Shiro Sakai 発光装置
US7417259B2 (en) 2002-08-29 2008-08-26 Seoul Semiconductor Co., Ltd. Light-emitting device having light-emitting elements
JP2008211255A (ja) * 2002-04-12 2008-09-11 Seoul Semiconductor Co Ltd 発光装置
JP2009158507A (ja) * 2007-12-25 2009-07-16 Panasonic Electric Works Co Ltd Ｌｅｄ発光装置およびそれを用いた照明器具
JP2009218355A (ja) * 2008-03-10 2009-09-24 Citizen Electronics Co Ltd Ｌｅｄランプ及びその実装構造
JP2010514198A (ja) * 2006-12-22 2010-04-30 ソウル オプト デバイス カンパニー リミテッド 複数のセルを有する発光素子
JP2012253360A (ja) * 2012-07-10 2012-12-20 Citizen Electronics Co Ltd Ｌｅｄランプ
JP2018093192A (ja) * 2016-11-30 2018-06-14 日亜化学工業株式会社 発光装置及び基板

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009296012A (ja) * 2002-04-12 2009-12-17 Seoul Semiconductor Co Ltd 発光装置
JP4585014B2 (ja) * 2002-04-12 2010-11-24 ソウル セミコンダクター カンパニー リミテッド 発光装置
JP2008211255A (ja) * 2002-04-12 2008-09-11 Seoul Semiconductor Co Ltd 発光装置
JP4585028B2 (ja) * 2002-04-12 2010-11-24 ソウル セミコンダクター カンパニー リミテッド 発光装置
JP2006210949A (ja) * 2002-04-12 2006-08-10 Shiro Sakai 発光装置
JP2009182356A (ja) * 2002-04-12 2009-08-13 Seoul Semiconductor Co Ltd 発光装置
JP2009182355A (ja) * 2002-04-12 2009-08-13 Seoul Semiconductor Co Ltd 発光装置
JP2009182357A (ja) * 2002-04-12 2009-08-13 Seoul Semiconductor Co Ltd 発光装置
JP2009296013A (ja) * 2002-04-12 2009-12-17 Seoul Semiconductor Co Ltd 発光装置
US7646031B2 (en) 2002-08-29 2010-01-12 Seoul Semiconductor Co., Ltd. Light emitting device having light emitting elements
US8735911B2 (en) 2002-08-29 2014-05-27 Seoul Semiconductor Co., Ltd. Light emitting device having shared electrodes
US9947717B2 (en) 2002-08-29 2018-04-17 Seoul Semiconductor Co., Ltd. Light-emitting device having light-emitting elements and electrode spaced apart from the light emitting element
US7569861B2 (en) 2002-08-29 2009-08-04 Seoul Semiconductor Co., Ltd. Light emitting device having light emitting elements
US7667237B2 (en) 2002-08-29 2010-02-23 Seoul Semiconductor Co., Ltd. Light emitting device having light emitting elements
US8735918B2 (en) 2002-08-29 2014-05-27 Seoul Semiconductor Co., Ltd. Light-emitting device having light-emitting elements with polygonal shape
US7615793B2 (en) 2002-08-29 2009-11-10 Seoul Semiconductor Co., Ltd. AC driven light—emitting device
US7417259B2 (en) 2002-08-29 2008-08-26 Seoul Semiconductor Co., Ltd. Light-emitting device having light-emitting elements
US7956367B2 (en) 2002-08-29 2011-06-07 Seoul Semiconductor Co., Ltd. Light-emitting device having light-emitting elements connected in series
US8084774B2 (en) 2002-08-29 2011-12-27 Seoul Semiconductor Co., Ltd. Light emitting device having light emitting elements
US8097889B2 (en) 2002-08-29 2012-01-17 Seoul Semiconductor Co., Ltd. Light emitting device having light emitting elements with a shared electrode
US8680533B2 (en) 2002-08-29 2014-03-25 Seoul Semiconductor Co., Ltd. Light-emitting device having light-emitting elements with a shared electrode
JP2010514198A (ja) * 2006-12-22 2010-04-30 ソウル オプト デバイス カンパニー リミテッド 複数のセルを有する発光素子
JP2009158507A (ja) * 2007-12-25 2009-07-16 Panasonic Electric Works Co Ltd Ｌｅｄ発光装置およびそれを用いた照明器具
JP2009218355A (ja) * 2008-03-10 2009-09-24 Citizen Electronics Co Ltd Ｌｅｄランプ及びその実装構造
JP2012253360A (ja) * 2012-07-10 2012-12-20 Citizen Electronics Co Ltd Ｌｅｄランプ
JP2018093192A (ja) * 2016-11-30 2018-06-14 日亜化学工業株式会社 発光装置及び基板

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