JPH04225019A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPH04225019A JPH04225019A JP41831690A JP41831690A JPH04225019A JP H04225019 A JPH04225019 A JP H04225019A JP 41831690 A JP41831690 A JP 41831690A JP 41831690 A JP41831690 A JP 41831690A JP H04225019 A JPH04225019 A JP H04225019A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- curing agent
- phenolic resin
- cresol
- naphthol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 38
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 38
- 239000000203 mixture Substances 0.000 title claims abstract description 16
- 239000005011 phenolic resin Substances 0.000 claims abstract description 25
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 22
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 20
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 claims abstract description 12
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000011256 inorganic filler Substances 0.000 claims abstract description 6
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 6
- 235000007586 terpenes Nutrition 0.000 claims abstract description 5
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical group C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims abstract description 4
- 239000004843 novolac epoxy resin Substances 0.000 claims description 8
- 238000005538 encapsulation Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 150000003505 terpenes Chemical class 0.000 claims description 4
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 15
- 229920003986 novolac Polymers 0.000 abstract description 11
- 239000000843 powder Substances 0.000 abstract description 11
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 abstract description 8
- 238000007789 sealing Methods 0.000 abstract description 7
- 238000010521 absorption reaction Methods 0.000 abstract description 6
- 239000000654 additive Substances 0.000 abstract description 4
- 239000005350 fused silica glass Substances 0.000 abstract description 4
- 239000003566 sealing material Substances 0.000 abstract description 4
- 239000003086 colorant Substances 0.000 abstract description 2
- 239000003063 flame retardant Substances 0.000 abstract description 2
- 230000010354 integration Effects 0.000 abstract description 2
- 239000004848 polyfunctional curative Substances 0.000 abstract 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 abstract 1
- 239000006087 Silane Coupling Agent Substances 0.000 abstract 1
- 238000013329 compounding Methods 0.000 abstract 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 abstract 1
- -1 terpene compound Chemical group 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 22
- 229910000679 solder Inorganic materials 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000012778 molding material Substances 0.000 description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 5
- 230000035882 stress Effects 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- 229930003836 cresol Natural products 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- WADSJYLPJPTMLN-UHFFFAOYSA-N 3-(cycloundecen-1-yl)-1,2-diazacycloundec-2-ene Chemical compound C1CCCCCCCCC=C1C1=NNCCCCCCCC1 WADSJYLPJPTMLN-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は高集積ＩＣデバイスの表
面実装時における半田耐熱性に優れた半導体封止用エポ
キシ樹脂組成物に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition for semiconductor encapsulation that has excellent soldering heat resistance during surface mounting of highly integrated IC devices.
【０００２】0002
【従来の技術】高集積ＩＣデバイスは、そのほとんどが
信頼性、コスト及び量産性に優れるエポキシ樹脂封止材
料による樹脂封止方式により封止されている。エポキシ
樹脂封止材料としては、耐熱性、耐湿性、成形性に優れ
たＯ−クレゾールノボラックエポキシ樹脂とノボラック
型フェノール樹脂で構成される樹脂組成物が用いられて
いる。しかし、近年の高集積化、多機能化に伴ない、高
集積ＩＣパッケージは、素子の大型化、実装合理化に伴
うパッケージの小型化、薄形化の傾向が強く、従来のＤ
ＩＰタイプから、小型、薄型のＳＯＪ、ＳＯＰ、ＱＦＰ
、ＴＳＯＰタイプの表面実装型パッケージへ急速に移行
している。2. Description of the Related Art Most highly integrated IC devices are encapsulated by a resin encapsulation method using an epoxy resin encapsulation material which is excellent in reliability, cost and mass production. As the epoxy resin sealing material, a resin composition composed of an O-cresol novolac epoxy resin and a novolac type phenol resin, which have excellent heat resistance, moisture resistance, and moldability, is used. However, with the recent trend toward higher integration and multifunctionality, there is a strong tendency for highly integrated IC packages to become smaller and thinner due to larger elements and rationalized mounting.
From IP type to small and thin SOJ, SOP, QFP
, there is a rapid shift to TSOP type surface mount packages.
【０００３】このことは、従来のＤＩＰタイプと違い半
田付け時にパッケージそのものが２１５〜２６０℃の高
温にさらされることとなり、大型チップを小型で薄いパ
ッケージに封入した表面実装タイプのパッケージは大き
な応力を受け、パッケージ樹脂のクラック、チップ界面
の剥離を引き起こし、ＩＣパッケージの信頼性に致命的
な問題となっている。これらの表面実装型パッケージを
封止するのに適した信頼性の高い封止用樹脂組成物が望
まれている。This means that, unlike the conventional DIP type, the package itself is exposed to high temperatures of 215 to 260°C during soldering, and surface mount type packages, in which a large chip is enclosed in a small and thin package, are subject to large stress. This causes cracks in the package resin and peeling at the chip interface, which is a fatal problem for the reliability of IC packages. A highly reliable sealing resin composition suitable for sealing these surface-mounted packages is desired.
【０００４】これらの問題を解決するために半田付け時
の熱衝撃を緩和する目的で、熱可塑性オリゴマーの添加
（特開昭６２−１１５８４９号公報）や各種シリコーン
化合物の添加（特開昭６２−１１５８５号公報、６２−
１１６６５４号公報６２−１２８１６２号公報）、更に
はシリコーン変性（特開昭６２−１３６８６０号公報）
などの手法で対処しているがいずれも半田付け時にパッ
ケージにクラックが生じてしまい信頼性の優れた半導体
封止用エポキシ樹脂組成物を得るまでには至らなかった
。[0004] In order to solve these problems, addition of thermoplastic oligomers (Japanese Unexamined Patent Publication No. 115849/1984) and various silicone compounds (Japanese Unexamined Patent Application Publication No. 1982-115849) have been proposed for the purpose of alleviating thermal shock during soldering. Publication No. 11585, 62-
116654 Publication No. 62-128162 Publication), and further silicone modification (Japanese Patent Application Laid-open No. 136860/1986)
Although these methods have been used to solve the problem, cracks occur in the package during soldering, and it has not been possible to obtain a highly reliable epoxy resin composition for encapsulating semiconductors.
【０００５】一方、半田付け時の耐熱ストレス性つまり
耐半田ストレス性に優れた半導体封止用エポキシ樹脂組
成物を得るために、樹脂系としてビフェニル型エポキシ
樹脂の使用（特開昭６４−６５１１６号公報）等が、検
討されてきたがビフェニル型エポキシ樹脂の使用により
リードフレームとの密着性及び低吸水性が向上し、耐半
田ストレス性の向上、特にクラック発生が低減するが、
耐熱性が劣るため特に２５０℃以上のような高温では耐
半田ストレス性が不十分である。On the other hand, in order to obtain an epoxy resin composition for semiconductor encapsulation that has excellent heat stress resistance during soldering, that is, solder stress resistance, a biphenyl type epoxy resin is used as the resin system (Japanese Patent Laid-Open No. 64-65116). Although the use of biphenyl-type epoxy resin improves adhesion with the lead frame and low water absorption, improves solder stress resistance, and particularly reduces cracking,
Since the heat resistance is poor, the solder stress resistance is insufficient especially at high temperatures such as 250° C. or higher.
【０００６】[0006]
【発明が解決しようとする課題】本発明は、成形性およ
び信頼性を劣化させることなく半田付け時の半田耐熱性
に優れた半導体封止用エポキシ樹脂組成物を提供するも
のである。SUMMARY OF THE INVENTION The present invention provides an epoxy resin composition for semiconductor encapsulation that has excellent soldering heat resistance during soldering without deteriorating moldability and reliability.
【０００７】[0007]
【課題を解決するための手段】本発明のエポキシ樹脂組
成物は、エポキシ樹脂としてパラクレゾールとαナフト
ールの共縮合ノボラックエポキシ樹脂を総エポキシ樹脂
の３０〜１００重量％含むエポキシ樹脂とフェノール樹
脂硬化剤として下記式（Ｉ）で示されるフェノール樹脂
硬化剤。[Means for Solving the Problems] The epoxy resin composition of the present invention comprises an epoxy resin containing a co-condensed novolac epoxy resin of para-cresol and α-naphthol in an amount of 30 to 100% by weight of the total epoxy resin, and a phenol resin curing agent. A phenolic resin curing agent represented by the following formula (I).
【０００８】[0008]
（式中のＲはジシクロペンタジエン、テルペン類、パラ
キシレン、シクロヘキサンの中から選択される。）を総
フェノール樹脂硬化剤に対し３０〜１００重量％含むフ
ェノール樹脂硬化剤を併用し、無機充填材および硬化促
進剤からなる樹脂組成物で、従来のエポキシ樹脂組成物
に比べ非常に優れた耐半田耐熱性を有するものである。(R in the formula is selected from dicyclopentadiene, terpenes, paraxylene, and cyclohexane) is used in combination with a phenolic resin curing agent containing 30 to 100% by weight of the total phenolic resin curing agent, and an inorganic filler. and a curing accelerator, and has extremely superior solder heat resistance compared to conventional epoxy resin compositions.
【０００９】本発明に用いるパラクレゾールとαナフト
ールの共縮合ノボラックエポキシ樹脂は、パラクレゾー
ルとαナフトールをホルムアルデヒドより共縮合された
ノボラック樹脂のエポキシ化物であり、その共縮合時の
αナフトール量は５０％以上が望ましく、下記式（ＩＩ
）の構造を主とする化合物である。The co-condensed novolac epoxy resin of para-cresol and α-naphthol used in the present invention is an epoxidized product of a novolak resin obtained by co-condensing para-cresol and α-naphthol with formaldehyde, and the amount of α-naphthol at the time of co-condensation is 50 % or more, and the following formula (II
) is a compound whose main structure is
【００１０】0010
【００１１】特徴としては、低吸水性に優れ、樹脂の線
膨張係数が小さく、成形時の離型性に優れるという特長
を有し、半田付け時のハンダ耐熱性に良好な結果を示す
。このパラクレゾールとαナフトール共縮合ノボラック
エポキシ樹脂の使用量は、これを調節することにより半
田耐熱性を最大限に引き出すことができる。[0011] Characteristically, it has excellent low water absorption, a low coefficient of linear expansion of the resin, excellent mold releasability during molding, and shows good results in soldering heat resistance during soldering. By adjusting the amount of the para-cresol and α-naphthol co-condensed novolac epoxy resin used, the soldering heat resistance can be maximized.
【００１２】半田耐熱性の効果を出すためにはパラクレ
ゾールとαナフトール共縮合ノボラックエポキシ樹脂を
総エポキシ樹脂量の３０重量％以上好ましくは６０重量
％以上の使用が望ましい。３０重量％未満では、低吸水
性、低線膨張係数性が充分に得られず、半田耐熱性が不
充分である。In order to obtain the effect of soldering heat resistance, it is desirable to use para-cresol and α-naphthol co-condensed novolac epoxy resin in an amount of 30% by weight or more, preferably 60% by weight or more of the total amount of epoxy resin. If it is less than 30% by weight, low water absorption and low coefficient of linear expansion cannot be obtained, and soldering heat resistance is insufficient.
【００１３】パラクレゾールとαナフトール共縮合ノボ
ラックエポキシ樹脂以外の他のエポキシ樹脂を併用する
場合、用いるエポキシ樹脂とは、エポキシ基を有するポ
リマー全般をいう。たとえばビスフェノール型エポキシ
樹脂、クレゾールノボラック型エポキシ樹脂、ビフェニ
ル型エポキシ樹脂、フェノールノボラック型エポキシ樹
脂及びトリフェノールメタン型エポキシ樹脂、アルキル
変性トリフェノールメタン型エポキシ樹脂等の３官能型
エポキシ樹脂、トリアジン核含有エポキシ樹脂等のこと
をいう。When an epoxy resin other than para-cresol and α-naphthol co-condensed novolac epoxy resin is used in combination, the epoxy resin used refers to any polymer having an epoxy group. For example, trifunctional epoxy resins such as bisphenol type epoxy resin, cresol novolac type epoxy resin, biphenyl type epoxy resin, phenol novolac type epoxy resin, triphenolmethane type epoxy resin, alkyl-modified triphenolmethane type epoxy resin, triazine nucleus-containing epoxy resin Refers to resin, etc.
【００１４】式（Ｉ）で示される構造のフェノール樹脂
硬化剤は、エポキシ樹脂との硬化物で可撓性が得られ、
低吸水性が得られる特長を有する。特に半田付け時の高
温時の可撓性に優れており、２５０〜２６０℃半田付け
時の半田耐熱性に著しい効果をもたらす。更に、可撓性
を有するフェノール樹脂硬化剤は概してガラス転移温度
がフェノールノボラック型フェノール樹脂硬化剤よりも
低くなるが、式（Ｉ）で示される構造のフェノール樹脂
硬化剤のエポキシ樹脂との硬化物のガラス転移温度はフ
ェノールノボラック型フェノール樹脂硬化剤と同等であ
り、本発明の組成物が半田耐熱性に優れる特長の一つと
なっている式（Ｉ）で示されるフェノール樹脂硬化剤の
使用量は、これを調節することにより半田耐熱性を最大
限に引き出すことができる。[0014] The phenolic resin curing agent having the structure shown by formula (I) can be cured with an epoxy resin to obtain flexibility.
It has the feature of low water absorption. In particular, it has excellent flexibility at high temperatures during soldering, and has a significant effect on soldering heat resistance during soldering at 250 to 260°C. Furthermore, although a flexible phenolic resin curing agent generally has a glass transition temperature lower than that of a phenol novolak type phenolic resin curing agent, a cured product of a phenolic resin curing agent having a structure represented by formula (I) with an epoxy resin The glass transition temperature of is equivalent to that of the phenol novolac type phenolic resin curing agent, and the amount of the phenolic resin curing agent represented by formula (I), which is one of the features of the composition of the present invention having excellent soldering heat resistance, is By adjusting this, soldering heat resistance can be maximized.
【００１５】半田耐熱性の効果を引き出すには式（Ｉ）
で示されるフェノール樹脂硬化剤を総フェノール樹脂硬
化剤の３０重量％以上、好ましくは６０重量％以上の使
用が望ましい。３０重量％未満では可撓性が不充分とな
り、半田付け時の半田耐熱性が充分に得られない。更に
式中のＲはジシクロペンタジエン、テルペン類、パラキ
シレン、シクロヘキサンから選択され可撓性と耐熱性の
バランスが良いテルペン類が好ましい。To bring out the effect of soldering heat resistance, use formula (I)
It is desirable to use the phenolic resin curing agent represented by 30% by weight or more, preferably 60% by weight or more of the total phenolic resin curing agent. If it is less than 30% by weight, flexibility will be insufficient and sufficient soldering heat resistance during soldering will not be obtained. Further, R in the formula is preferably a terpene selected from dicyclopentadiene, terpenes, paraxylene, and cyclohexane, which has a good balance between flexibility and heat resistance.
【００１６】式（Ｉ）で示されるフェノール樹脂硬化剤
以外に他のフェノール樹脂硬化剤を併用する場合、用い
るフェノール樹脂硬化剤とはフェノール性水酸基を有す
るポリマー全般をいう。たとえばフェノールノボラック
樹脂、クレゾールノボラック樹脂、ジシクロペンタジエ
ン変性フェノール樹脂、ジシクロペンタジエン変性フェ
ノール樹脂とフェノールノボラック及びクレゾールノボ
ラック樹脂との共重合物、パラキシレン変性フェノール
樹脂等を用いることができる。When a phenolic resin curing agent other than the phenolic resin curing agent represented by formula (I) is used in combination, the phenolic resin curing agent used refers to any polymer having a phenolic hydroxyl group. For example, a phenol novolak resin, a cresol novolak resin, a dicyclopentadiene-modified phenol resin, a copolymer of a dicyclopentadiene-modified phenol resin with a phenol novolak and a cresol novolak resin, a paraxylene-modified phenol resin, and the like can be used.
【００１７】本発明で用いる無機充填材としては、溶融
シリカ粉末、球状シリカ粉末、結晶シリカ粉末、２次凝
集シリカ粉末、多孔質シリカ粉末、２次凝集シリカ粉末
または多孔質シリカ粉末を粉砕したシリカ粉末、アルミ
ナ等が挙げられ、特に溶融シリカ粉末が好ましい。The inorganic filler used in the present invention includes fused silica powder, spherical silica powder, crystalline silica powder, secondary agglomerated silica powder, porous silica powder, secondary agglomerated silica powder, or pulverized porous silica powder. Examples include powder, alumina, etc., and fused silica powder is particularly preferred.
【００１８】本発明に使用される硬化促進剤はエポキシ
基とフェノール性水酸基との反応を促進するものであれ
ばよく、一般に封止用材料に使用されているものを広く
使用することができ、例えばジアザビシクロウンデセン
（ＤＢＵ）、トリフェニルホスフィン（ＴＰＰ）、ジメ
チルベンジルアミン（ＢＤＭＡ）や２メチルイミダゾー
ル（２ＭＺ）等が単独もしくは２種類以上混合して用い
られる。本発明の封止用エポキシ樹脂組成物はエポキシ
樹脂、硬化剤、無機充填材及び硬化促進剤を必須成分と
するが、これ以外に必要に応じてシランカップリング剤
、ブロム化エポキシ樹脂、三酸化アンチモン、ヘキサブ
ロムベンゼン等の難燃剤、カーボンブラック、ベンガラ
等の着色剤、天然ワックス、合成ワックス等の離型剤及
びシリコーンオイル、ゴム等の低応力添加剤等の種々の
添加剤を適宜配合しても差し支えがない。The curing accelerator used in the present invention may be any one that promotes the reaction between the epoxy group and the phenolic hydroxyl group, and a wide variety of those commonly used in sealing materials can be used. For example, diazabicycloundecene (DBU), triphenylphosphine (TPP), dimethylbenzylamine (BDMA), 2methylimidazole (2MZ), and the like may be used alone or in combination of two or more. The epoxy resin composition for sealing of the present invention contains an epoxy resin, a curing agent, an inorganic filler, and a curing accelerator as essential components. Various additives such as flame retardants such as antimony and hexabromobenzene, colorants such as carbon black and red iron, mold release agents such as natural wax and synthetic wax, and low stress additives such as silicone oil and rubber are appropriately blended. There is no problem.
【００１９】又、本発明の封止用エポキシ樹脂組成物を
成形材料として製造するには、エポキシ樹脂、硬化剤、
硬化促進剤、充填剤、その他の添加剤をミキサー等によ
って十分に均一に混合した後、さらに熱ロールまたはニ
ーダー等で溶融混練し、冷却後粉砕して成形材料とする
ことができる。これらの成形材料は電子部品あるいは電
気部品の封止、被覆、絶縁等に適用することができる。In order to produce the epoxy resin composition for sealing of the present invention as a molding material, an epoxy resin, a curing agent,
After the curing accelerator, filler, and other additives are thoroughly and uniformly mixed using a mixer or the like, the mixture can be further melt-kneaded using a heated roll or kneader, cooled, and then ground to obtain a molding material. These molding materials can be applied to sealing, covering, insulating, etc. electronic or electrical components.
【００２０】以下に本発明を実施例で示す。The present invention will be illustrated below with examples.
【実施例１】下記組成物
パラクレゾールとαナフトール共縮合ノボラッ
クエポキシ樹脂
（エポキシ当量２００、軟化点６５℃
）１３重量部 式（Ｉ）で示されるフェノール樹
脂硬化剤
（ＯＨ当量１７０、軟化点１１５℃） １
１重量部 溶融シリカ粉末
７５重量部 トリフェニルホ
スフィン
０．２重量部 カー
ボンブラック
０．３重
量部 カルナバワックス
０．５重量部をミキサーで常温で混合し、７０
〜１００℃で２軸ロールにより混練し、冷却後粉砕した
成形材料とした。得られた成形材料をダブレット化し、
低圧トランスファー成形機にて１７５℃、７０ｋｇ／ｃ
ｍ２、１２０秒の条件で半田クラック試験用として６×
６ｍｍのチップを５２ｐパッケージに封止した。封止し
たテスト用素子について下記の半田クラック試験をおこ
なった。半田クラック試験：封止したテスト用パッケー
ジを８５℃，８５％ＲＨの環境下で７２Ｈｒ処理し、そ
の後○１ＶＰＳ装置で２１５℃，６０秒の半田処理及び
○２２６０℃半田槽に１０秒の浸漬処理をそれぞれ行い
、顕微鏡にてパッケージの外部クラック発生状況を観察
した。試験結果を表１に示す。[Example 1] The following composition para-cresol and α-naphthol co-condensed novolac epoxy resin
(Epoxy equivalent: 200, softening point: 65°C
) 13 parts by weight phenolic resin curing agent represented by formula (I)
(OH equivalent: 170, softening point: 115°C) 1
1 part by weight fused silica powder
75 parts by weight triphenylphosphine
0.2 parts by weight carbon black
0.3 parts by weight carnauba wax
Mix 0.5 parts by weight with a mixer at room temperature, and make 70 parts by weight.
A molding material was obtained by kneading with a twin-screw roll at ~100°C, cooling, and pulverizing. The obtained molding material is made into a doublet,
175℃, 70kg/c with low pressure transfer molding machine
6× for solder crack test under conditions of m2, 120 seconds.
A 6mm chip was sealed in a 52p package. The following solder crack test was conducted on the sealed test device. Solder crack test: The sealed test package was processed for 72 hours in an environment of 85°C and 85% RH, and then soldered for 60 seconds at 215°C in a ○1 VPS device and immersed in a 2260°C solder bath for 10 seconds. Each was conducted, and the appearance of external cracks on the package was observed using a microscope. The test results are shown in Table 1.
【００２１】[0021]
【実施例２〜６】表１に従って配合し、実施例１と同様
にして成形材料を得た。この成形材料で試験用の封止し
た成形品を得、この成形品を用いて実施例１と同様に半
田クラック試験を行った。試験結果を表１に示す。[Examples 2 to 6] Molding materials were obtained in the same manner as in Example 1 by blending according to Table 1. A sealed molded product for testing was obtained using this molding material, and a solder crack test was conducted in the same manner as in Example 1 using this molded product. The test results are shown in Table 1.
【比較例１〜６】表１にしたがって配合し、実施例１と
同様にして成形材料を得た。この成形品を用いて実施例
１と同様に半田クラック試験を行った。結果を表１に示
す。[Comparative Examples 1 to 6] Molding materials were obtained in the same manner as in Example 1 by blending according to Table 1. A solder crack test was conducted in the same manner as in Example 1 using this molded product. The results are shown in Table 1.
【００２２】[0022]
【表１】[Table 1]
【００２３】[0023]
【発明の効果】本発明に従うと従来技術では得ることの
できなかった耐熱性、低吸水性、可撓性を有するエポキ
シ樹脂を得ることができるので、表面実装化された高集
積ＩＣパッケージ用封止材料として半田付け時の半田耐
熱性に非常に優れていることから電子電気部品の封止用
、被覆用、絶縁用等に用いた場合、特に高集積ＩＣ用表
面実装パッケージに好適である。Effects of the Invention According to the present invention, it is possible to obtain an epoxy resin having heat resistance, low water absorption, and flexibility, which could not be obtained using conventional techniques. As a sealing material, it has excellent soldering heat resistance during soldering, so when used for sealing, covering, insulating, etc., electronic and electrical components, it is particularly suitable for surface mount packages for highly integrated ICs.
Claims (1)
の共縮合ノボラックエポキシ樹脂を総エポキシ樹脂の３
０〜１００重量％含むエポキシ樹脂 （Ｂ）下記式（
Ｉ）で示されるフェノール樹脂硬化剤 （式中のＲは
ジシクロペンタジエン、テルペン類、パラキシレン、シ
クロヘキサンの中から選択される ）を総フェノール
樹脂硬化剤に対し３０〜１００重量％含むフェノール樹
脂硬化剤 （Ｃ）無機充填材 （Ｄ）硬化促進剤を
必須成分とする半導体封止用エポキシ樹脂組成物。 【化１】Claim 1: (A) Co-condensed novolac epoxy resin of para-cresol and α-naphthol is
Epoxy resin containing 0 to 100% by weight (B) The following formula (
A phenolic resin curing agent containing 30 to 100% by weight of a phenolic resin curing agent represented by I) (R in the formula is selected from dicyclopentadiene, terpenes, paraxylene, and cyclohexane) based on the total phenolic resin curing agent. An epoxy resin composition for semiconductor encapsulation which contains (C) an inorganic filler and (D) a curing accelerator as an essential component. [Chemical formula 1]
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP41831690A JP2820541B2 (en) | 1990-12-27 | 1990-12-27 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP41831690A JP2820541B2 (en) | 1990-12-27 | 1990-12-27 | Epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04225019A true JPH04225019A (en) | 1992-08-14 |
| JP2820541B2 JP2820541B2 (en) | 1998-11-05 |
Family
ID=18526184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP41831690A Expired - Fee Related JP2820541B2 (en) | 1990-12-27 | 1990-12-27 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2820541B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04342719A (en) * | 1991-05-21 | 1992-11-30 | Shin Etsu Chem Co Ltd | Epoxy resin composition and semiconductor device |
-
1990
- 1990-12-27 JP JP41831690A patent/JP2820541B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04342719A (en) * | 1991-05-21 | 1992-11-30 | Shin Etsu Chem Co Ltd | Epoxy resin composition and semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2820541B2 (en) | 1998-11-05 |
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