JPH0422354B2 - - Google Patents

Info

Publication number
JPH0422354B2
JPH0422354B2 JP59267772A JP26777284A JPH0422354B2 JP H0422354 B2 JPH0422354 B2 JP H0422354B2 JP 59267772 A JP59267772 A JP 59267772A JP 26777284 A JP26777284 A JP 26777284A JP H0422354 B2 JPH0422354 B2 JP H0422354B2
Authority
JP
Japan
Prior art keywords
led chip
lens
resin material
chip
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59267772A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61144890A (ja
Inventor
Tomio Nakaya
Hoichiro Kashiwabara
Osamu Waki
Toshihide Kawamura
Hiroo Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP59267772A priority Critical patent/JPS61144890A/ja
Publication of JPS61144890A publication Critical patent/JPS61144890A/ja
Publication of JPH0422354B2 publication Critical patent/JPH0422354B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)
  • Led Device Packages (AREA)
JP59267772A 1984-12-19 1984-12-19 Ｌｅｄランプのレンズの製造方法 Granted JPS61144890A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59267772A JPS61144890A (ja) 1984-12-19 1984-12-19 Ｌｅｄランプのレンズの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59267772A JPS61144890A (ja) 1984-12-19 1984-12-19 Ｌｅｄランプのレンズの製造方法

Publications (2)

Publication Number Publication Date
JPS61144890A JPS61144890A (ja) 1986-07-02
JPH0422354B2 true JPH0422354B2 (enrdf_load_stackoverflow) 1992-04-16

Family

ID=17449370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59267772A Granted JPS61144890A (ja) 1984-12-19 1984-12-19 Ｌｅｄランプのレンズの製造方法

Country Status (1)

Country Link
JP (1) JPS61144890A (enrdf_load_stackoverflow)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3431038B2 (ja) * 1994-02-18 2003-07-28 ローム株式会社 発光装置とその製造方法およびｌｅｄヘッドの製造方法
DE19631736A1 (de) * 1996-08-06 1998-02-12 Stm Sensor Technologie Muenche Verfahren und Vorrichtung zum Herstellen von Linsen mikrooptischer Systeme sowie Lichtsender/Lichtempfängersystem
KR20030033273A (ko) * 2001-10-19 2003-05-01 (주) 나노옵토테크놀러지 칩형 엘. 디. 엠
JP2004087812A (ja) * 2002-08-27 2004-03-18 Sanyo Electric Co Ltd 発光体
CN1777999B (zh) 2003-02-26 2010-05-26 美商克立股份有限公司 复合式白色光源及其制造方法
EP2264798B1 (en) 2003-04-30 2020-10-14 Cree, Inc. High powered light emitter packages with compact optics
JP5057692B2 (ja) * 2005-04-27 2012-10-24 サムソン エルイーディー カンパニーリミテッド． 発光ダイオードを利用したバックライトユニット
KR20070045462A (ko) 2005-10-27 2007-05-02 엘지이노텍 주식회사 발광 다이오드 패키지
WO2007083481A1 (ja) * 2006-01-19 2007-07-26 Rohm Co., Ltd. 半導体表示装置及び半導体表示装置の製造方法
JP4049186B2 (ja) 2006-01-26 2008-02-20 ソニー株式会社 光源装置
JP5074696B2 (ja) * 2006-03-07 2012-11-14 アバゴ・テクノロジーズ・イーシービーユー・アイピー（シンガポール）プライベート・リミテッド 発光ダイオード
KR100809263B1 (ko) * 2006-07-10 2008-02-29 삼성전기주식회사 직하 방식 백라이트 장치
US20120097985A1 (en) * 2010-10-21 2012-04-26 Wen-Huang Liu Light Emitting Diode (LED) Package And Method Of Fabrication
CN104241262B (zh) 2013-06-14 2020-11-06 惠州科锐半导体照明有限公司 发光装置以及显示装置
JP2014029341A (ja) * 2013-09-17 2014-02-13 Nikon Corp 受発光ユニット、光学式エンコーダ
DE102015107516A1 (de) * 2015-05-13 2016-11-17 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen einer Linse für eine optoelektronische Leuchtvorrichtung

Also Published As

Publication number Publication date
JPS61144890A (ja) 1986-07-02

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