JPH0422354B2 - - Google Patents

Info

Publication number
JPH0422354B2
JPH0422354B2 JP59267772A JP26777284A JPH0422354B2 JP H0422354 B2 JPH0422354 B2 JP H0422354B2 JP 59267772 A JP59267772 A JP 59267772A JP 26777284 A JP26777284 A JP 26777284A JP H0422354 B2 JPH0422354 B2 JP H0422354B2
Authority
JP
Japan
Prior art keywords
chip
led chip
frame
substrate
resin material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59267772A
Other versions
JPS61144890A (en
Inventor
Tomio Nakaya
Hoichiro Kashiwabara
Osamu Waki
Toshihide Kawamura
Hiroo Sakai
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP59267772A priority Critical patent/JPH0422354B2/ja
Publication of JPS61144890A publication Critical patent/JPS61144890A/en
Publication of JPH0422354B2 publication Critical patent/JPH0422354B2/ja
Anticipated expiration legal-status Critical
Application status is Expired - Lifetime legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00Illuminated signs; Luminous advertising
    • G09F13/20Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/54Encapsulations having a particular shape

Abstract

PURPOSE:To prevent the optical losses such as absorption or diffusion of the light from an LED chip, etc., by a method wherein a circular frame is arranged on a substrate, with the LED chip bonded on the substrate as the center, and a resin material is dropped from above the LED chip to form a convex lens shaped with surface tention within the frame. CONSTITUTION:A circular and enclosing frame 4 is arranged on a substrate 2, with an LED chip 1, on which wire 3 is bonded, as the center. A resin material 5 is dropped from above the chip 1 to form a convex lens 6 on the chip 1 with the surface tention of the resin material 5 within the frame 4. The chip 1 is buried in the lens 6, with the result that the optical losses of absorption and deffusion of the light from the LED chip 1 because of the non-presence of an air layer between the chip 1 and the lens 6.
JP59267772A 1984-12-19 1984-12-19 Expired - Lifetime JPH0422354B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59267772A JPH0422354B2 (en) 1984-12-19 1984-12-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59267772A JPH0422354B2 (en) 1984-12-19 1984-12-19

Publications (2)

Publication Number Publication Date
JPS61144890A JPS61144890A (en) 1986-07-02
JPH0422354B2 true JPH0422354B2 (en) 1992-04-16

Family

ID=17449370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59267772A Expired - Lifetime JPH0422354B2 (en) 1984-12-19 1984-12-19

Country Status (1)

Country Link
JP (1) JPH0422354B2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19631736A1 (en) * 1996-08-06 1998-02-12 Stm Sensor Technologie Muenche Method and apparatus for producing lenses of microoptical systems, and optical transmitter / receiver system
EP1597777B1 (en) 2003-02-26 2013-04-24 Cree, Inc. Composite white light source and method for fabricating
EP2264798A1 (en) 2003-04-30 2010-12-22 Cree, Inc. High powered light emitter packages with compact optics
JP5057692B2 (en) * 2005-04-27 2012-10-24 サムソン エルイーディー カンパニーリミテッド. Backlight unit using light emitting diode
KR20070045462A (en) 2005-10-27 2007-05-02 엘지이노텍 주식회사 Package of light emitting diode
JPWO2007083481A1 (en) * 2006-01-19 2009-06-11 ローム株式会社 Semiconductor display device and manufacturing method of semiconductor display device
JP4049186B2 (en) 2006-01-26 2008-02-20 ソニー株式会社 Light source device
JP5074696B2 (en) * 2006-03-07 2012-11-14 アバゴ・テクノロジーズ・イーシービーユー・アイピー(シンガポール)プライベート・リミテッド Light emitting diode
KR100809263B1 (en) 2006-07-10 2008-02-29 삼성전기주식회사 Direct backlight having surface light source
US20120097985A1 (en) * 2010-10-21 2012-04-26 Wen-Huang Liu Light Emitting Diode (LED) Package And Method Of Fabrication
JP2014029341A (en) * 2013-09-17 2014-02-13 Nikon Corp Light receiving/emitting unit and optical encoder
DE102015107516A1 (en) * 2015-05-13 2016-11-17 Osram Opto Semiconductors Gmbh Method for producing a lens for an optoelectronic lighting device

Also Published As

Publication number Publication date
JPS61144890A (en) 1986-07-02

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