JPH0422354B2 - - Google Patents

Info

Publication number
JPH0422354B2
JPH0422354B2 JP59267772A JP26777284A JPH0422354B2 JP H0422354 B2 JPH0422354 B2 JP H0422354B2 JP 59267772 A JP59267772 A JP 59267772A JP 26777284 A JP26777284 A JP 26777284A JP H0422354 B2 JPH0422354 B2 JP H0422354B2
Authority
JP
Japan
Prior art keywords
led chip
lens
resin material
chip
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59267772A
Other languages
Japanese (ja)
Other versions
JPS61144890A (en
Inventor
Tomio Nakaya
Hoichiro Kashiwabara
Osamu Waki
Toshihide Kawamura
Hiroo Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP59267772A priority Critical patent/JPS61144890A/en
Publication of JPS61144890A publication Critical patent/JPS61144890A/en
Publication of JPH0422354B2 publication Critical patent/JPH0422354B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To prevent the optical losses such as absorption or diffusion of the light from an LED chip, etc., by a method wherein a circular frame is arranged on a substrate, with the LED chip bonded on the substrate as the center, and a resin material is dropped from above the LED chip to form a convex lens shaped with surface tention within the frame. CONSTITUTION:A circular and enclosing frame 4 is arranged on a substrate 2, with an LED chip 1, on which wire 3 is bonded, as the center. A resin material 5 is dropped from above the chip 1 to form a convex lens 6 on the chip 1 with the surface tention of the resin material 5 within the frame 4. The chip 1 is buried in the lens 6, with the result that the optical losses of absorption and deffusion of the light from the LED chip 1 because of the non-presence of an air layer between the chip 1 and the lens 6.

Description

【発明の詳細な説明】 （産業上の利用分野） 本発明は、LEDランプのレンズの製造方法に
関するものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to a method of manufacturing a lens for an LED lamp.

（従来技術） 従来のLEDランプにおいては第４図に示すよ
うに、基板ａ上にワイヤーボンデイングした１個
または複数個のLEDチツプｂが配置されている。
そして、別体で内部を空洞に形成した凸状のレン
ズｃを、前記LEDチツプｂに被せるようにして
基板ａに取付けていた。(Prior Art) In a conventional LED lamp, as shown in FIG. 4, one or more wire-bonded LED chips b are arranged on a substrate a.
Then, a separate convex lens c having a hollow interior was attached to the substrate a so as to cover the LED chip b.

（発明が解決しようとする問題点） 前記従来例におけるLEDランプは、別体で形
成したレンズをLEDチツプに被せるようにして
基板に取付けるため、LEDチツプとレンズのセ
ンターがズレて配置される懸念があつた。また、
レンズの内部が空洞に形成されているので、
LEDチツプとレンズとの間に空気層による空間
が形成され、その空間でLEDチツプからの光線
が吸収や散乱等の光学的損失を生じる要因となつ
ていた。(Problems to be Solved by the Invention) Since the LED lamp in the conventional example is attached to the board by covering the LED chip with a separately formed lens, there is a concern that the centers of the LED chip and the lens may be misaligned. It was hot. Also,
Since the inside of the lens is formed into a cavity,
An air layer forms a space between the LED chip and the lens, and this space causes light rays from the LED chip to suffer optical losses such as absorption and scattering.

本発明は、このような従来のLEDランプのレ
ンズに起因する問題点を解決しようとするもので
ある。 The present invention aims to solve the problems caused by the lenses of conventional LED lamps.

（問題点を解決するための手段） 前記問題点を解決するための手段として本発明
は、基板上にボイデイングしたLEDチツプを中
心として、その周囲を囲むようにして円形状の枠
を配置し、前記LEDチツプの上部から樹脂材を
滴下させ、前記枠の内側に前記樹脂材の表面張力
を利用して凸状のレンズを、前記LEDチツプ上
に形成することを要旨とするものである。(Means for Solving the Problems) As a means for solving the above-mentioned problems, the present invention arranges a circular frame around an LED chip voided on a substrate so as to surround the LED chip. The gist is to drop a resin material from the top of the chip and form a convex lens on the LED chip inside the frame by utilizing the surface tension of the resin material.

（作用） 上記の構成により、LEDチツプとレンズのセ
ンターがズレて配置されることがなくなり、かつ
LEDチツプ上に直接レンズが形成されるので、
空気層の空間によつて生じるLEDチツプからの
光の吸収や散乱等の光学的損失を防止することが
できる。(Function) With the above configuration, the center of the LED chip and lens will not be misaligned, and
Since the lens is formed directly on the LED chip,
Optical losses such as absorption and scattering of light from the LED chip caused by the air space can be prevented.

（実施例） 以下、本発明を図示の実施例により詳細に説明
すると、１は、基板２にボンデイングされた
LEDチツプであり、その上面にワイヤー３がボ
ンデイングされている。４は、円形状の枠であ
り、前記LEDチツプ１を中心として、その周囲
を囲むようにして配置されている。(Example) Hereinafter, the present invention will be explained in detail with reference to illustrated examples.
It is an LED chip, and a wire 3 is bonded to its top surface. Reference numeral 4 denotes a circular frame, which is arranged to surround the LED chip 1 with the LED chip 1 at the center.

そして、第２図に示すように、水平に設置した
基板２上のLEDチツプ１の上方からシリコンや
フロン系等の樹脂材５を滴下させ、第３図に示す
ように、前記枠４の内側に樹脂材５の表面張力を
利用して凸状のレンズ６がLEDチツプ１上に形
成される。 Then, as shown in FIG. 2, a resin material 5 such as silicon or fluorocarbon is dropped from above the LED chip 1 on the horizontally installed board 2, and as shown in FIG. Then, a convex lens 6 is formed on the LED chip 1 using the surface tension of the resin material 5.

本発明に係るLEDランプのレンズ６は、上記
のようにして形成することができ、枠４によつて
滴下した樹脂材５の流出を阻止すると共に枠４の
内側に樹脂材５の表面張力を利用して凸状のレン
ズ６を形成することができ、更に滴下させる樹脂
材５の量と枠４の大きさによつて、レンズ６の形
状や大きさを任意に調整することができる。 The lens 6 of the LED lamp according to the present invention can be formed as described above, and prevents the resin material 5 dropped by the frame 4 from flowing out, and also reduces the surface tension of the resin material 5 inside the frame 4. A convex lens 6 can be formed by using the resin material 6, and the shape and size of the lens 6 can be arbitrarily adjusted depending on the amount of the resin material 5 to be dropped and the size of the frame 4.

また、前記枠４は，前記レンズ６を形成するシ
リコンやフロン系等の樹脂材５と親和性のない材
質で形成することが好ましく、場合によつてはレ
ンズ６を形成した後、枠４を取外してもよい。 Further, the frame 4 is preferably formed of a material that has no affinity with the resin material 5 such as silicon or fluorocarbon that forms the lens 6. In some cases, the frame 4 may be formed after forming the lens 6. May be removed.

（発明の効果） 以上説明したように、本発明に係るLEDラン
プのレンズの製造方法は、基板上にボンデイング
したLEDチツプを中心として、その周囲を囲む
ようにして円形状の枠を配置し、前記LEDチツ
プの上方から樹脂材を滴下させ、前記枠の内側に
樹脂材の表面張力を利用して凸状のレンズを、前
記LEDチツプ上に形成するものであるから、
LEDチツプとレンズのセンターがズレることな
く、確実に一致させることができる。(Effects of the Invention) As explained above, in the method for manufacturing an LED lamp lens according to the present invention, a circular frame is arranged to surround the LED chip bonded on the substrate, and the LED chip is bonded to the substrate. A convex lens is formed on the LED chip by dropping a resin material from above the chip and using the surface tension of the resin material inside the frame.
The center of the LED chip and lens can be matched without misalignment.

また、レンズ内にLEDチツプが埋設されるた
め、従来のLEDランプのように、、LEDチツプと
レンズとの間に空気層の空間が形成されることが
なくなり、LEDチツプからの光の吸収や散乱等
の光学的損失を未然に防止できる等の優れた効果
を奏する。 In addition, since the LED chip is embedded within the lens, unlike conventional LED lamps, there is no air space between the LED chip and the lens, which reduces the absorption of light from the LED chip. This has excellent effects such as being able to prevent optical losses such as scattering.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、本発明に係るLEDランプのレンズ
を示す斜視図、第２図、第３図は、本発明に係る
LEDランプのレンズの製造要領を示す断面図、
第４図は、従来例の断面図である。 １……LEDチツプ、２……基板、４……枠、
５……樹脂材、６……レンズ。 FIG. 1 is a perspective view showing a lens of an LED lamp according to the present invention, and FIGS. 2 and 3 are a perspective view showing a lens of an LED lamp according to the present invention.
A cross-sectional diagram showing the manufacturing procedure for LED lamp lenses.
FIG. 4 is a sectional view of a conventional example. 1...LED chip, 2...board, 4...frame,
5... Resin material, 6... Lens.

Claims (1)

【特許請求の範囲】[Claims] １ 基板上にボンデイングしたLEDチツプを中
心として、その周囲を囲むようにして円形状の枠
を配置し、前記LEDチツプの上部から樹脂材を
滴下させ、前記枠の内側に前記樹脂材の表面張力
を利用して凸状のレンズを、前記LEDチツプ上
に形成することを特徴とするLEDランプのレン
ズの製造方法。1 A circular frame is placed around the LED chip bonded on the substrate, and a resin material is dropped from the top of the LED chip, using the surface tension of the resin material inside the frame. A method for manufacturing a lens for an LED lamp, comprising forming a convex lens on the LED chip.
JP59267772A 1984-12-19 1984-12-19 Production of lens of led lamp Granted JPS61144890A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59267772A JPS61144890A (en) 1984-12-19 1984-12-19 Production of lens of led lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59267772A JPS61144890A (en) 1984-12-19 1984-12-19 Production of lens of led lamp

Publications (2)

Publication Number Publication Date
JPS61144890A JPS61144890A (en) 1986-07-02
JPH0422354B2 true JPH0422354B2 (en) 1992-04-16

Family

ID=17449370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59267772A Granted JPS61144890A (en) 1984-12-19 1984-12-19 Production of lens of led lamp

Country Status (1)

Country Link
JP (1) JPS61144890A (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3431038B2 (en) * 1994-02-18 2003-07-28 ローム株式会社 LIGHT EMITTING DEVICE, ITS MANUFACTURING METHOD, AND LED HEAD MANUFACTURING METHOD
DE19631736A1 (en) * 1996-08-06 1998-02-12 Stm Sensor Technologie Muenche Method and device for manufacturing lenses of micro-optical systems and light transmitter / light receiver system
KR20030033273A (en) * 2001-10-19 2003-05-01 (주) 나노옵토테크놀러지 Chip type l.d.m
JP2004087812A (en) * 2002-08-27 2004-03-18 Sanyo Electric Co Ltd Light emitting device
CA2517009A1 (en) 2003-02-26 2004-09-10 Cree, Inc. White light source using emitting diode and phosphor and method of fabrication
CN101556985B (en) 2003-04-30 2017-06-09 克利公司 High powered light emitter encapsulation with compact optical element
JP5057692B2 (en) * 2005-04-27 2012-10-24 サムソン エルイーディー カンパニーリミテッド． Backlight unit using light emitting diode
KR20070045462A (en) * 2005-10-27 2007-05-02 엘지이노텍 주식회사 Package of light emitting diode
EP1976029A1 (en) * 2006-01-19 2008-10-01 Rohm Co., Ltd. Semiconductor display device and process for manufacturing the same
JP4049186B2 (en) 2006-01-26 2008-02-20 ソニー株式会社 Light source device
JP5074696B2 (en) * 2006-03-07 2012-11-14 アバゴ・テクノロジーズ・イーシービーユー・アイピー（シンガポール）プライベート・リミテッド Light emitting diode
KR100809263B1 (en) 2006-07-10 2008-02-29 삼성전기주식회사 Direct backlight having surface light source
US20120097985A1 (en) * 2010-10-21 2012-04-26 Wen-Huang Liu Light Emitting Diode (LED) Package And Method Of Fabrication
CN104241262B (en) 2013-06-14 2020-11-06 惠州科锐半导体照明有限公司 Light emitting device and display device
JP2014029341A (en) * 2013-09-17 2014-02-13 Nikon Corp Light receiving/emitting unit and optical encoder
DE102015107516A1 (en) * 2015-05-13 2016-11-17 Osram Opto Semiconductors Gmbh Method for producing a lens for an optoelectronic lighting device

Also Published As

Publication number Publication date
JPS61144890A (en) 1986-07-02

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