JP2014029341A - Light receiving/emitting unit and optical encoder - Google Patents

Light receiving/emitting unit and optical encoder Download PDF

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Publication number
JP2014029341A
JP2014029341A JP2013191734A JP2013191734A JP2014029341A JP 2014029341 A JP2014029341 A JP 2014029341A JP 2013191734 A JP2013191734 A JP 2013191734A JP 2013191734 A JP2013191734 A JP 2013191734A JP 2014029341 A JP2014029341 A JP 2014029341A
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Japan
Prior art keywords
light emitting
electrode
light receiving
resin member
light
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JP2013191734A
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Japanese (ja)
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Tetsuya Hikichi
哲也 引地
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Nikon Corp
株式会社ニコン
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Abstract

Provided are a light emitting / receiving unit and an optical encoder that can improve the yield of a product while ensuring the reliability of the device and reducing the size and weight.
In a detection unit 1A, an LED chip 2 having a light emitting portion 13 is mounted on a substrate-side semiconductor element 1a on which first and second light receiving element arrays 6 and 7 are provided. The LED chip 2 is coated with a resin to form a sealing layer 16 so that the light emitting portion 13 is covered. Between the first and second light receiving element arrays 6 and 7 and the LED chip 2, the resin flows from the LED chip 2 side to the first and second light receiving element arrays 6 and 7 side during resin application. A dam portion 17a for stopping is provided.
[Selection] Figure 1

Description

  The present invention relates to a light emitting / receiving unit in which a light emitting element is mounted on a chip provided with a light receiving element, and an optical encoder using the light receiving / emitting unit.

  Conventionally, in an optical encoder or a so-called LED chip, a light emitting / receiving unit (hereinafter simply referred to as “light emitting / receiving unit”; the same applies in this specification) in which a light emitting element is mounted on a chip provided with a light receiving element is used. It has been. As this light emitting / receiving unit, for example, a chip-on-chip structure, that is, a structure in which a plurality of semiconductor elements are stacked in two layers is known. If this chip-on-chip structure is used, there is an advantage that the semiconductor elements constituting the light emitting / receiving unit can be further integrated. This light emitting / receiving unit has a substrate side semiconductor element as a “chip” provided with a light receiving element array in which “light receiving elements” are integrated, and the substrate side semiconductor element emits light as a “light emitting element”. An LED chip having a diode (LED: Light Emitting Diode) is fixedly configured (see, for example, Patent Document 1).

  A detection unit (surface-mounted LED) as a conventional “light emitting / receiving unit” is shown in FIGS. 16 and 17. As shown in the figure, an LED chip 101 is provided on the surface side of the detection unit 100. When the LED chip 101 and the mesa portion 103 of the LED chip 101 are used in a state exposed to the outside air, the light emitting diode is used. 102 and the mesa 103 are corroded, and lighting failure due to this corrosion is likely to occur, and it becomes difficult to ensure the reliability of the apparatus. Therefore, in this detection unit 100, by applying a thermoplastic resin to the entire surface of the LED chip 101, solidifying the resin, and forming a transparent sealing layer 104 as shown by a two-dot chain line in the figure, While ensuring the reliability of the detection unit 100, an attempt is made to reduce the size and weight.

JP 2003-304003 A

  However, in such a conventional structure, when the sealing layer 104 is formed, the irradiation direction of the light emitted from the light emitting diode 102 may be disturbed if the thickness of the sealing layer 104 varies depending on the location. The amount of light may decrease. Therefore, for example, in the manufacturing stage, it is necessary to form the sealing layer 104 with a uniform thickness by a process in which air is blown over the resin material immediately after the liquid resin material is dropped on the surface of the LED chip 101. is there. As a result, the liquid resin material spreads outside the region where the sealing layer 104 is originally to be formed (for example, the region indicated by the two-dot chain line in FIGS. 16 and 17) and flows onto the light receiving element arrays 105 and 105. (For example, the state shown by the one-dot chain line in FIGS. 16 and 17), and as a result, the light receiving function of the light receiving element arrays 105 and 105 may be lowered.

  The present invention has been made in view of such problems, and provides a light emitting / receiving unit and an optical encoder that can improve the yield of a product while ensuring the reliability of the device and reducing the size and weight. Is an issue.

  In order to achieve such a problem, the present invention includes a light emitting element (13) mounted on a chip (1a, 1b, 1c, 1d, 1e, 1f) provided with a light receiving element (6a, 7a), and a resin ( 16) is a light emitting / receiving unit (1A, 1B, 1C, 1D, 1E, 1F) coated with the light emitting element (13), the light emitting element (13) and the light receiving element (6a). , 7a) a weir portion for blocking the flow of the resin (16) from the light emitting element (13) side to the light receiving element (6a, 7a) side when the resin (16) is applied (17a, 17b, 17c, 17d, 17e, 17f) is provided.

  The present invention also relates to an optical encoder (20), the light emitting / receiving unit (1A, 1B, 1C, 1D, 1E, 1F) described above and the light emitting / receiving unit (1A, 1B, 1C, 1D, 1E, 1F) and a reflecting plate (22) that reflects the light emitted from the light emitting element (13), and the reflected light reflected by the reflecting plate (22) is transmitted to the light emitting / receiving unit (1A, 1B, 1B). The light receiving elements (6a, 7a) of 1C, 1D, 1E, 1F) receive the light and detect the amount of movement of the reflecting plate (22).

  Here, in order to explain the present invention in an easy-to-understand manner, the description has been made in association with the reference numerals indicating the embodiments. However, it goes without saying that the present invention is not limited to the embodiments.

  According to the present invention, it is possible to provide a light emitting / receiving unit capable of improving the yield of products while ensuring the reliability of the device and reducing the size and weight.

It is a top view of the detection unit which concerns on Embodiment 1 of this invention. It is a perspective view of a detection unit same as the above. It is a flowchart which shows the manufacture procedure of a detection unit same as the above. It is a partial expanded side view of the rotary encoder of this embodiment. It is a schematic perspective view of a rotary encoder same as the above. It is a top view of the detection unit which concerns on Embodiment 2 of this invention. It is a perspective view of a detection unit same as the above. It is a top view of the detection unit which concerns on Embodiment 3 of this invention. It is a perspective view of a detection unit same as the above. It is a top view of the detection unit which concerns on Embodiment 4 of this invention. It is a perspective view of a detection unit same as the above. It is a top view of the detection unit which concerns on Embodiment 5 of this invention. It is a perspective view of a detection unit same as the above. It is a top view of the detection unit which concerns on Embodiment 6 of this invention. It is a perspective view of a detection unit same as the above. It is a top view of the conventional detection unit. It is a perspective view of a detection unit same as the above.

Embodiment 1 of the Invention
1 to 5 show a first embodiment of the present invention.

  FIG. 1 is a plan view of a detection unit as a “light emitting / receiving unit” according to this embodiment, and FIG. 2 is a perspective view of the detection unit. This detection unit 1A is used for a reflection type absolute rotary encoder (details will be described later) as an “optical encoder”, and includes a substrate side semiconductor element 1a as a “chip” and a “light emitting element”. LED chip 2.

  The substrate-side semiconductor element 1a is formed by laminating a semiconductor layer on the surface side (that is, the side shown in FIG. 1) of a substantially rectangular plate-like silicon substrate 3 to form an integrated semiconductor circuit. The first light receiving element array 6 is provided on the upper side of FIG. 1 and the second light receiving element array 7 is provided on the other end side (lower side of FIG. 1) on the surface side. In the first light receiving element array 6 and the second light receiving element array 7, strip-shaped light receiving elements 6 a and 7 a are arranged in a substantially arc shape. In the first light receiving element array 6 and the second light receiving element array 7, each light receiving element 6a, 7a has a photoelectric conversion function, and converts the received light into an electric signal and outputs it.

A cathode electrode 8 and an anode electrode 11 are disposed at a substantially central portion on the surface side of the substrate-side semiconductor element 1a. On the cathode electrode 8, the LED chip 2 is mounted and fixed via a conductive adhesive (silver paste) 9.
The LED chip 2 also has a semiconductor layer laminated on the substrate surface to form an integrated semiconductor circuit. In addition, the electrode portion 10 provided on the LED chip 2 and the anode electrode 11 of the substrate-side semiconductor element 1 a are connected via a lead wire 12.
The LED chip 2 has a light emitting unit 13. The light emitting unit 13 is formed as a semiconductor layer made of a material such as GaAsP, GaP, GaN, etc., and emits light of a predetermined wavelength by applying a voltage between the cathode electrode 8 and the anode electrode 11 to perform absolute rotation. The encoder functions as a point light source. The light emitting unit 13 emits light to the outside through a light emitting window 14 formed on the surface side. The light emitting window 14 is provided with a transparent protective film (not shown), and the light emitting portion 13 is protected from corrosion and the like by this protective film.
The entire surface of the LED chip 2 including the light emitting unit 13 and the mesa unit 15 and the anode electrode 11 are covered with a sealing layer 16. The sealing layer 16 is formed of a resin coating adhesive as “resin”. The resin coating adhesive is a resin coating adhesive having both the surface protection function of the light emitting portion 13 and the function of fixing the LED chip 2 to the substrate-side semiconductor element 1a. In this embodiment, the resin coating adhesive is formed of an epoxy resin. . The sealing layer 16 protects the light emitting portion 13 and the mesa portion 15 having a high risk of being corroded by the external environment from being shielded from the external environment, and does not cause a lighting failure. Reliability can be ensured as in the case of being housed in the cavity and sealed with resin. Moreover, the sealing layer 16 is configured to cover the entire surface of the LED chip 2 with a substantially uniform thickness without being too thick. As a result, it is possible to reduce the size and thickness as compared with the case where the container is accommodated in the cavity of the container and sealed with resin. In other words, it is possible to ensure the reliability by preventing the corrosion by the external environment without changing the size as much as the LED chip 2 itself.
The sealing layer 16 has a small ratio of absorption and loss of light emitted from the light emitting unit 13 before exiting the sealing layer 16, and is reflected by a rotary reflecting disk (not shown) or the like. It is necessary to prevent light from being re-reflected on the surface of the LED chip 2 and being repeatedly reflected. Therefore, the sealing layer 16 is formed by rotating and reflecting an epoxy resin to which an absorber that absorbs (absorbs) light in the wavelength region emitted from the light emitting unit 13 is added while slightly reducing the loss of light emitted from the light emitting unit 13. It is desirable to use a content added to a level that can suppress re-reflection of reflected light reflected on a plate (not shown) or the like, for example, a content added about 5%. Further, an absorbent is added to the epoxy resin for forming the sealing layer 16, but it is desirable not to add a filler (filler) that causes the light from the light emitting portion 13 to be scattered and dispersed. Thereby, it is possible to prevent a situation in which the light emission intensity of the LED chip 2 is greatly reduced and a situation in which light is irradiated from a portion other than the light emitting unit 13 toward the rotary reflection disk.

  As shown in FIG. 2, a frame-shaped weir portion 17 a is provided over the entire periphery of the light emitting portion 13 of the substrate-side semiconductor element 1 a and the LED chip 2. The dam portion 17 a is provided so as to protrude in the surface direction from the first and second light receiving element arrays 6 and 7. The width W1 and height T1 of the weir portion 17a are from the light emitting portion 13 side to the first and second light receiving element arrays 6 and 7 side when the resin coating adhesive for forming the sealing layer 16 is applied. It is formed in a size that can prevent resin flow. In addition, as for the surface of the board | substrate side semiconductor element 1a, the inner peripheral side and outer peripheral side of the dam part 17a are formed on the substantially the same plane.

  FIG. 3 is a flowchart showing the manufacturing procedure of the detection unit 1A. The manufacturing procedure of the detection unit 1A will be described based on the flowchart.

First, as shown in FIG. 1 and FIG. 2, in a substantially central portion on the surface side of the silicon substrate 3 in which the light receiving element array 6, the second light receiving element array 7, and other semiconductor layers (not shown) are arranged on the surface side. The cathode electrode 8 is disposed. Then, a “mounting step” is performed in which the light emitting unit 13 is mounted on the cathode electrode 8 via the conductive adhesive 9 and the anode electrode 11 is mounted in the vicinity of the cathode electrode 8 (step S1). ). The LED chip 2 is fixed on the cathode electrode 8 by the “placement process”. Further, after the “placement step”, the electrode portion 10 of the LED chip 2 and the anode electrode 11 are connected by the lead wire 12.
Next, a “dropping step” in which an uncured resin coating adhesive as a sealing agent for forming the sealing layer 16 (see FIGS. 1 and 2) is dropped onto the surface of the LED chip 2 and the surface side of the silicon substrate 3. Is performed (step S2). The dropped resin coating adhesive is raised on the surface of the LED chip 2 and the surface of the silicon substrate 3 due to the surface tension.
Then, an “air blowing process” is performed in which air is blown onto the resin coating adhesive that has been raised on the surface of the LED chip 2 and the surface of the silicon substrate 3 due to surface tension (step S3). Thereby, the resin coating adhesive flows along the surface of the LED chip 2 and the surface side of the silicon substrate 3, and the application region of the resin coating adhesive spreads, and the LED chip 2 including the light emitting unit 13 and the mesa unit 15 is included. The entire surface is covered with a substantially uniform thickness.
In this state, a “heat curing process” is performed in which the silicon substrate 3 on which the LED chip 2 is placed is placed in an oven and the resin coating adhesive is heated and cured (step S4). The resin coating adhesive is cured by the “heat curing process”, and the entire surface of the LED chip 2 is covered with a substantially uniform thickness by the sealing layer 16 formed by the cured resin coating adhesive. Further, the surface portion on the side where the light emitting portion 13 of the LED chip 2 to which air is directly blown in step S3 is disposed is covered with the sealing layer 16 with an appropriate thickness without the sealing layer 16 being too thick. It will be.

  Here, since the weir portion 17a provided on the surface side of the silicon substrate 3 is provided and protruded over the entire circumference of the light emitting portion 13 and the LED chip 2, the weir portion 17a is formed with the resin coating adhesive. The flow of the resin coating adhesive that has flowed outward along the surface side of the silicon substrate 3 is blocked by the dam portion 17a, for example, at a position P1 shown in FIG. . Therefore, in the “air blowing process” in step S3, the resin coating adhesive is prevented from flowing out of the weir portion 17a.

  This prevents the resin coating adhesive from flowing into the surface of the first light receiving element array 6 or the surface of the second light receiving element array 7 in the manufacturing stage of the detection unit 1A. The light receiving function of the array 6 and the second light receiving element array 7 can be kept good, and the product yield can be made good.

  The detection unit 1A manufactured in this way is used for an absolute rotary encoder as an “optical encoder”.

FIG. 4 is a partially enlarged side view of the absolute rotary encoder 20 of this embodiment, and FIG. 5 is a schematic perspective view of the absolute rotary encoder 20 of this embodiment. Hereinafter, the absolute rotary encoder 20 according to this embodiment will be described with reference to these drawings.
The absolute rotary encoder 20 is a reflection type optical encoder, and includes a detection unit 1A and a rotating reflection disk 21 as a “reflection plate”. 1 A of detection units are arrange | positioned in the state in which the surface side (namely, the side displayed in FIG. 1) was faced downward, and opposed and opposed to the surface side of the rotation reflection disc 21 faced upward. doing.
The rotary reflection disk 21 has a substantially annular incremental track 23 formed on one side of a disk-shaped substrate portion 22 in the vicinity of the outer peripheral portion, and a substantially annular absolute track 24 disposed on the inner peripheral side of the incremental track 23. It is installed. The incremental track 23 and the absolute track 24 have a shape in which substantially strip-shaped reflectors are radially arranged on a concentric circle, whereby an incremental pattern 23 is provided on the incremental track 23 and an absolute pattern 24 is provided on the absolute track 24. Forming. The central portion 25 of the board portion 22 is pivotally supported by a rotation shaft (not shown), and is connected to a motor (not shown) on the rotation shaft (not shown).

  In the absolute rotary encoder 20 of this embodiment, the substrate portion 22 is rotated by the rotation of a motor (not shown), and the light emitted from the light emitting portion 13 is reflected by the incremental track 23 and the absolute track 24, respectively. Then, the reflected light reflected by the incremental track 23 is received by the first light receiving element array 6, and the reflected light reflected by the absolute track 24 is received by the second light receiving element array 7. The first light receiving element array 6 and the second light receiving element array 7 intermittently receive the reflected light reflected by the individual reflecting mirrors that form the incremental track 23 and the absolute track 24, respectively. A signal formed as a result of photoelectric conversion of a typical light is output to a signal processing circuit (not shown) having a CPU. In a signal processing circuit (not shown), the received signal is A / D converted to form a pulse signal, and the rotational position of the rotary reflecting disk 21 is determined by measuring the number of pulses and the appearance pattern of the pulse signal. Detect with high accuracy.

[Embodiment 2 of the Invention]
6 and 7 show a second embodiment of the present invention.

  FIG. 6 is a plan view of a detection unit as a “light emitting / receiving unit” according to the embodiment of the present invention, and FIG. 7 is a perspective view of the detection unit. The substrate-side semiconductor element 1b as a “chip” in the detection unit 1B of this embodiment is replaced with the first light receiving element array 6 and the LED chip 2 in place of the weir portion 17a of the first embodiment, and Between the second light receiving element array 7 and the LED chip 2, a pair of weir portions 17b and 17b are provided so as to protrude on the surface side. Each of the weir portions 17b and 17b has a substantially straight shape when viewed from the surface side (that is, the shape shown in FIG. 6), and one side and the other side of the light emitting unit 13 (see FIG. 6). It is provided in parallel along the upper side and the lower side of the light emitting unit 13 shown. Other configurations are the same as those in the first embodiment.

  In this embodiment, since the shape seen from the surface side of the provided weir portions 17b, 17b (that is, the shape shown in FIG. 6) is formed in a substantially linear shape, the light emitting portion 13 and the LED chip As compared with the detection unit in which the weir portion is provided over the entire circumference of 2, the manufacture is easier and the yield of the product can be further improved.

Embodiment 3 of the Invention
8 and 9 show a third embodiment of the present invention.

  FIG. 8 is a plan view of a detection unit as a “light emitting / receiving unit” according to the embodiment of the present invention, and FIG. 9 is a perspective view of the detection unit. In the substrate-side semiconductor element 1c as the “chip” in the detection unit 1C of this embodiment, the weir portion 17c is displayed in the back direction (that is, shown in FIG. 8) than the first and second light receiving element arrays 6 and 7. The second embodiment is different from the first embodiment in that it is provided to be depressed in a direction opposite to the other side. The width W2 and the depth T2 of the weir portion 17c are from the light emitting portion 13 side to the first and second light receiving element arrays 6 and 7 side when the resin coating adhesive for forming the sealing layer 16 is applied. It is formed in a size that can prevent resin flow. Other configurations are the same as those in the first embodiment.

  In this embodiment, since the weir portion 17c is recessed from the first and second light receiving element arrays 6 and 7, it flows toward the outside along the front surface side of the silicon substrate 3. The resin coating adhesive flows into the dam portion 17c, for example, as indicated by a symbol P2 shown in FIG. Thereby, the resin coating adhesive is prevented from flowing out of the weir portion 17c in the manufacturing stage of the detection unit 1C. Therefore, in this embodiment, the material of the silicon substrate 3 is reduced compared with the case where the dam portion is formed to protrude in the surface direction, and the first light receiving element array 6 and the second light receiving element array 7 are reduced. The light receiving function can be kept good and the product yield can be made good.

[Embodiment 4 of the Invention]
10 and 11 show a fourth embodiment of the present invention.

  FIG. 10 is a plan view of a detection unit as a “light emitting / receiving unit” according to the embodiment of the present invention, and FIG. 11 is a perspective view of the detection unit. The substrate-side semiconductor element 1d as the “chip” in the detection unit 1D of this embodiment is replaced with the first light receiving element array 6 and the LED chip 2 in place of the weir portion 17c of the third embodiment, and Between the second light receiving element array 7 and the LED chip 2, a pair of dam portions 17 d and 17 d are provided so as to be recessed in the back surface direction. The weir portions 17d and 17d are formed in a substantially straight shape when viewed from the surface side (that is, the shape shown in FIG. 10), and are parallel to one side and the other side of the light emitting unit 13. Is provided. Other configurations are the same as those of the third embodiment.

  In this embodiment, the shape seen from the surface side of the provided weir portions 17d, 17d is formed in a substantially linear shape, so that the entire circumference around the light emitting portion 13 and the LED chip 2 is formed. Manufacture is easier than the detection unit provided with the weir portion, and the yield of the product can be further improved.

[Embodiment 5 of the Invention]
12 and 13 show a fifth embodiment of the present invention.

  FIG. 12 is a plan view of a detection unit as a “light emitting / receiving unit” according to the embodiment of the present invention, and FIG. 13 is a perspective view of the detection unit. The substrate-side semiconductor element 1e as a “chip” in the detection unit 1E of this embodiment is provided with a substantially rectangular recess 18a in the center portion on the surface side of the substrate portion 3.

  The recess 18a is substantially rectangular in shape when viewed from the front surface side (ie, the shape shown in FIG. 12), and is closer to the back side than the first and second light receiving element arrays 6 and 7 (ie, shown in FIG. 12). The concavity is formed in the opposite direction).

  The light emitting unit 13 is mounted at a substantially central portion of the recess 18a. In addition, a stepped portion is formed at the boundary between the recess 18a and the portion other than the recess 18a in the substrate portion 3 so as to protrude in a direction substantially perpendicular to the surface of the recess 18a. A portion 17e is formed. Other configurations are the same as those of the first embodiment.

  In this embodiment, the step portion formed at the boundary portion between the recess 18a and the portion other than the recess 18a of the substrate portion 3 is formed as the weir portion 17e, and therefore, along the surface side of the silicon substrate 3. The flow of the resin coating adhesive that has flowed toward the outside is blocked by the weir portion 17e, for example, at a location indicated by reference numeral P3 shown in FIG. Thereby, the resin coating adhesive is prevented from flowing out of the weir portion 17e in the manufacturing stage of the detection unit 1E. Furthermore, in this embodiment, since the step portion is the dam portion 17e, there is no need to form the dam portions 17a, 17b, 17c, and 17d in a protruding or depressed manner as in the first to fourth embodiments. There is no need to take the width of the protrusion formed and the width of the recess formed in the depression. And the area seen from the surface side of the detection unit 1E can be made small by the part of the width. Therefore, the integration degree of the detection unit 1E can be increased, and the yield of products can be improved while maintaining the light receiving functions of the first light receiving element array 6 and the second light receiving element array 7.

Embodiment 6 of the Invention
14 and 15 show a sixth embodiment of the present invention.

  FIG. 14 is a plan view of a detection unit as a “light emitting / receiving unit” according to an embodiment of the present invention, and FIG. 15 is a perspective view of the detection unit. The substrate-side semiconductor element 1f as a “chip” in the detection unit 1F of this embodiment has a concave portion in the entire region from one side of the surface side to the other side (that is, from the left side to the right side shown in FIG. 14). The place 18b is formed as a depression. Further, at the boundary between the recess 18b and a place other than the recess 18b, a stepped portion is formed which is raised in a direction substantially perpendicular to the surface of the recess 18b. 17f is formed. Other configurations are the same as those of the first embodiment.

  In this embodiment, since the recesses 18b forming the weir portions 17f and 17f are formed from one side of the surface side of the substrate-side semiconductor element 1f to the other side, the degree of integration of the detection unit 1F is increased. The product yield can be improved while maintaining the light receiving function of the first light receiving element array 6 and the second light receiving element array 7 in good condition.

  Note that the detection units 1B, 1C, 1D, 1E, and 1F in the second to sixth embodiments are also used for forming the absolute rotary encoder 20 and the rotation of the rotary reflecting disk 21 as in the detection unit 1A in the first embodiment. The position can be detected with high accuracy.

  In each of the above embodiments, the detection units 1A, 1B, 1C, 1D, 1E, and 1F are configured to be used for the absolute rotary encoder 20, but instead, are configured to be used for the incremental rotary encoder. Or a configuration for use in an absolute linear encoder or an incremental linear encoder. Furthermore, any other than the above may be used as long as it is a reflective absolute encoder or a reflective incremental encoder.

  Furthermore, in each of the above embodiments, the LED chip 2 is mounted on the substrate-side semiconductor elements 1a, 1b, 1c, 1d, 1e, and 1f. Instead, the substrate-side semiconductor elements 1a and 1b are mounted. , 1c, 1d, 1e, and 1f may be configured such that only a light emitting diode as a “light emitting element” is mounted.

  It is needless to say that each of the above embodiments is an exemplification of the present invention and does not mean that the present invention is limited to the above embodiment.

1A, 1B, 1C, 1D, 1E, 1F... Detection unit (light emitting / receiving unit)
1a, 1b, 1c, 1d, 1e, 1f... Substrate side semiconductor element (chip)
6a, 7a ... light receiving element 13 ... light emitting diode (light emitting element)
16 ... Sealing layer (resin)
17a, 17b, 17c, 17d, 17e, 17f ... weirs 18a, 18b ... recess 20 ... rotary encoder (optical encoder)
22 ... Rotating reflective disk (reflective plate)

Claims (7)

  1. A chip having a first electrode and a second electrode provided at a position different from the first electrode and having a different polarity from the first electrode;
    A light-emitting element disposed on the chip and connected to the first electrode and the front second electrode, and irradiates light on a predetermined pattern;
    A first resin member covering the surface of the light emitting element;
    A light emitting unit for an encoder, comprising: a second resin member disposed independently of the first resin member and covering a connection portion between the light emitting element and the second electrode.
  2. The light emitting element and the second electrode are connected via a lead wire,
    A connection portion between the light emitting element and the lead wire is covered with the first resin member,
    The light emitting unit according to claim 1, wherein a connection portion between the second electrode and the lead wire is covered with the second resin member.
  3.   The light emitting unit according to claim 1, wherein the first resin member is formed so as to cover a surface of the light emitting element with a substantially uniform thickness.
  4. The light emitting element is disposed on the first electrode via a conductive adhesive,
    The light emitting unit according to any one of claims 1 to 3, wherein the first resin member is formed so as to cover a connection portion between the light emitting element and the first electrode.
  5.   5. The light emitting unit according to claim 1, further comprising a weir portion provided on the chip so as to surround the first electrode and the second electrode. 6.
  6. The light emitting unit according to any one of claims 1 to 5,
    A reflector that is movable relative to the light emitting unit and has either or both of an incremental pattern and an absolute pattern as the predetermined pattern;
    An optical encoder comprising:
  7. A method of manufacturing a light emitting unit for an encoder,
    Placing the optical element on the first electrode disposed on the chip;
    A step of connecting the optical element with a second electrode disposed on the chip and different from the first electrode and having a different polarity from the first electrode;
    Covering the surface of the light emitting element with a first resin member;
    Covering the connection between the light emitting element and the second electrode independently of the first resin member with a second resin member;
    The manufacturing method characterized by including.
JP2013191734A 2013-09-17 2013-09-17 Light receiving/emitting unit and optical encoder Pending JP2014029341A (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59107147U (en) * 1983-01-07 1984-07-19
JPS61144890A (en) * 1984-12-19 1986-07-02 Stanley Electric Co Ltd Production of lens of led lamp
JPH07231120A (en) * 1994-02-18 1995-08-29 Rohm Co Ltd Light emitting device and manufacture thereof and manufacture of led head
JP2000315823A (en) * 1999-04-30 2000-11-14 Runaraito Kk Light emitting diode and manufacture thereof
JP2005121593A (en) * 2003-10-20 2005-05-12 Nikon Corp Absolute encoder

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59107147U (en) * 1983-01-07 1984-07-19
JPS61144890A (en) * 1984-12-19 1986-07-02 Stanley Electric Co Ltd Production of lens of led lamp
JPH07231120A (en) * 1994-02-18 1995-08-29 Rohm Co Ltd Light emitting device and manufacture thereof and manufacture of led head
JP2000315823A (en) * 1999-04-30 2000-11-14 Runaraito Kk Light emitting diode and manufacture thereof
JP2005121593A (en) * 2003-10-20 2005-05-12 Nikon Corp Absolute encoder

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