JP2002141557A - Led with sealing resin mixed with photodiffusion element - Google Patents
Led with sealing resin mixed with photodiffusion elementInfo
- Publication number
- JP2002141557A JP2002141557A JP2000331200A JP2000331200A JP2002141557A JP 2002141557 A JP2002141557 A JP 2002141557A JP 2000331200 A JP2000331200 A JP 2000331200A JP 2000331200 A JP2000331200 A JP 2000331200A JP 2002141557 A JP2002141557 A JP 2002141557A
- Authority
- JP
- Japan
- Prior art keywords
- led
- sealing resin
- mixed
- light diffusing
- diffusing element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は封止樹脂に光拡散素
子を混入したＬＥＤに関する。詳しくは、液晶表示装置
のバックライト等に使用されるＬＥＤであって、封止樹
脂によるレンズ作用により照明むらが生ずるのを防止す
るため、封止樹脂に光拡散素子を混入したＬＥＤに関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED in which a light diffusing element is mixed in a sealing resin. More specifically, the present invention relates to an LED used for a backlight or the like of a liquid crystal display device, in which a light diffusing element is mixed in a sealing resin in order to prevent illumination unevenness due to a lens function of the sealing resin.
【０００２】[0002]
【従来の技術】従来の液晶表示装置のバックライトの１
例を図４に示す。同図（ａ）は平面図，（ｂ）は側面
図、（ｃ）は（ｂ）図の一部拡大図、（ｄ）はＬＥＤの
配光特性を示す図である。（ａ）図において、符号１は
液晶表示パネル、２はプリント基板、３はＬＥＤ（発光
ダイオード）である。該ＬＥＤ３は（ｃ）図の如く、ベ
アチップ４の複数個がプリント基板２に適宜の間隔で実
装され、ワイヤボンデイング５等により配線された後、
透明なエポキシ樹脂または透明なシリコン樹脂等の樹脂
封止材６により半球状に封止されている。そして、
（ｂ）図の如く、液晶表示パネル１を裏面より照明でき
るようになっている。2. Description of the Related Art One of the backlights of a conventional liquid crystal display device.
An example is shown in FIG. 3A is a plan view, FIG. 3B is a side view, FIG. 3C is a partially enlarged view of FIG. 3B, and FIG. 3D is a diagram showing light distribution characteristics of an LED. 1A, reference numeral 1 denotes a liquid crystal display panel, 2 denotes a printed board, and 3 denotes an LED (light emitting diode). As shown in FIG. 3 (c), after a plurality of bare chips 4 are mounted on the printed circuit board 2 at appropriate intervals and wired by a wire bonding 5 or the like, as shown in FIG.
It is hemispherically sealed with a resin sealing material 6 such as a transparent epoxy resin or a transparent silicon resin. And
(B) As shown in the figure, the liquid crystal display panel 1 can be illuminated from the back.
【０００３】[0003]
【発明が解決しようとする課題】上記従来の液晶表示装
置のバックライトのＬＥＤにおいては、図４（ｃ）に示
すように、その封止材６が半球状をなしているため、レ
ンズとして集光作用をなして（ｄ）図の配光特性に示す
ように照明光には垂直方向の強い指向性が生ずる。この
ため、ベアチップ４の真上方向には強く、それ以外は弱
い輝度となるため液晶表示パネルの照明に照明むらが生
ずるという問題がある。なお、ＬＥＤ３の実装ピッチを
狭くすれば照明むらを少なくすることはできるが、実装
数が増えるためコストアップになるという問題が生ず
る。また、液晶表示パネル１とＬＥＤ３との距離を離せ
ば照明むらを減少できるが、小型化に反するという問題
が生ずる。In the backlight LED of the above-mentioned conventional liquid crystal display device, as shown in FIG. 4 (c), the encapsulating material 6 has a hemispherical shape, so that it is collected as a lens. As shown by the light distribution characteristics in FIG. 4D, the illumination light has a strong directivity in the vertical direction. For this reason, there is a problem that the brightness becomes strong just above the bare chip 4 and the brightness becomes weak in the other direction, so that the unevenness occurs in the illumination of the liquid crystal display panel. In addition, if the mounting pitch of the LEDs 3 is narrowed, the unevenness in illumination can be reduced. Further, if the distance between the liquid crystal display panel 1 and the LED 3 is increased, the unevenness in illumination can be reduced.
【０００４】本発明は上記従来の問題点に鑑み、ＬＥＤ
の実装ピッチを狭くすることなく、また液晶表示パネル
との距離を大きく取る必要がないようにした、封止樹脂
に光拡散素子を混入したＬＥＤを実現することを目的と
する。The present invention has been made in view of the above-mentioned conventional problems, and has
It is an object of the present invention to realize an LED in which a light diffusing element is mixed in a sealing resin, without reducing the mounting pitch of the liquid crystal display panel and without requiring a large distance from the liquid crystal display panel.
【０００５】[0005]
【課題を解決するための手段】本発明の請求項１の封止
樹脂に光拡散素子を混入したＬＥＤは、基板上に搭載さ
れたＬＥＤのベアチップ１２を透明乃至半透明の封止樹
脂１３により封止してなるＬＥＤ１０において、前記封
止樹脂１３に多数の光拡散素子を混入したことを特徴と
する。また、請求項２は、前記封止樹脂１３には、エポ
キシ樹脂、又はシリコーン樹脂を用いたことを特徴とす
る。また、請求項３は、前記光拡散素子は、中実ガラス
球１４、光ファイバ切片１５、中空ガラス球１６のうち
の少なくとも１つを含むことを特徴とする。また、請求
項４は、前記光拡散素子の大きさは直径が１０〜１００
μｍであることを特徴とする。According to the first aspect of the present invention, the LED in which the light diffusing element is mixed into the sealing resin according to the first aspect of the present invention is obtained by using a transparent or translucent sealing resin to seal the bare chip of the LED mounted on the substrate. The sealed LED 10 is characterized in that a large number of light diffusing elements are mixed in the sealing resin 13. A second aspect of the present invention is characterized in that an epoxy resin or a silicone resin is used for the sealing resin 13. According to a third aspect of the present invention, the light diffusing element includes at least one of a solid glass sphere 14, an optical fiber section 15, and a hollow glass sphere 16. According to a fourth aspect of the present invention, the size of the light diffusion element is 10 to 100 in diameter.
μm.
【０００６】この構成を採ることにより、光拡散素子を
混入した封止樹脂によりＬＥＤのベアチップを封止した
ことにより、照明むらの少ないＬＥＤを実現することが
できる。With this configuration, the LED bare chip is sealed with the sealing resin mixed with the light diffusing element, so that an LED with less illumination unevenness can be realized.
【０００７】[0007]
【発明の実施の形態】図１は本発明の第１の実施の形態
を示す図で、（ａ）は断面図、（ｂ）は光拡散素子とし
ての中実ガラス球を示す拡大断面図、（ｃ）は中実ガラ
ス球の作用をを示す図である。同図において符号１０は
本実施の形態のＬＥＤ、１１は該ＬＥＤを搭載したプリ
ント基板である。本実施の形態のＬＥＤ１０は、ベアチ
ップ１２と該ベアチップ１２を封止した封止樹脂１３と
より構成され、該封止樹脂１３には透明なエポキシ樹脂
または透明なシリコン樹脂等の樹脂が用いられているこ
とは図４で説明した従来例と同様であるが、本実施の形
態ではこの樹脂封止材１３に光拡散素子として多数の微
小な中実ガラス球１４を混入したことを特徴としてい
る。FIG. 1 is a view showing a first embodiment of the present invention, in which (a) is a sectional view, (b) is an enlarged sectional view showing a solid glass sphere as a light diffusing element, (C) is a figure which shows the effect | action of a solid glass sphere. In FIG. 1, reference numeral 10 denotes an LED of the present embodiment, and reference numeral 11 denotes a printed circuit board on which the LED is mounted. The LED 10 of the present embodiment includes a bare chip 12 and a sealing resin 13 that seals the bare chip 12, and the sealing resin 13 is made of a resin such as a transparent epoxy resin or a transparent silicon resin. This is the same as the conventional example described with reference to FIG. 4, but the present embodiment is characterized in that a large number of minute solid glass spheres 14 are mixed into the resin sealing material 13 as light diffusing elements.
【０００８】前記中実ガラス球には透明または半透明の
ガラス（着色されていても可）で、その直径を１０〜１
００μｍに形成されたものが用いられ、樹脂封止材に分
散して混合される。The solid glass sphere is a transparent or translucent glass (which may be colored) and has a diameter of 10 to 1
One having a thickness of 00 μm is used, and is dispersed and mixed in a resin sealing material.
【０００９】このように構成された本実施の形態は、図
１（ｃ）に示すように、ベアチップ１２から出射した光
はガラス球１４により屈折または反射される。このた
め、封止樹脂１３から出る光は従来例の如く垂直方向に
集中せずに四方に分散して出射される。従って、液晶表
示パネルのバックライトに使用した場合には照明むらを
従来より少なくすることができる。In the present embodiment configured as described above, the light emitted from the bare chip 12 is refracted or reflected by the glass sphere 14, as shown in FIG. For this reason, the light emitted from the sealing resin 13 is emitted in four directions without being concentrated in the vertical direction as in the conventional example. Therefore, when used as a backlight for a liquid crystal display panel, illumination unevenness can be reduced as compared with the related art.
【００１０】図２は本発明の第２の実施の形態を示す図
で、（ａ）は断面図、（ｂ）は光拡散素子としての光フ
ァイバ切片を示す拡大斜視図である。本実施の形態は前
実施の形態とほぼ同様であり、異なるところは、光拡散
素子として多数の微小な光ファイバ切片１５を用いたこ
とである。この光ファイバ切片１５は直径が１０〜１０
０μｍで、長さは５００μｍ以下であることが好まし
い。FIGS. 2A and 2B are views showing a second embodiment of the present invention, wherein FIG. 2A is a sectional view, and FIG. 2B is an enlarged perspective view showing an optical fiber section as a light diffusing element. This embodiment is almost the same as the previous embodiment, except that many small optical fiber sections 15 are used as light diffusing elements. This optical fiber section 15 has a diameter of 10 to 10
Preferably, the length is 0 μm and the length is 500 μm or less.
【００１１】このように構成された本実施の形態は、光
ファイバ切片１５が前実施の形態のガラス球と同様な作
用をなし、液晶表示パネルのバックライトに使用した場
合には前実施の形態と同様な効果を発揮することができ
る。In the present embodiment configured as described above, the optical fiber section 15 functions in the same manner as the glass sphere of the previous embodiment. The same effect can be exhibited.
【００１２】図３は本発明第３の実施の形態を示す図
で、（ａ）は断面図、（ｂ）は光拡散素子としての中空
ガラス球を示す拡大斜視図である。本実施の形態は、第
１の実施の形態とほぼ同様であり、異なるところは、光
拡散素子として直径が１０〜１００μｍを有する多数の
微小な中空ガラス球１６を用いたことである。FIGS. 3A and 3B show a third embodiment of the present invention. FIG. 3A is a sectional view, and FIG. 3B is an enlarged perspective view showing a hollow glass sphere as a light diffusing element. This embodiment is almost the same as the first embodiment, except that a large number of minute hollow glass spheres 16 having a diameter of 10 to 100 μm are used as the light diffusing element.
【００１３】このように構成された本実施の形態は、中
空ガラス球１６が、ベアチップ１２から出射した光を屈
折すると共に、その表面および中空内面で反射するため
光拡散作用は第１の実施の形態の中実ガラス球に比して
更に大となる。従って、液晶表示パネルのバックライト
に使用した場合には照明むらを極めて少なくすることが
できる。In the present embodiment having the above-described structure, the hollow glass sphere 16 refracts the light emitted from the bare chip 12 and reflects the light on the surface and the hollow inner surface. It is even larger than a solid glass sphere in form. Therefore, when used as a backlight of a liquid crystal display panel, illumination unevenness can be extremely reduced.
【００１４】[0014]
【発明の効果】本発明の封止樹脂に光拡散素子を混入し
たＬＥＤに依れば、封止樹脂に多数の中実ガラス球、光
ファイバ切片、中空ガラス球等の微小な光拡散素子を混
入したことにより、封止樹脂によるレンズ作用による集
光を防止してベアチップから出射する光を拡散すること
ができ、液晶表示パネルのバックライトに使用した場合
の照明むらを少なくすることができる。またＬＥＤの実
装ピッチを狭くすること及び液晶表示パネルとの距離を
大きく取る必要がないため装置の大型化を防止すること
ができる。According to the LED of the present invention in which a light diffusing element is mixed with a sealing resin, a large number of minute light diffusing elements such as solid glass spheres, optical fiber sections, hollow glass spheres, etc. are used for the sealing resin. By being mixed, light emitted from the bare chip can be diffused while preventing light from condensing by the lens function of the sealing resin, and illumination unevenness when used as a backlight of a liquid crystal display panel can be reduced. Further, since it is not necessary to reduce the mounting pitch of the LEDs and to increase the distance from the liquid crystal display panel, it is possible to prevent an increase in the size of the device.
【００１５】なお、前述の各実施の形態の説明では、中
実ガラス球、光ファイバ切片、中空ガラス球の各光拡散
素子をそれぞれ単独で用いるように説明したが、単独と
は限らず２種類以上を混合して使用しても良い。In the above embodiments, each of the light diffusing elements of the solid glass sphere, the optical fiber section, and the hollow glass sphere has been described as being used alone. The above may be used in combination.
【図１】本発明の封止樹脂に光拡散素子を混入したＬＥ
Ｄの第１の実施の形態を示す図で、（ａ）は断面図、
（ｂ）は光拡散素子としての中実ガラス球を示す拡大断
面図、（ｃ）は中実ガラス球の作用を示す図である。FIG. 1 shows LE in which a light diffusing element is mixed into a sealing resin of the present invention.
D is a diagram showing the first embodiment, (a) is a cross-sectional view,
(B) is an enlarged sectional view showing a solid glass sphere as a light diffusing element, and (c) is a view showing the action of the solid glass sphere.
【図２】本発明の封止樹脂に光拡散素子を混入したＬＥ
Ｄの第２の実施の形態を示す図で、（ａ）は断面図、
（ｂ）は光拡散素子としての光ファイバ切片を示す拡大
斜視図である。FIG. 2 shows LE in which a light diffusing element is mixed into the sealing resin of the present invention.
D is a diagram showing a second embodiment, (a) is a cross-sectional view,
(B) is an enlarged perspective view showing an optical fiber section as a light diffusing element.
【図３】本発明の封止樹脂に光拡散素子を混入したＬＥ
Ｄの第３の実施の形態を示す図で、（ａ）は断面図、
（ｂ）は光拡散素子としての中空ガラス球を示す拡大断
面図である。FIG. 3 shows LE in which a light diffusing element is mixed into the sealing resin of the present invention.
D is a diagram showing a third embodiment, (a) is a cross-sectional view,
(B) is an enlarged sectional view showing a hollow glass sphere as a light diffusing element.
【図４】従来の液晶表示装置のバックライトの１例を示
す図で、（ａ）は平面図，（ｂ）は側面図、（ｃ）は
（ｂ）図の一部拡大図、（ｄ）はＬＥＤの配光特性を示
す図である。4A and 4B are diagrams showing an example of a backlight of a conventional liquid crystal display device, where FIG. 4A is a plan view, FIG. 4B is a side view, FIG. 4C is a partially enlarged view of FIG. () Is a diagram showing light distribution characteristics of the LED.
１０…ＬＥＤ １１…プリント基板 １２…ベアチップ １３…封止樹脂 １４…中実ガラス球 １５…光ファイバ切片 １６…中空ガラス球 DESCRIPTION OF SYMBOLS 10 ... LED 11 ... Printed circuit board 12 ... Bare chip 13 ... Sealing resin 14 ... Solid glass sphere 15 ... Optical fiber section 16 ... Hollow glass sphere
Claims (4)
（１２）を透明乃至半透明の封止樹脂（１３）により封
止してなるＬＥＤ（１０）において、 前記封止樹脂（１３）に多数の光拡散素子を混入したこ
とを特徴とする封止樹脂に光拡散素子を混入したＬＥ
Ｄ。An LED (10) in which a bare LED chip (12) mounted on a substrate is sealed with a transparent or translucent sealing resin (13). LE mixed with a light diffusing element in a sealing resin, characterized in that a light diffusing element is mixed.
D.
脂、又はシリコーン樹脂を用いたことを特徴とする請求
項１記載の封止樹脂に光拡散素子を混入したＬＥＤ。2. The LED according to claim 1, wherein an epoxy resin or a silicone resin is used as the sealing resin.
４）、光ファイバ切片（１５）、中空ガラス球（１６）
のうちの少なくとも１つを含むことを特徴とする請求項
１記載の封止樹脂に光拡散素子を混入したＬＥＤ。3. The light diffusing element is a solid glass sphere (1.
4), optical fiber section (15), hollow glass sphere (16)
The LED according to claim 1, wherein the light diffusing element is mixed in the sealing resin.
１００μｍであることを特徴とする請求項１記載の封止
樹脂に光拡散素子を混入したＬＥＤ。4. The light diffusion element has a diameter of 10 to 10.
The LED according to claim 1, wherein the light diffusion element is mixed in the sealing resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000331200A JP2002141557A (en) | 2000-10-30 | 2000-10-30 | Led with sealing resin mixed with photodiffusion element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000331200A JP2002141557A (en) | 2000-10-30 | 2000-10-30 | Led with sealing resin mixed with photodiffusion element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002141557A true JP2002141557A (en) | 2002-05-17 |
Family
ID=18807582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000331200A Pending JP2002141557A (en) | 2000-10-30 | 2000-10-30 | Led with sealing resin mixed with photodiffusion element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002141557A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100385312C (en) * | 2004-06-30 | 2008-04-30 | Lg.菲利浦Lcd株式会社 | Backlight unit of liquid crystal display device and liquid crystal display device using the same |
| KR100868170B1 (en) * | 2007-06-13 | 2008-11-12 | 노순호 | High brightness light-emitting diode cover |
| KR101221217B1 (en) * | 2005-12-29 | 2013-01-15 | 엘지디스플레이 주식회사 | Light- emitting diode, method of fabricating the same and backlight assembly |
| JP2017135427A (en) * | 2010-12-28 | 2017-08-03 | 日亜化学工業株式会社 | Light emitting device |
| JP2019004134A (en) * | 2017-06-12 | 2019-01-10 | 日亜化学工業株式会社 | Light-emitting device and method for manufacturing the same |
| JP2019134048A (en) * | 2018-01-31 | 2019-08-08 | 日亜化学工業株式会社 | Light-emitting device and manufacturing method thereof |
| JP2019134052A (en) * | 2018-01-31 | 2019-08-08 | 日亜化学工業株式会社 | Light-emitting device and manufacturing method thereof |
| US10454007B2 (en) | 2017-06-12 | 2019-10-22 | Nichia Corporation | Light-emitting device and method for manufacturing same |
| WO2024016480A1 (en) * | 2022-07-18 | 2024-01-25 | 武汉恩倍思科技有限公司 | Photoelectric glass display screen and process |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03206672A (en) * | 1990-01-08 | 1991-09-10 | Seiwa Denki Kk | Light-emitting diode element and its manufacture |
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2000
- 2000-10-30 JP JP2000331200A patent/JP2002141557A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03206672A (en) * | 1990-01-08 | 1991-09-10 | Seiwa Denki Kk | Light-emitting diode element and its manufacture |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| US10454007B2 (en) | 2017-06-12 | 2019-10-22 | Nichia Corporation | Light-emitting device and method for manufacturing same |
| JP7137050B2 (en) | 2017-06-12 | 2022-09-14 | 日亜化学工業株式会社 | Light-emitting device and manufacturing method thereof |
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| JP2019134052A (en) * | 2018-01-31 | 2019-08-08 | 日亜化学工業株式会社 | Light-emitting device and manufacturing method thereof |
| US10964859B2 (en) | 2018-01-31 | 2021-03-30 | Nichia Corporation | Light-emitting device and method of manufacturing the same |
| US11355678B2 (en) | 2018-01-31 | 2022-06-07 | Nichia Corporation | Light-emitting device and method of manufacturing the same |
| US11621379B2 (en) | 2018-01-31 | 2023-04-04 | Nichia Corporation | Light-emitting device and method of manufacturing the same |
| WO2024016480A1 (en) * | 2022-07-18 | 2024-01-25 | 武汉恩倍思科技有限公司 | Photoelectric glass display screen and process |
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