JP4400786B2 - Light emitting diode - Google Patents

Light emitting diode Download PDF

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JP4400786B2
JP4400786B2 JP2004173683A JP2004173683A JP4400786B2 JP 4400786 B2 JP4400786 B2 JP 4400786B2 JP 2004173683 A JP2004173683 A JP 2004173683A JP 2004173683 A JP2004173683 A JP 2004173683A JP 4400786 B2 JP4400786 B2 JP 4400786B2
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light emitting
light
emitting diode
emitting element
sealing resin
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JP2005353875A (en
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喬士 三井
一哉 石原
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Citizen Electronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Description

本発明は、樹脂封止された表面実装型の発光ダイオードに関するものである。   The present invention relates to a resin-sealed surface mount type light emitting diode.

従来の発光ダイオードは、特許文献１等に開示されているように、電極パターンが形成された回路基板上に発光素子を実装した後、その上を透光性の封止樹脂体で封止した構造となっている。   As disclosed in Patent Document 1 and the like, a conventional light-emitting diode is formed by mounting a light-emitting element on a circuit board on which an electrode pattern is formed, and then sealing the light-emitting element with a translucent sealing resin body. It has a structure.

従来の一般的な発光ダイオード１は、図９に示すように、一対の電極３ａ，３ｂ（アノード電極，カソード電極）が形成された回路基板２と、この回路基板２の略中央部にダイボンドあるいはワイヤボンドによって実装される発光素子４と、この発光素子４の上方を封止する透光性を有した封止樹脂体６とによって形成されている。このような構成からなる発光ダイオード１は、マザーボード等の実装基板上に表面実装され、前記発光素子４から発せられた光を前記封止樹脂体６の上面及び側面を通して外部に出射させるようになっている。   As shown in FIG. 9, a conventional general light emitting diode 1 includes a circuit board 2 on which a pair of electrodes 3a and 3b (anode electrode and cathode electrode) are formed, and a die bond or a substantially central portion of the circuit board 2. The light-emitting element 4 is mounted by wire bonding, and a light-transmitting sealing resin body 6 that seals above the light-emitting element 4 is formed. The light-emitting diode 1 having such a configuration is surface-mounted on a mounting substrate such as a mother board, and emits light emitted from the light-emitting element 4 to the outside through the upper surface and side surfaces of the sealing resin body 6. ing.

前記発光ダイオード１は、各種装置に備えるスイッチ類の照明用の光源として搭載される場合が多い。例えば、携帯電話機に備えるキースイッチもその一つで、テンキースイッチが実装される回路基板上に前記発光ダイオード１を適宜実装すると共に、この発光ダイオード１から発せられる光を拡散させる導光板を配置して構成されている。
特許第３３９３０８９号 The light emitting diode 1 is often mounted as a light source for illumination of switches provided in various devices. For example, a key switch provided in a cellular phone is one of them, and the light emitting diode 1 is appropriately mounted on a circuit board on which the numeric key switch is mounted, and a light guide plate for diffusing light emitted from the light emitting diode 1 is disposed. Configured.
Japanese Patent No. 3393089

しかしながら、上記従来例に示した発光ダイオード１においては、発光素子４の発光正面にあたる封止樹脂体６の上面から出射される光が最も強くなる。このため、平面的な広がりを持たせて発光させようとする場合は、前記発光ダイオード１を実装基板上に複数平面配置しなければならない。このため、実装スペースが大きくなると共に、消費電力も大きくなり、小型の電子機器内に実装するのが困難になるといった問題がある。   However, in the light emitting diode 1 shown in the conventional example, the light emitted from the upper surface of the sealing resin body 6 corresponding to the light emitting front surface of the light emitting element 4 is the strongest. For this reason, when it is intended to emit light with a planar spread, the light emitting diodes 1 must be arranged in a plurality of planes on the mounting substrate. For this reason, there is a problem that the mounting space increases and the power consumption also increases, making it difficult to mount in a small electronic device.

また、前記発光ダイオード１は、封止樹脂体６の上面が平坦であるため、指向性に幅を持たせることができない。このため、出射方向を変化させたい場合は、前記発光ダイオード１にレンズ体を装着したり、周りに反射部材や拡散部材を配設したりするなどの対策が必要となり、部品点数の増加と共にコストが増大するといった問題がある。   Moreover, since the upper surface of the sealing resin body 6 is flat, the light emitting diode 1 cannot have a wide directivity. For this reason, when it is desired to change the emission direction, it is necessary to take measures such as mounting a lens body on the light emitting diode 1 and disposing a reflecting member or a diffusing member around it. There is a problem that increases.

そこで、本発明の目的は、発光素子を封止する透光性の封止樹脂体の上面に向かう光の出射角度を広げることによって、少ない個数で平面的な広がりのある照明効果が得られる発光ダイオードを提供することである。   Accordingly, an object of the present invention is to provide a light emitting device capable of obtaining a lighting effect with a small number of planes by widening the emission angle of light toward the upper surface of a translucent sealing resin body that seals the light emitting element. It is to provide a diode.

上記課題を解決するために、本発明の発光ダイオードは、電極パターンが形成された回路基板と、この回路基板上に実装される発光素子と、この発光素子の上方を封止する透光性の封止樹脂体とを備えた発光ダイオードにおいて、前記封止樹脂体の上面に前記発光素子の上方を通る筋状の溝部を形成すると共に、この溝部内に光拡散部材を設けたことを特徴とする。   In order to solve the above-described problems, a light-emitting diode according to the present invention includes a circuit board on which an electrode pattern is formed, a light-emitting element mounted on the circuit board, and a translucent material that seals above the light-emitting element. A light emitting diode comprising a sealing resin body, wherein a streak-like groove portion passing above the light emitting element is formed on an upper surface of the sealing resin body, and a light diffusion member is provided in the groove portion. To do.

本発明に係る発光ダイオードによれば、発光素子を封止する封止樹脂体の上面側に溝部を形成し、この溝部内に光屈折あるいは光反射作用を有した光拡散部材を設けることで、通常、封止樹脂体の上方へ多く出射される光を広角に広げて出射させることができる。このため、平面的な広がりを備えた照明効果が得られる。また、前記溝部の形状やこの溝部内に形成される光拡散部材を選択することで、光の出射角度や出射光量の調整を行うことが可能となる。   According to the light emitting diode of the present invention, a groove is formed on the upper surface side of the sealing resin body that seals the light emitting element, and a light diffusing member having a light refraction or a light reflecting action is provided in the groove, Usually, a large amount of light emitted upward from the encapsulating resin body can be widened and emitted. For this reason, the illumination effect provided with the planar expansion is obtained. Further, by selecting the shape of the groove and the light diffusion member formed in the groove, it is possible to adjust the light emission angle and the amount of light emitted.

以下、添付図面に基づいて本発明に係る発光ダイオードの実施形態を詳細に説明する。図１は本発明の一実施形態に係る発光ダイオードの斜視図、図２は前記発光ダイオードの断面図である。   Hereinafter, embodiments of a light emitting diode according to the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a perspective view of a light emitting diode according to an embodiment of the present invention, and FIG. 2 is a sectional view of the light emitting diode.

図１に示すように、本発明の発光ダイオード２１は、一対の電極２３ａ，２３ｂ（アノード電極，カソード電極）が形成された回路基板２２と、この回路基板２２上に実装される発光素子２４と、この発光素子２４を封止する透光性を有した封止樹脂体２６と、この封止樹脂体２６の上面に形成される溝部３０及びこの溝部３０内に設けられる光拡散部材３１とを備えている。   As shown in FIG. 1, a light-emitting diode 21 according to the present invention includes a circuit board 22 on which a pair of electrodes 23a and 23b (anode electrode and cathode electrode) are formed, and a light-emitting element 24 mounted on the circuit board 22. A light-transmitting sealing resin body 26 for sealing the light emitting element 24, a groove portion 30 formed on the upper surface of the sealing resin body 26, and a light diffusion member 31 provided in the groove portion 30 are provided. I have.

前記回路基板２２は、ガラスエポキシ樹脂やＢＴレジン（Bismaleimide Triazine Resin）等で四角形状に形成され、その表面にアノード電極とカソード電極による一対の電極２３ａ，２３ｂがエッチング等によって形成されている。   The circuit board 22 is formed in a quadrangular shape using glass epoxy resin, BT resin (Bismaleimide Triazine Resin), or the like, and a pair of electrodes 23a and 23b including an anode electrode and a cathode electrode are formed on the surface thereof by etching or the like.

前記発光素子２４は、前記アノード電極２３ａ及びカソード電極２３ｂと対応する一対の素子電極部を備えており、一方の素子電極部をカソード電極２３ｂにダイボンドし、他方の素子電極部をアノード電極２３ａにボンディングワイヤを介して接続される。   The light emitting element 24 includes a pair of element electrode portions corresponding to the anode electrode 23a and the cathode electrode 23b, one element electrode portion is die-bonded to the cathode electrode 23b, and the other element electrode portion is connected to the anode electrode 23a. They are connected via bonding wires.

封止樹脂体２６は、透光性を有するエポキシまたはシリコーン系の樹脂によって、前記発光素子２４を覆うように、回路基板２２上に立方体形状に成型される。また、前記封止樹脂体２６の上面には、前記発光素子２４の真上を通過する筋状の溝部３０が形成されている。図１に示される第１実施形態の発光ダイオード２１では、前記溝部３０が発光素子２４を中心とした十字状に形成されている。前記溝部３０は、図２に示したように、Ｖ字状に凹設して形成され、この凹設した箇所に一対の傾斜面３０ａ，３０ｂが形成されている。この傾斜面３０ａ，３０ｂの傾斜角度は、通常６０°〜９０°の範囲で選択されるが、所望の照明効果により、断面は曲面形状とすることができる。また、前記溝部３０の深さについても任意に設定が可能である。   The sealing resin body 26 is molded in a cubic shape on the circuit board 22 so as to cover the light emitting element 24 with a translucent epoxy or silicone resin. Further, on the upper surface of the sealing resin body 26, a streak-like groove portion 30 that passes right above the light emitting element 24 is formed. In the light emitting diode 21 of the first embodiment shown in FIG. 1, the groove 30 is formed in a cross shape with the light emitting element 24 as the center. As shown in FIG. 2, the groove portion 30 is formed in a V-shaped recess, and a pair of inclined surfaces 30a and 30b are formed in the recessed portion. The inclination angles of the inclined surfaces 30a and 30b are usually selected in the range of 60 ° to 90 °, but the cross section can be formed into a curved surface shape by a desired lighting effect. Further, the depth of the groove portion 30 can be arbitrarily set.

前記溝部３０内には、光拡散部材３１が充填形成される。この光拡散部材３１は、前記発光素子２４から上方向に直進する光の一部を側面方向に屈折あるいは反射させて広く拡散させるために設けられる。したがって、前記光拡散部材３１は、ある程度の光透過率を確保しつつ、封止樹脂体２６とは異なった屈折あるいは反射作用が必要となる。本実施形態では、前記光拡散部材３１をエポキシまたはシリコーン系の透光性樹脂をベースにして、白色顔料を混在させて形成した。前記白色顔料としては、酸化チタン等の金属性のフィラーが使用される。この酸化チタンの混在割合は、光の透過、屈折及び反射のそれぞれの割合に応じて決定されるが、溝部３０内に充填される樹脂材に対して５０〜７０％程度が最適である。多すぎると光反射または屈折作用が強すぎて上方へ抜ける光量が低下し、逆に少なすぎると光反射または屈折作用が弱くなり、前記溝部３０及び光拡散部材３１を設けた効果が得られなくなるからである。なお、前記光拡散部材３１の上面は、薄型化を妨げないように、封止樹脂体２６の上面と連続するように平坦面に形成される。   A light diffusing member 31 is filled in the groove 30. The light diffusing member 31 is provided in order to diffuse a part of the light traveling straight upward from the light emitting element 24 by being refracted or reflected in the side surface direction. Therefore, the light diffusing member 31 needs a refraction or reflection action different from that of the sealing resin body 26 while ensuring a certain degree of light transmittance. In this embodiment, the light diffusing member 31 is formed by mixing a white pigment based on an epoxy or silicone-based translucent resin. As the white pigment, a metallic filler such as titanium oxide is used. The mixing ratio of titanium oxide is determined in accordance with the ratios of light transmission, refraction, and reflection, but is optimally about 50 to 70% with respect to the resin material filled in the groove 30. If the amount is too large, the amount of light reflected or refracted will be too strong and the amount of light passing upward will be reduced. Because. The upper surface of the light diffusing member 31 is formed on a flat surface so as to be continuous with the upper surface of the sealing resin body 26 so as not to prevent the thinning.

次に、図２及び図３に基づいて前記第１実施形態の発光ダイオード２１による発光作用を説明する。図２は、垂直方向における発光作用を示したものである。前記一対の電極２３ａ，２３ｂ間に電圧が印加されると、その電流値に応じて発光素子２４が発光する。この発光素子２４から発せられる光は、回路基板２２の上方に向けて出射されるが、その中でも発光素子２４の真上に位置する溝部３０の中心部３２近辺での出射量が大きい。この中心部３２に出射された光のほとんどは、溝部３０の傾斜面３０ａ，３０ｂによって外方向に屈折、あるいは、光拡散部材３１に混入されているフィラーに当たって反射され、封止樹脂体２６の上面から水平方向に広がる発光効果が得られる。なお、前記発光素子２４から発せられる光の一部はそのまま光拡散部材３１を通じて上方に出射されるので、光量は低下するものの、前記溝部３０が完全に影になることはない。   Next, the light emitting action by the light emitting diode 21 of the first embodiment will be described with reference to FIGS. FIG. 2 shows the light emitting action in the vertical direction. When a voltage is applied between the pair of electrodes 23a and 23b, the light emitting element 24 emits light according to the current value. The light emitted from the light emitting element 24 is emitted toward the upper side of the circuit board 22, and among them, the amount of emission near the center portion 32 of the groove portion 30 positioned directly above the light emitting element 24 is large. Most of the light emitted to the central portion 32 is refracted outward by the inclined surfaces 30 a and 30 b of the groove portion 30 or reflected by the filler mixed in the light diffusion member 31, and the upper surface of the sealing resin body 26. The light emission effect spreading horizontally can be obtained. Since a part of the light emitted from the light emitting element 24 is emitted upward through the light diffusing member 31 as it is, the amount of light is reduced, but the groove 30 is not completely shaded.

図３は、前記発光ダイオード２１の平面的な発光作用を示したものである。この図に示されるように、十字状に交差させて形成された溝部３０によって、前記発光素子２４を中心として、封止樹脂体２６の対角線方向（斜線で示す）に指向性を有した発光効果が得られる。   FIG. 3 shows a planar light emitting action of the light emitting diode 21. As shown in this figure, a light emitting effect having directivity in the diagonal direction (shown by diagonal lines) of the sealing resin body 26 with the light emitting element 24 as a center by the groove portion 30 formed to cross in a cross shape. Is obtained.

前記溝部３０は、封止樹脂体２６を成形した後、前記封止樹脂体２６の上面を断面がＶ字状のブレード等を使用して切削形成される。また、光拡散部材３１は、前記溝部３０が形成された封止樹脂体２６に型枠を装着し、前記溝部３０内にフィラーを混入した樹脂を充填して形成される。前記光拡散部材３１は、封止樹脂体２６と同じエポキシ系やシリコーン系の樹脂をベースとして形成されたものが望ましいが、封止樹脂体２６と異なった透過率や屈折率を有する樹脂であれば同一種類である必要はない。   The groove 30 is formed by cutting the upper surface of the sealing resin body 26 using a blade having a V-shaped cross section after the sealing resin body 26 is molded. The light diffusing member 31 is formed by attaching a mold to the sealing resin body 26 in which the groove 30 is formed, and filling the groove 30 with a resin mixed with a filler. The light diffusing member 31 is preferably formed on the basis of the same epoxy or silicone resin as the sealing resin body 26, but may be a resin having a transmittance or refractive index different from that of the sealing resin body 26. Need not be of the same type.

次に、前記溝部３０の形状を変えた他の実施形態の発光ダイオードについて説明する。図４は、封止樹脂体２６の上面を通る一本の対角線上に沿って溝部４２を形成した第２実施形態の発光ダイオード４１を示したものである。前記溝部４２の略中央部の真下に発光素子２４が実装されている。前記溝部４２は断面がＶ字状に形成され、この溝部４２内に樹脂材を充填して形成された光拡散部材４３が設けられる。この実施形態の発光ダイオード４１によれば、図５に示されるように、前記溝部４２を挟んで相対する方向（斜線で示す）に指向性を有して広がる発光効果が得られる。   Next, a light emitting diode according to another embodiment in which the shape of the groove 30 is changed will be described. FIG. 4 shows the light emitting diode 41 of the second embodiment in which the groove 42 is formed along one diagonal line passing through the upper surface of the sealing resin body 26. The light emitting element 24 is mounted just below the substantially central portion of the groove 42. The groove 42 has a V-shaped cross section, and a light diffusing member 43 formed by filling a resin material in the groove 42 is provided. According to the light emitting diode 41 of this embodiment, as shown in FIG. 5, a light emitting effect that spreads with directivity in the opposite direction (indicated by oblique lines) across the groove 42 is obtained.

図６は、封止樹脂体２６の上面に二対の対角線が交差する位置を中心として溝部５２をＸ字状に形成したもので、前記交差する溝部５２の中心の真下に発光素子２４が実装されている。前記溝部５２は断面がＶ字状に形成され、この溝部５２内を埋めるように光拡散部材５３が充填形成されている。この実施形態の発光ダイオード５１によれば、図７に示されるように、四角形状に成形された封止樹脂体のそれぞれの４辺方向（斜線で示す）に広がるような発光効果が得られる。   In FIG. 6, the groove 52 is formed in an X shape centering on the position where two pairs of diagonal lines intersect on the upper surface of the sealing resin body 26, and the light emitting element 24 is mounted directly below the center of the intersecting groove 52. Has been. The groove 52 has a V-shaped cross section, and is filled with a light diffusing member 53 so as to fill the groove 52. According to the light-emitting diode 51 of this embodiment, as shown in FIG. 7, a light-emitting effect that spreads in the four side directions (indicated by hatching) of each of the quadrangular sealing resin bodies can be obtained.

図８は、前記第３実施形態における発光ダイオード５１を光源とした携帯電話機のキースイッチパネル６１の構成例を示したものである。このようなキースイッチパネル６１は、図示しない回路基板上にキースイッチ６２を所定間隔で複数形成し、これらのキースイッチ６２の近傍に前記発光ダイオード５１を配設する。そして、前記キースイッチ６２及び発光ダイオード５１を露出させる窓孔を有した導光板６３を配設して形成される。このようなキースイッチパネル６１における光源は、側面方向に対する光量を多くする必要があるため、上記実施形態で示した発光ダイオード５１が最適である。前記キースイッチ６２との位置関係等に応じて溝部３０，４２，５２の形状の異なる上記発光ダイオード２１，４１，５１の中から適宜選択して形成される。   FIG. 8 shows an example of the configuration of a key switch panel 61 of a mobile phone using the light emitting diode 51 in the third embodiment as a light source. In such a key switch panel 61, a plurality of key switches 62 are formed at a predetermined interval on a circuit board (not shown), and the light emitting diodes 51 are disposed in the vicinity of the key switches 62. A light guide plate 63 having a window hole for exposing the key switch 62 and the light emitting diode 51 is disposed. Since the light source in such a key switch panel 61 needs to increase the light quantity with respect to a side surface direction, the light emitting diode 51 shown in the said embodiment is optimal. According to the positional relationship with the key switch 62, etc., the light emitting diodes 21, 41, 51 having different shapes of the groove portions 30, 42, 52 are appropriately selected and formed.

また、上記各実施形態における発光素子２４に窒化ガリウム系化合物半導体からなる青色発光素子を使用し、封止樹脂体２６にイットリウム・アルミニウム・ガーネットＹＡＧ等の微粒状の蛍光材を適量混入させることによって、演色性に優れた白色発光型の発光ダイオードを形成することもできる。   Further, by using a blue light emitting element made of a gallium nitride compound semiconductor for the light emitting element 24 in each of the above embodiments, and mixing an appropriate amount of fine particulate fluorescent material such as yttrium, aluminum, and garnet YAG into the sealing resin body 26. In addition, a white light emitting diode having excellent color rendering can be formed.

上述したように、本発明の発光ダイオード２１，４１，５１は、封止樹脂体２６に光の透過方向を変更させる傾斜面を備えた溝部３０，４２，５２を設け、さらに、この溝部に前記封止樹脂体２６と異なる光の屈折や反射効果を促進させる光拡散部材３１，４３，５３を設けた構造となっている。このため、前記発光ダイオード２１，４１，５１は、発光素子２４から上方へ発せられる光を側面方向に多く向けさせる平面的な広がりを備えた光源となり、特に、携帯電話機等の小型薄型電子機器の照明用途に適している。   As described above, the light emitting diodes 21, 41, 51 of the present invention are provided with the groove portions 30, 42, 52 having the inclined surfaces that change the light transmission direction in the sealing resin body 26, and further, The light diffusing members 31, 43, and 53 that promote light refraction and reflection effects different from the sealing resin body 26 are provided. For this reason, the light emitting diodes 21, 41, 51 serve as a light source having a planar spread that causes a large amount of light emitted upward from the light emitting element 24 to be directed in the lateral direction, and in particular, for small and thin electronic devices such as mobile phones. Suitable for lighting applications.

本発明に係る第１実施形態の発光ダイオードの斜視図である。1 is a perspective view of a light emitting diode according to a first embodiment of the present invention. 上記第１実施形態の発光ダイオードの断面図である。It is sectional drawing of the light emitting diode of the said 1st Embodiment. 上記第１実施形態の発光ダイオードの平面図である。It is a top view of the light emitting diode of the said 1st Embodiment. 第２実施形態の発光ダイオードの斜視図である。It is a perspective view of the light emitting diode of 2nd Embodiment. 上記第２実施形態の発光ダイオードの平面図である。It is a top view of the light emitting diode of the said 2nd Embodiment. 第３実施形態の発光ダイオードの斜視図である。It is a perspective view of the light emitting diode of 3rd Embodiment. 上記第３実施形態の発光ダイオードの平面図である。It is a top view of the light emitting diode of the said 3rd Embodiment. 上記発光ダイオードを備えたキースイッチパネルの要部斜視図である。It is a principal part perspective view of the key switch panel provided with the said light emitting diode. 従来の発光ダイオードの斜視図である。It is a perspective view of the conventional light emitting diode.

符号の説明Explanation of symbols

２１，４１，５１ 発光ダイオード
２２ 回路基板
２３ 電極パターン
２３ａ アノード電極
２３ｂ カソード電極
２４ 発光素子
２６ 封止樹脂体
３０，４２，５２ 溝部
３１，４３，５３ 光拡散部材
21, 41, 51 Light emitting diode 22 Circuit board 23 Electrode pattern 23a Anode electrode 23b Cathode electrode 24 Light emitting element 26 Sealing resin body 30, 42, 52 Groove 31, 43, 53 Light diffusing member

Claims (8)

電極パターンが形成された回路基板と、この回路基板上に実装される発光素子と、この発光素子の上方を封止する透光性の封止樹脂体とを備えた発光ダイオードにおいて、
前記封止樹脂体の上面に前記発光素子の上方を通る筋状の溝部を形成すると共に、この溝部内に光拡散部材を設けたことを特徴とする発光ダイオード。 In a light emitting diode comprising a circuit board on which an electrode pattern is formed, a light emitting element mounted on the circuit board, and a translucent sealing resin body that seals above the light emitting element,
A light emitting diode, wherein a streak-like groove portion passing above the light emitting element is formed on an upper surface of the sealing resin body, and a light diffusion member is provided in the groove portion. 前記光拡散部材は、前記発光素子から上方に発せられる光を屈折あるいは反射させて封止樹脂体の側面方向に拡散させる請求項１記載の発光ダイオード。 2. The light emitting diode according to claim 1, wherein the light diffusing member refracts or reflects light emitted upward from the light emitting element and diffuses it in a side surface direction of the sealing resin body. 前記光拡散部材は、白色顔料が混入された透光性樹脂である請求項１記載の発光ダイオード。 The light-emitting diode according to claim 1, wherein the light diffusing member is a translucent resin mixed with a white pigment. 前記白色顔料は、酸化チタンである請求項３記載の発光ダイオード。 The light-emitting diode according to claim 3, wherein the white pigment is titanium oxide. 前記透光性樹脂は、エポキシ樹脂またはシリコーン樹脂である請求項３記載の発光ダイオード。 The light-emitting diode according to claim 3, wherein the translucent resin is an epoxy resin or a silicone resin. 前記溝部は、前記封止樹脂体の上面を断面Ｖ字状または曲線状に凹設して形成される請求項１記載の発光ダイオード。 The light emitting diode according to claim 1, wherein the groove is formed by recessing an upper surface of the sealing resin body in a V-shaped cross section or a curved shape. 前記溝部は、前記発光素子の上方を中心として、前記封止樹脂体の上面を十字状またはＸ字状に交差させて形成される請求項１記載の発光ダイオード。 2. The light emitting diode according to claim 1, wherein the groove is formed by intersecting an upper surface of the sealing resin body in a cross shape or an X shape with the upper side of the light emitting element as a center. 前記発光素子が青色発光素子であり、前記封止樹脂体にイットリウム・アルミニウム・ガーネット（ＹＡＧ）蛍光材を含有させた請求項１記載の発光ダイオード。 2. The light emitting diode according to claim 1, wherein the light emitting element is a blue light emitting element, and the sealing resin body contains an yttrium aluminum garnet (YAG) fluorescent material.
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