JPH04220574A - Tool for measuring semiconductor device - Google Patents

Abstract

PURPOSE:To provide a tool for measurement in a simple structure for a semiconductor device consisting of a main body part and a plurality of lead portions and in a structure which is suited for use at a high temperature. CONSTITUTION:A title item consists of a wiring 22 which is provided at a position to be connected to a lead part 12 of a semiconductor device 1 on an insulation substrate 2, a presser tool for pressing the lead part 12 elastically through an insulation part 31, a retention part 3 for retaining an insulation part and the presser tool 31, and a fixing means 4 for removing the retention part 3 to the substrate 2 or mounting it to the substrate 2.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention relates to a measuring jig used to measure the electrical characteristics of semiconductor devices such as field effect transistors (hereinafter referred to as FETs) using GaAs in environments such as high temperatures. It's about structure.

0002

2. Description of the Related Art Semiconductor devices such as FETs require operation tests under harsh environments such as high temperature and high humidity for reliability evaluation. Therefore, measurement jigs are used that reliably electrically connect and insulate semiconductor devices under harsh environments. In particular, semiconductor devices using semiconductor materials such as GaAs, which have a wider band gap than Si, can operate at temperatures as high as 200°C or higher, and reliability evaluations are conducted at even higher temperatures. ing. Therefore, a measurement jig is required to operate the semiconductor device at such high temperatures.

0003

[Problems to be Solved by the Invention] However, a measuring jig for use in such high-temperature tests has not been provided. Measurement jigs that are commonly used are made of polymeric resin materials and do not have sufficient mechanical and electrical properties at high temperatures. Furthermore, since such a measuring jig has a complicated structure and shape, it is difficult and expensive to construct it from a material that is stable at high temperatures, such as ceramic. The present invention solves these problems and aims to provide a measuring jig having a simple structure and suitable for use at high temperatures.

0004

[Means for Solving the Problems] A measuring jig according to the present invention is used for measuring a semiconductor device consisting of a main body and a plurality of lead parts, and includes an insulating base and a connection with the lead parts on the surface of the base. a holding part for holding the holding part and corresponding to the semiconductor device; The gist is to include a fixing means that is attached to and detached from the base body.

[0005]

[Operation] Since the lead portion of the semiconductor device is elastically pressed through the insulating portion, only the lead portion is pressurized and fixed, and stress that would mechanically destroy the semiconductor device is less likely to be applied. Furthermore, since it is composed of components with a simple structure, it is possible to use materials with poor workability that can be used even at high temperatures, and it can also be applied to measurements at high temperatures.

[0006]

Embodiment The structure of a measuring jig for high temperature operation of an FET, which is an embodiment of the present invention, will be described below with reference to FIGS. 1 and 2. The FET 1, which is the object to be measured, is a Schottky junction gate type using a GaAs semiconductor, and its package consists of a ceramic main body 11 and four lead parts 12 extending planarly from the main body 11. The lead portion 12 corresponds to the gate, source, and drain electrodes of the FET 1.

The FET 1 is held between a substrate 2, which is a base body, and a block 3, which is a holding part. The substrate 2 is made of polyimide resin, which is a heat-resistant insulating material, and is provided with a recess 21 large enough to accommodate the main body 11 of the FET. A wiring 22 is provided. Each electrode of the FET 1 is connected via this wiring 21 to a power supply device, a voltage measuring device, etc. (not shown) for operation testing.

[0008] In order to fix the connection between the lead portion 12 and the wiring 21, an insulating presser rod 31 made of Teflon resin presses down on the lead portion 12. This presser bar 31 is connected to the block 3 made of aluminum metal via a coiled spring 32. Note that the block 3 is provided with a groove 33 that serves as a guide for the presser bar 31 and a recess 34 so as not to impede storage of the FET main body 11. The block 3 is fixed to the substrate 2 using a plurality of screws 4 as fixing means.

Next, a method of measuring high temperature operation using this embodiment will be explained. The body portion 11 of the FET 1, which is the object to be measured, is placed in the recess 21 of the substrate 2, and the lead portions 12 are placed on respective predetermined wirings 22. Next, block 3 is placed over FET 1 and fixed to substrate 2 with screws 4. A plurality of blocks 3 are mounted on the substrate 2 in order to fix a plurality (usually several tens) of FETs 1. The board 2 is mounted in a high-temperature constant temperature oven, and the wiring 22 is connected to a power supply device, a voltage measuring device, etc. for operation testing provided outside the high-temperature constant temperature oven. Thereafter, the high temperature constant temperature bath is heated to a predetermined temperature (150° C.) and an operation test is performed.

In particular, according to this embodiment, a large number of FETs 1 to be tested can be installed in a narrow constant temperature chamber.
Multiple measurements can be taken simultaneously. Furthermore, since a metal block is placed around the object to be tested, the temperature of the object to be measured can be made uniform, and the accuracy of test conditions can be improved.

[0011]

As explained above, the measuring jig according to the present invention is used to measure a semiconductor device consisting of a main body and a plurality of lead parts, and includes an insulating base and a connection with the lead parts on the surface of the base. a holding part for holding the holding part and corresponding to the semiconductor device; The gist is to include a fixing means that is attached to and detached from the base body.

[0012] Therefore, since only the lead portions are pressurized and fixed, the semiconductor device will not be destroyed. Furthermore, since the measurement jig is composed of components with a simple structure, it is possible to use materials with poor workability that can be used even at high temperatures, and is less likely to be damaged during handling.

[Brief explanation of the drawing]

FIG. 1 is a sectional view for explaining a measuring jig that is an embodiment of the present invention.

FIG. 2 is a plan view for explaining a measuring jig that is an embodiment of the present invention.

[Explanation of symbols]

1 FET (semiconductor device) 11 Main body 12 Lead part 2 Substrate (insulating base) 21 Recess 22 Wiring 3 Block (holding part) 31 Presser bar (presser) 32 Spring (elastic means) 4 Screw (fixing means)

Claims (1)

[Claims] 1. A semiconductor device measurement jig comprising a main body and a plurality of lead parts, including an insulating base, a wire provided on the surface of the base at a position connected to the lead part, and a wire on the wire. The semiconductor device is characterized in that it includes a presser that elastically presses the lead portion through an insulating portion, a holding portion in which the presser is held and corresponds to the semiconductor device, and a fixing means for attaching and detaching the holding portion to the base body. A jig for measuring semiconductor devices.