JPH05333093A - Measuring device for temperature characteristics of semiconductor product - Google Patents

Abstract

PURPOSE:To directly detect the temperatures of individual products during measuring the temperature charcteristics of HIC products. CONSTITUTION:A surface temperature sensor 11 is inserted and fixed in a sensor insertion hole 24 in a pushing head 2, a semiconductor product 7 is pushed and fixed by the pushing head 2 and the temperature of a heat sink 8 is measured with the sensor 11. By providing a conduction checking circuit 12, the conduction state in the conduction path through the sensor 11, the heat sink 8 and a measuring jig 3 is detected.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for measuring temperature characteristics of semiconductor products such as HIC (hybrid IC) products.

[0002]

2. Description of the Related Art FIG. 3 shows a conventional HIC (Hybrid I).
C) A configuration diagram of a temperature characteristic measuring device for a product is shown. In the figure, 1 is a thermostatic chamber, in which an electric characteristic measuring jig 3 for measuring the electric characteristic of a semiconductor product and an object to be measured. The same dummy HIC product 4 as the HIC product is independently arranged and is connected to the digital multi-meters 5a and 5b outside the thermostatic chamber 1 via thermocouples 6a and 6b, respectively, and the temperature thereof is monitored. It is like this.
A pressing head 2 is mounted on the electric characteristic measuring jig 3 and presses and fixes the lead of the product whose electric characteristic is to be measured, and is composed of an insulating member.

FIG. 4 (a) is a plan view of the electric characteristic measuring jig 3 and is in contact with the leads 9 of the semiconductor product 7 when the semiconductor product 7 is mounted at a predetermined position with the heat sink 8 down. A measurement substrate 10 having a pad 10a is provided.
4 (b) is a plan view of the back surface of the pressing head 2 shown in FIG.
(c) shows a side view thereof, and a heat radiating plate pressing portion 22 for pressing the heat radiating plate 8 of the semiconductor product 7 and a lead pressing portion 21 for pressing the leads 9 are provided by using insulating members. Reference numeral 23 is an attachment portion for attaching the pressing head 2 to a stay (not shown).

Next, a temperature characteristic measuring method using the above-mentioned device will be described. By placing the HIC product 7 to be measured at a predetermined position on the measuring jig 3 (see FIG. 4 (a)), and pressing the heat sink 8 using the pressing head 2 from above,
Lead 9 of semiconductor product 7 and pad 10a of measurement substrate 10
Make sure to make contact with. In this state, set the temperature inside the thermostatic chamber 1 to the temperature you want to measure, and set the thermocouples 6a, 6b and digital
The temperature of the jig 3 and the temperature of the dummy HIC product 4 are confirmed using the multi-meters 5a and 5b, and the electrical characteristics of the semiconductor product 7 at the desired temperature are measured.

[0005]

The conventional temperature characteristic measuring apparatus for semiconductor products is constructed as described above, and the temperature of the measuring jig and the dummy HIC product is controlled and these temperatures are placed on the jig. Since the electrical characteristics were measured by regarding them as the temperature of the semiconductor product, the temperature of each actually measured product has a deviation from the set temperature. Therefore, the temperature characteristic of each HIC product is There was a problem that we could not guarantee it enough.

The present invention has been made in order to solve the above problems, and an object thereof is to obtain a temperature characteristic measuring apparatus for semiconductor products capable of sufficiently guaranteeing the temperature characteristic of each product. ..

[0007]

A semiconductor product temperature characteristic measuring device according to the present invention comprises a temperature sensor for directly measuring the temperature of a heat radiation plate of a semiconductor product mounted on a measuring jig. Is.

Further, a conduction state detecting means for detecting the conduction state of the conduction path by the temperature sensor, the heat radiating plate and the measuring jig is provided.

[0009]

In the present invention, since the temperature sensor is provided so as to be in contact with the heat radiation plate of the semiconductor product mounted on the measuring jig, the temperature of each product can be measured and the product at a predetermined temperature can be measured. The guarantee of electrical characteristics can be ensured.

Further, by conducting the continuity check between the temperature sensor and the semiconductor product, it is possible to prevent the temperature measurement error due to the contact failure of the temperature sensor.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A temperature characteristic measuring apparatus for semiconductor products according to an embodiment of the present invention will be described below with reference to FIG. In the drawings, the same reference numerals as those in FIGS. 3 and 4 indicate the same or corresponding portions, and 11 is a surface temperature sensor, which is fixed by inserting its tip into a sensor insertion hole 24 formed in the head 2 when in use. Used. Reference numeral 13 is a continuity check wiring, one end of which is connected to the measurement jig 3 and the surface temperature sensor 11, and the other end of which is connected to the continuity check circuit 12. FIG. 1B is a plan view of the back surface side of the holding head 2, and the sensor insertion hole 24 is provided near the heat dissipation plate holding portion 22.
The constant temperature bath is omitted here.

Next, the temperature characteristic measuring method will be described. First, the tip of the surface temperature sensor 11 is pressed into the sensor insertion hole 24 formed in the head 2 and fixed.
Then, after mounting the HIC product 7 at a predetermined position on the measurement jig 3 and setting the temperature in a constant temperature bath (not shown) to a predetermined temperature, the product 7 is pressed by the pressing head 2 and at the same time the surface is The tip of the temperature sensor 11 contacts the heat sink 8 of the semiconductor product 7, and the temperature of the semiconductor product 7 is measured. At this time, the tip of the sensor 11 comes into contact with the heat dissipation plate 8 of the semiconductor product 7, and the heat dissipation plate 8 and the measurement jig 3 come into contact with each other. And the continuity check circuit 12 is turned on,
The contact state between the temperature sensor 11 and the semiconductor product 7 can be confirmed. In this state, the measurement jig 3 measures the electrical characteristics of the HIC 7.

As described above, according to this embodiment, the surface temperature sensor 11 is attached to the pressing head 2, and the pressing head 2 is attached.
Since the tip of the surface temperature sensor 11 is brought into contact with the heat dissipation plate 8 of the HIC product 7 to be measured at the time of use to measure the temperature, the temperature of the product measured at the time of measuring the electrical characteristics varies among the products. As a result, the reliability of guaranteeing the temperature characteristics of the product can be improved.

Further, since the continuity check circuit 12 is provided to check the conduction paths of the temperature sensor 11, the heat sink 8 and the measuring jig 3, it is possible to confirm the contact between the temperature sensor 11 and the heat sink 8. Therefore, it is possible to prevent temperature detection error due to poor contact.

Next, a temperature characteristic measuring apparatus for semiconductor products according to a second embodiment of the present invention will be described with reference to FIG. In this embodiment, the temperature sensor is provided on the measuring jig side. That is, in FIG. 2A, reference numeral 14 is a temperature sensor whose tip portion is curved in an L-shape, and is mounted on the fixed base 15 and housed in the measuring jig 3. And Fig. 2 (b)
As shown in FIG. 3, a sensor tip hole 31 is formed in the HIC mounting area of the measuring jig 3, and the tip of the temperature sensor 14 is fixed by using the fixing table 15 so that the tip of the temperature sensor 14 is located there. At this time, the tip of the temperature sensor 14 and the surface of the measuring jig 3 are electrically insulated. Note that the constant temperature bath is also omitted here.

Next, a method for measuring temperature characteristics will be described.
By placing the semiconductor product 7 at a predetermined position on the measurement jig 3 and pressing the semiconductor product from above with a pressing head (not shown), the tip of the surface temperature sensor 14 and the semiconductor product 7
Of the semiconductor product 7
The temperature of is measured. At the same time, a conduction path for the sensor 14, the heat sink 8 and the measuring jig 3 is formed, and the conduction check circuit 12 is formed.
Is turned on, and contact between the temperature sensor 14 and the semiconductor product 7 is confirmed. By doing so, the same effect as that of the above-described embodiment can be obtained.

In the above embodiments, the HIC is used as the semiconductor product to be measured, but other products can be used as long as they have a heat sink and need to guarantee their electrical characteristics against temperature. The same effect as above can be expected.

[0018]

As described above, according to the temperature characteristic evaluation apparatus for semiconductor products of the present invention, the surface temperature sensor is fixed to the pressing head, or the surface temperature sensor is housed in the measuring jig. The temperature of each semiconductor product is measured directly by contacting the tip with the heat sink of the semiconductor product, so the temperature of each product can be measured when measuring the electrical characteristics of the semiconductor product. There is an effect that the electrical characteristics can be guaranteed.

Further, since the conduction state detecting means is provided to check the contact between the temperature sensor and the heat radiating plate, it is possible to eliminate an error in temperature measurement due to a poor contact between the temperature sensor and the product, and to improve the measurement accuracy. There is an effect that can be.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a temperature characteristic measuring apparatus for semiconductor products according to a first embodiment of the present invention.

FIG. 2 is a configuration diagram of a temperature characteristic measuring apparatus for semiconductor products according to a second embodiment of the present invention.

FIG. 3 is a block diagram of a conventional temperature characteristic measuring apparatus for semiconductor products.

FIG. 4 is a plan view of a measuring jig of a conventional semiconductor device temperature characteristic measuring apparatus, and a back side plan view and a side view of a pressing head.

[Explanation of symbols]

 1 Constant Temperature Tank 2 Holding Head 3 Measuring Jig 4 Dummy Semiconductor Product 5a Digital Multi Meter 5b Digital Multi Meter 6a Thermocouple 6b Thermocouple 7 HIC Product 8 Heat Sink 9 Lead 10 Measurement Board 10a Pad 11 Surface Temperature Sensor 12 Continuity check circuit 13 Continuity check line 14 Surface temperature sensor 15 Fixing stand 21 Lead pressing part 22 Radiating plate pressing part 23 Pressing head mounting part 24 Sensor insertion hole 31 Surface sensor tip hole

Claims (4)

[Claims] 1. A temperature characteristic measuring device for measuring electric characteristics of a semiconductor product having a heat sink at a predetermined temperature, and a measuring jig for mounting the semiconductor product and measuring the electric characteristics thereof. The temperature of the semiconductor product is provided with a pressing head for pressing and fixing the semiconductor product to the measuring jig, and a temperature sensor for contacting a heat dissipation plate of the semiconductor product to measure the temperature thereof. Characteristic measuring device. 2. The temperature characteristic measuring device for a semiconductor product according to claim 1, further comprising a conduction state detecting means for detecting a conduction state of a conduction path formed by the temperature sensor, the heat radiating plate and the measuring jig. Measuring equipment for temperature characteristics of semiconductor products. 3. The temperature characteristic measuring device for a semiconductor product according to claim 1, wherein the temperature sensor is attached to the pressing head,
A temperature characteristic measuring device for a semiconductor product, which is in contact with the heat sink of the semiconductor product from above. 4. The temperature characteristic measuring device for a semiconductor product according to claim 1, wherein the temperature sensor is attached to the measuring jig and is in contact with a back surface of a heat sink of the semiconductor product. Measuring equipment for temperature characteristics of semiconductor products.