TWM487432U - Temperature sensing system having a plurality of quartz crystal temperature sensors and temperature-sensing apparatus - Google Patents

Description

Temperature sensing system with complex quartz crystal temperature sensor System and its temperature sensing device

The invention relates to a temperature sensing system and a temperature sensing device thereof, in particular to a temperature sensing system with a plurality of quartz crystal temperature sensors for measuring a plurality of electronic components to be tested and a sense of temperature thereof. Measuring device.

At present, the electronic component 15 (for example, the package component) is usually subjected to a temperature test through a temperature test system 1, thereby detecting whether the electronic component 15 has reached a desired target temperature, and evaluating the electronic component 15 at the target temperature. Whether it works normally. Referring to FIG. 1, the temperature testing system 1 has an oven 11 (venven), a plurality of temperature sensors 12 disposed at the top corner of the oven 11, a plurality of test boards 13 placed in the oven 11, and a plurality of The test sockets 14 on the test circuit board 13 and the plurality of test electronic components 15 placed on the test sockets 14 and electrically connected to the test circuit boards 13 through the test sockets 14.

When the oven 11 is heated or cooled, the temperature sensors 12 can be used to sense the temperature in the oven 11 and transmit the measured temperature signals to a processor (not shown) for monitoring. However, the temperature sensors 12 can only be used to sense the temperature of a local area, while at the distance The temperature of the area farther away from the detector 12 cannot be accurately measured, so that the electronic component 15 to be tested in these areas is not subjected to accurate temperature detection throughout the test.

Therefore, the object of the present invention is to provide a temperature sensing device that can accurately measure the temperatures of a plurality of electronic components to be tested, respectively.

Therefore, the novel temperature sensing device is applicable to temperature testing of a plurality of electronic components to be tested, and the temperature sensing device comprises a circuit substrate and a plurality of temperature sensing components disposed and electrically connected to the circuit substrate. The temperature sensing elements are quartz crystal temperature sensors and are used to sense the temperatures of the corresponding electronic components to be tested.

Another object of the present invention is to provide a temperature sensing system that can accurately measure the temperature of the electronic component to be tested, respectively, during temperature testing of a plurality of electronic components to be tested.

Therefore, the novel temperature sensing system is applicable to temperature testing of a plurality of electronic components to be tested, each electronic component to be tested has a plurality of conductive contacts, and the temperature sensing system comprises at least one test circuit board and a plurality of test sockets. And at least one temperature sensing device as described above.

The test sockets are disposed on the test circuit board. Each test socket includes an insulating base and a plurality of probes that pass through the insulating base. The insulating base has a receiving space for the corresponding electronic component to be tested groove. The bottom end of each of the probes is soldered to the test circuit board, and the top end of each of the probes abuts the corresponding conductive contacts of the electronic component to be tested. The temperature sensing device includes a circuit substrate and a plurality of temperature sensing elements disposed and electrically connected to the circuit substrate. The temperature sensing elements are quartz crystal temperature sensors and are used to sense the temperatures of the corresponding electronic components to be tested.

The utility model has the advantages that: by the one-to-one sensing between the temperature sensing elements and the corresponding electronic components to be tested, the corresponding electronic components to be tested can be accurately measured respectively. temperature.

2‧‧‧Temperature sensing device

21‧‧‧ circuit board

211‧‧‧Signal Transmission Department

22‧‧‧Temperature sensing components

221‧‧‧Contact surface

3‧‧‧Test circuit board

31‧‧‧Signal Transmission Department

4‧‧‧Test socket

41‧‧‧Insulated body

411‧‧‧ accommodating slots

412‧‧‧ Surrounding

413‧‧‧through holes

42‧‧‧Probe

5‧‧‧Electronic components to be tested

51‧‧‧Ontology

52‧‧‧Electrical contact

6‧‧‧ oven

Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: FIG. 1 is a side elevational view showing the state of conventionally performing temperature testing of a plurality of electronic components to be tested; Is a side view illustrating a preferred embodiment of the temperature sensing system of the present invention having a temperature sensing device; and FIG. 3 is a front elevational view showing a preferred embodiment of the temperature sensing device of the present invention; 4 is a front view illustrating a test circuit board and a plurality of test sockets of the temperature sensing system; FIG. 5 is a side exploded view showing the test circuit board, the test socket and its plurality of probes, and an electron to be tested The component and the temperature sensing device before the installation; and FIG. 6 is a side view illustrating the test circuit board, the test socket and The probes, an electronic component to be tested, and the temperature sensing device are mounted.

Referring to FIG. 2, FIG. 3 and FIG. 5, a preferred embodiment of the temperature sensing device 2 is applicable to temperature testing of a plurality of electronic components to be tested 5, which may be package components and frequency components. , logic elements, switching elements, gain elements or other types of electronic components. Preferably, the standby electronic component 5 is a quartz crystal oscillator. The preferred embodiment of the temperature sensing device 2 includes a circuit substrate 21 and a plurality of temperature sensing elements 22.

The circuit board 21 has a signal transmission unit 211 for transmitting signals generated by the temperature sensing elements 22 to a processor (not shown) electrically connected to the signal transmission unit 211, whereby the processor The signals can be further analyzed and converted to the temperature represented to monitor the temperature of the electronic component 5 to be monitored.

The temperature sensing elements 22 are disposed and electrically connected to the circuit substrate 21. The temperature sensing elements 22 are quartz crystal temperature sensors and are available for sensing to sense the temperatures of the corresponding electronic components 5 to be tested. Preferably, each of the temperature sensing elements 22 has a contact surface 221 (shown in FIG. 5) that can abut against the corresponding electronic component 5 to be tested. When the contact surface 221 of the temperature sensing element 22 abuts the waiting electronic component 5, the signals generated by the temperature sensing components 22 are converged by circuit wiring (not shown) on the circuit substrate 21. The signal transmission unit 211 is then transmitted to a processor (not shown) that is electrically connected to the signal transmission unit 211.

In the preferred embodiment, the temperature sensing elements 22 are quartz crystal temperature sensors, but not limited thereto. The temperature sensing elements 22 may also be thermal resistance temperature sensors and thermocouple temperatures. Sensor or semiconductor temperature sensor.

When the quartz crystal temperature sensors are in contact with the standby electronic component 5 (for example, a quartz crystal oscillator), the quartz crystal temperature sensors generate corresponding frequency signals by temperature changes, thereby The generated frequency signal can be further transmitted to the processor (not shown) via the circuit substrate 21 for analysis. In particular, the frequency signals generated by the quartz crystal temperature sensors are usually in a plurality of equations corresponding to the temperature represented by the plurality of equations. Therefore, by analyzing the temperatures corresponding to the frequency signals, respectively, This waits for the temperature of the electronic component 5. Different quartz crystal temperature sensors have different temperature resolutions and temperature sensing ranges, so they can be based on the desired temperature resolution (for example, temperature resolution below 0.1 ° C) and temperature sensing range (for example, the target temperature is -55 to 125 ° C) to choose the appropriate quartz crystal temperature sensor.

Referring to FIG. 2, FIG. 3, FIG. 4 and FIG. 5, a preferred embodiment of the novel temperature sensing system is applicable to temperature testing of a plurality of electronic components to be tested 5. Each of the electronic components 5 to be tested has a body 51 and a plurality of conductive contacts 52 disposed on the bottom surface of the body 51 and spaced apart from each other. The conductive contacts 52 of the present embodiment are exemplified by metal pads. A preferred embodiment of the temperature sensing system includes an oven 6, a plurality of test circuit boards 3, a plurality of test sockets 4, and a plurality of temperature sensing devices 2 as described above.

The test boards 3 are placed in the oven 6. Each The test circuit board 3 has a signal transmission unit 31. The signal transmission unit 31 can be further electrically connected to a processor (not shown), whereby the processor can be used to monitor and evaluate the electronic component 5 at a target temperature. Does it have a normal effect?

The test sockets 4 are disposed on the test circuit boards 3. Each test socket 4 includes an insulating base 41 and a plurality of probes 42 that pass through the insulating base 41. The insulating base 41 has a receiving groove 411 for receiving the corresponding electronic component 5 to be tested, a surrounding portion 412 defining the receiving groove 411, and a plurality of communicating with the receiving groove 411. A through hole 413 is provided for the probes 42 to pass through. The bottom end of each of the probes 42 is soldered to the test circuit board 3, and the top end of each of the probes 42 abuts against the corresponding conductive contacts 52 of the electronic component 5 to be tested, whereby the probes 42 are electrically The connection between the test circuit board 3 and the corresponding conductive contacts 52 of the corresponding electronic component 5 to be tested is connected. The probes 42 can further transmit the output signals of the electronic component 5 to be tested to the processor (not shown) via the signal transmitting portion 31 of the test circuit board 3.

Each temperature sensing device 2 includes a circuit substrate 21 and a temperature sensing element 22 disposed in plurality and electrically connected to the circuit substrate 21. The temperature sensing elements 22 are quartz crystal temperature sensors and are available for sensing to sense the temperatures of the corresponding electronic components 5 to be tested. The circuit substrate 21 and the temperature sensing elements 22 have the configuration and function as described above.

Referring to FIG. 6, when the electronic component 5 to be tested is mounted on the test socket 41, the probes 42 are electrically connected to the test circuit board 3 and the like. Between the conductive contacts 52, the temperature sensing component 22 of the temperature sensing device 2 is then abutted against the corresponding electronic component 5 to be tested, and thus can be used to measure the corresponding electronic component 5 to be tested. temperature.

In particular, the number and arrangement positions of the temperature sensing elements 22 on the circuit substrate 21 and the test sockets 4 on the test circuit board 3 correspond to each other (as shown in FIGS. 3 and 4). However, the number and arrangement positions are not limited to the embodiment. Those skilled in the art can adjust the number and arrangement positions of the temperature sensing elements 22 and the test sockets 4 according to their professional literacy and needs.

In the preferred embodiment, the test sockets 4 are independently disposed on the corresponding test circuit board 3. However, the manner in which the test sockets 4 are disposed is not limited thereto, and the plurality of test sockets 4 may be connected to each other or integrally formed, for example, the insulating base 41 of the test sockets 4 The test socket unit (not shown) may be formed by being connected to each other or integrally formed, and the plurality of test socket units are formed with a plurality of intervals spaced apart from each other and available for waiting The accommodating slots (not shown) in which the electronic components are accommodated are disposed, and the probes are disposed in the same manner as described above (not shown).

In summary, the corresponding electronic components 5 to be tested can be separately measured by the temperature sensing elements 22 disposed on the circuit substrate 21, and thus can be measured during the temperature test. The temperature value of the electronic component 5 to be measured is accurately obtained, so that the object of the present invention can be achieved.

However, the above is only the preferred embodiment of the present invention. The scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made in accordance with the scope of the present patent application and the contents of the patent specification are still within the scope of the present patent.

2‧‧‧Temperature sensing device

21‧‧‧ circuit board

22‧‧‧Temperature sensing components

3‧‧‧Test circuit board

4‧‧‧Test socket

5‧‧‧Electronic components to be tested

6‧‧‧ oven

Claims (3)

A temperature sensing device is applicable to temperature testing of a plurality of electronic components to be tested, the temperature sensing device comprising: a circuit substrate; and a plurality of temperature sensing components disposed and electrically connected to the circuit substrate, the temperatures The sensing element is a quartz crystal temperature sensor and is used to sense the temperature of the corresponding electronic component to be tested. A temperature sensing system is suitable for temperature testing of a plurality of electronic components to be tested, each electronic component to be tested has a plurality of conductive contacts, the temperature sensing system comprises: at least one test circuit board; a plurality of test sockets, setting On the test circuit board, each test socket includes an insulating base body and a plurality of probes through the insulating base body, and the insulating base body has a receiving groove for receiving the corresponding electronic component to be tested. The bottom end of each of the probes is soldered to the test circuit board, and the top end of each probe abuts the corresponding conductive contact portion of the electronic component to be tested; and at least one temperature sensing device includes a circuit substrate And a plurality of temperature sensing elements disposed on the circuit substrate, and the temperature sensing elements are quartz crystal temperature sensors and are used to sense the temperatures of the corresponding electronic components to be tested. The temperature sensing system of claim 2, wherein the insulating base has a surrounding portion defining the receiving groove, and a plurality of through holes communicating with the receiving groove for the probes to pass through.