JP2002040096A - Inspection device for semiconductor integrated circuit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inspection device capable of measuring the temperature of an LSI inserted into an LSI socket and automating an inspection for electric characteristic considering temperature condition. SOLUTION: This inspection device for semiconductor integrated circuit comprises the LSI socket 3 having a plurality of measurement pins 2 to make contact with the LSI 1, and an LSI tester 6 electrically connected to each measurement pin 2 of the LSI socket 3 to evaluate and inspect the electric characteristic of the LSI through the measurement pin 2. A temperature sensor 2b for detecting the temperature of the LSI and outputting it as an electric signal is arranged on at least one measurement pin 2, and the temperature information from the temperature sensor 2b is take out by the LSI tester 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor integrated circuit testing apparatus for evaluating and testing electrical characteristics of a semiconductor integrated circuit using a semiconductor integrated circuit socket.

[0002]

2. Description of the Related Art When evaluating and inspecting electrical characteristics of a semiconductor integrated circuit (hereinafter also referred to as LSI), an LSI is connected to a terminal of an LSI 11 in an inspection apparatus as shown in FIG.
The measurement pins 13 of the socket 12 are brought into physical contact with each other, and measurements relating to various inspection items are performed by an LSI tester 15 electrically connected to the measurement pins 13 via a performance board 14. The temperature that affects the electrical characteristics of the LSI 11 is managed by a thermostreamer 16 arranged so as to surround the LSI socket 12. 1
Reference numeral 7 denotes a lid of the LSI socket 12.

[0003]

However, in the above-described conventional device configuration, the heat applied from the thermostreamer 16 is transmitted to the LSI 11 through the LSI socket 12 having a low thermal conductivity and the lid 17 of the thermostreamer. Even if the ambient temperature in 16 reached the desired temperature X ° C., it was not known whether the temperature of the LSI 11 reached X ° C. In addition, since temperature information is not input to the LSI tester 15, it has not been possible to automate inspection and evaluation of electrical characteristics in consideration of temperature conditions.

Therefore, it has been a problem to be able to check the temperature of the LSI and to automate the inspection of the electrical characteristics in consideration of the temperature condition.

[0005]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a measuring pin provided in contact with a semiconductor integrated circuit, wherein a temperature sensor is provided, and the temperature information is input to an inspection means as an electric signal. Thus, the temperature of the semiconductor integrated circuit can be directly confirmed and the inspection can be automated.

According to a first aspect of the present invention, there is provided a semiconductor integrated circuit socket having a plurality of measuring pins for contacting a semiconductor integrated circuit, and the measuring pins electrically connected to the respective measuring pins of the semiconductor integrated circuit socket. A testing device for evaluating and testing the electrical characteristics of the semiconductor integrated circuit through a semiconductor integrated circuit, wherein a temperature at which the temperature of the semiconductor integrated circuit is detected at at least one of the measurement pins and output as an electrical signal A sensor is arranged, and temperature information from the temperature sensor is taken out by the inspection means.

The temperature sensor may be any sensor that detects the temperature of the semiconductor integrated circuit and converts it into an electric signal. For example, a thermocouple can be used to extract a thermoelectromotive force and use it as temperature information.

According to a second aspect of the present invention, in the semiconductor integrated circuit inspection apparatus according to the first aspect, predetermined electrical characteristics of the semiconductor integrated circuit are evaluated under predetermined temperature conditions based on temperature information from a temperature sensor. And a control means for controlling the inspection means so as to perform the inspection.
The control means may be formed integrally with the inspection means or may be formed separately.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic overall configuration diagram of a semiconductor integrated circuit inspection apparatus according to an embodiment of the present invention. As shown in FIG. 1, an LSI socket 3 having a plurality of measurement pins 2 that comes into contact with an LSI 1 that is a semiconductor integrated circuit is mounted on a performance board 4 and surrounded by a thermostreamer 5. The measuring pin 2 of the LSI socket 3 is connected to the LSI via the performance board 4.
Electrical signals that are electrically connected to the tester 6 and that are necessary for evaluating and testing the electrical characteristics of the LSI 1 are transmitted through the performance board 4. Reference numeral 7 denotes a lid of the LSI socket 3.

The LSI socket 3 is for a CSP (Chip Scale Package) as shown in FIG.
It is attached to the performance board 4 by using a socket attachment screw 8, and the plurality of measurement pins 2 are provided on a land 9 in a central region. LSI1
This LSI is designed so that its terminal contacts the measuring pin 2.
By being set on the socket 3 and being held down by the lid 7, it is electrically connected to the LSI tester 6.

However, a plurality of measurement pins 2 are arranged in a plurality of rows and sub-stages, as is common in LSI sockets 3 for CSPs, in which a plurality of measurement terminals 2a for contacting LSI terminals are arranged. An NC terminal that does not contact the LSI terminal is disposed at the corner. Here, these NC terminals are configured as a temperature sensor 2b composed of a thermocouple.

The operation of the above configuration will be described. LSI
The temperature 1 is always detected as a thermoelectromotive force by the temperature sensor 2b of the LSI socket 3 or at an appropriate time interval.

The LSI tester 6 measures the voltage from the thermoelectromotive force, automatically calculates the temperature of the LSI 1 based on the voltage-temperature characteristics stored in advance for the temperature sensor 2b, and displays the temperature on the display unit.

Therefore, based on the temperature information taken out by the LSI tester 6, the thermostreamer 5 is adjusted by control means (or by an operator) (not shown) to control the LSI 1 at a desired temperature while the measuring terminal 2a
, It is possible to measure various inspection items, and it is possible to evaluate and inspect desired electrical characteristics of the LSI 1 at a constant temperature.

Further, a temperature condition can be added to the inspection program of the LSI tester 6. That is, while the temperature of the thermostreamer 5 is continuously changed at a constant rate by control means (not shown), the temperature of the LSI 1 is calculated by the LSI tester 6 and automatically determined at predetermined temperature intervals based on the temperature information. Measurement, and the like, and automation of evaluation and inspection of the temperature characteristics of the LSI 1 can be realized.

The use of the NC terminal as the temperature sensor 2b also results in the versatility of the LSI socket 3. However, if the temperature sensor is made of a conductive material, it can be arranged at the measuring terminal 2a.

Temperature management is important in the overall evaluation and inspection of the electrical characteristics of a semiconductor. Among them, items that require temperature management include a power supply current test and a function test.

[0018]

As described above, according to the present invention, the temperature of the semiconductor integrated circuit can be directly measured at the time of inspection and evaluation by making a simple change of arranging the temperature sensor at the measurement pin of the semiconductor integrated circuit socket. Can be confirmed. Therefore, it is possible to control the temperature of the semiconductor integrated circuit and add a temperature condition to the inspection program.

[Brief description of the drawings]

FIG. 1 is a schematic overall configuration diagram of a semiconductor integrated circuit inspection apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of a semiconductor integrated circuit socket constituting a part of the semiconductor integrated circuit inspection device shown in FIG. 1;

FIG. 3 is an overall view of a conventional semiconductor integrated circuit temperature measuring method.

[Explanation of symbols]

 1 LSI 2 Measuring pin 2a Measuring terminal 2b Temperature sensor 3 LSI socket 4 Performance board 5 Thermostreamer 6 LSI tester

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01R 13/66 H01R 33/76 504Z 33/76 504 G01R 31/28 HK F term (Reference) 2G003 AA07 AC03 AG01 AH00 2G011 AA05 AA14 AB06 AC00 AC11 AD01 AE02 AF07 2G032 AA00 AB01 AB13 AJ07 AK01 AL00 5E021 FA05 FB03 FC40 MA04 5E024 CA15 CB01 CB10

Claims (2)

[Claims] A semiconductor integrated circuit socket having a plurality of measurement pins for contacting the semiconductor integrated circuit; and a semiconductor integrated circuit electrically connected to each of the measurement pins of the semiconductor integrated circuit socket via the measurement pins. A testing device for evaluating and testing electrical characteristics of a semiconductor integrated circuit, comprising: a temperature sensor that detects a temperature of the semiconductor integrated circuit and outputs the temperature as an electrical signal on at least one of the measurement pins; An inspection apparatus for a semiconductor integrated circuit, wherein temperature information from a sensor is taken out by said inspection means. 2. Based on temperature information from a temperature sensor,
2. The semiconductor integrated circuit inspection apparatus according to claim 1, further comprising control means for controlling the inspection means so as to evaluate and inspect predetermined electrical characteristics of the semiconductor integrated circuit under predetermined temperature conditions.