JPH04205899A - Semiconductor manufacturing device - Google Patents

Abstract

PURPOSE:To improve the yield of a memory by providing a changing means which changes measuring conditions and analyzing means which discriminates the possibility of changing a defective product to an acceptable product when a redundancy circuit is used. CONSTITUTION:A measuring means is controlled by means of a control circuit 2. When this semiconductor manufacturing device is started, an analyzing means 1 discriminates whether or not a defective product can be changed to an acceptable product. When it is discriminated that a defective product can be changed to an acceptable product, tests are repeatedly executed under stricter test conditions. At the time of discriminating a product as defective, the product is regarded as a defective product when the discrimination is made on the results of the first test and the results of the preceding test is utilized when the discrimination is made on the results of the second and after second tests. Therefore, the quality of a memory can be secured sufficiently even when the memory has no testing margin.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a tester for measuring semiconductor manufacturing equipment, particularly semiconductor storage elements (hereinafter referred to as memories).

[Prior Art] As the degree of integration of memories increases, the need for redundant circuits increases. FIG. 3 is a test flowchart for measuring a conventional memory and determining whether to use redundant circuitry. Step 1 is test A, step 2 is an analysis part that uses a redundant circuit to determine whether it can be changed to a non-defective product, and test A is a measurement item.

Conventionally, the measurement conditions and measurement contents of measurement items are determined in advance and remain unchanged.

Next, the operation will be explained. Test A is performed on the memory to be measured (step 1). An analysis is performed based on the results, and it is determined whether the product can be changed to a non-defective product using a redundant circuit previously provided in the memory (step 2). Based on the determination result, if the product is good, the defective state is coated (step 3, step 4).

[Problem to be solved by the invention] Conventional testers for semiconductor manufacturing equipment have fixed test conditions, so it is difficult to judge memory that becomes defective due to slight variations in test conditions with only one test. The problem was that it wasn't enough.

This invention has been made to solve the problems described in F, and aims to provide a semiconductor manufacturing apparatus that provides sufficient guarantees for memories without test margins.

[Means for Solving the Problems] A semiconductor manufacturing apparatus according to the present invention is provided with a changing means for changing measurement conditions and an analysis means for determining whether or not a non-defective product can be changed by using a redundant circuit. .

[Operation] The changing means in this invention changes the measurement conditions based on the results of the analysis means.

[Example] An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a block diagram of a tester for semiconductor manufacturing equipment showing an embodiment of the present invention. In the figure, (1) is an analysis means for determining whether or not it can be changed to a non-defective product by using a redundant circuit, (2) is a control circuit, (2I) is a determination means, (2
2) is a changing means, which is constituted by the analyzing means (1) or a changing means for changing the measurement conditions. (3) is a measuring means that is controlled by a changing means (22).

Next, the operation will be explained.

The measuring means (3) is controlled by the control circuit (2) as shown in the flowchart of FIG. In the figure, when the process starts, in step 2A, the analysis means (1) is used to determine whether or not the product will be of good quality.

If the product is non-defective, the test conditions are made stricter in step 4A, and the test is repeated in step IA.

If it is determined in step 2A that the product will not be non-defective, if it is the result of the first test, it will be determined to be a defective product, and if it is the second or later test, the result of the previous test will be used.

[Effects of the Invention] As described above, according to the present invention, the yield of memory can be improved by using all of the redundant circuits.

[Brief explanation of the drawing]

FIG. 1 is a block diagram of a tester for semiconductor manufacturing equipment showing an embodiment of the present invention, FIG. 2 is a flowchart showing control means for the tester shown in FIG. 1, and FIG. 3 is a block diagram of a tester for a conventional semiconductor manufacturing equipment. FIG. 2 is a flowchart showing a measuring method. In the figure, (1) is the analysis means, (2) is the control circuit, (
21) is a determining means, (22) is a changing means, and (3) is a measuring means. Agent Masuo Oiwa Figure 2 Figure 3

Claims (1)

[Claims] A tester for semiconductor manufacturing equipment that measures semiconductor memory elements, a measuring means to be measured by this tester, and a failure state of each measurement item measured by this measuring means,
A semiconductor manufacturing apparatus comprising: an analysis means for determining whether or not a product can be changed to a non-defective product by using a redundant circuit; and a change means for changing measurement conditions when the analysis means determines that the product can be changed to a non-defective product.