JPH042024U - - Google Patents
Info
- Publication number
- JPH042024U JPH042024U JP4279190U JP4279190U JPH042024U JP H042024 U JPH042024 U JP H042024U JP 4279190 U JP4279190 U JP 4279190U JP 4279190 U JP4279190 U JP 4279190U JP H042024 U JPH042024 U JP H042024U
- Authority
- JP
- Japan
- Prior art keywords
- hole structure
- metal
- semiconductor device
- plated
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 2
- 230000005669 field effect Effects 0.000 claims 1
- 238000007747 plating Methods 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electrodes Of Semiconductors (AREA)
- Junction Field-Effect Transistors (AREA)
Description
第1図はこの考案の一実施例による半導体装置
の断面図、第2図は従来の半導体装置の断面図で
ある。
図において、1はGaAs,2はAuめつき、
3はソース電極、4はゲート電極、5はドレイン
電極、6は半田、7はパツケージ基体、8メツキ
かる成るCu材を示す。なお、図中、同一符号は
同一、又は相当部分を示す。
FIG. 1 is a sectional view of a semiconductor device according to an embodiment of this invention, and FIG. 2 is a sectional view of a conventional semiconductor device. In the figure, 1 is GaAs, 2 is Au plating,
3 is a source electrode, 4 is a gate electrode, 5 is a drain electrode, 6 is solder, 7 is a package base, and 8 indicates a Cu material consisting of plating. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
ンジスタにおいて、via−holeの構造を形
成する金属にAu以外の金属を用い、その表面を
Auめつきしたことを特徴とする半導体装置。 1. A semiconductor device comprising a field effect transistor having a via-hole structure, in which a metal other than Au is used as the metal forming the via-hole structure, and the surface thereof is plated with Au.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4279190U JPH042024U (en) | 1990-04-20 | 1990-04-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4279190U JPH042024U (en) | 1990-04-20 | 1990-04-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH042024U true JPH042024U (en) | 1992-01-09 |
Family
ID=31554642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4279190U Pending JPH042024U (en) | 1990-04-20 | 1990-04-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH042024U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53136230U (en) * | 1977-04-01 | 1978-10-27 | ||
JPS53158316U (en) * | 1977-05-16 | 1978-12-12 | ||
JPH08203924A (en) * | 1995-01-27 | 1996-08-09 | Nec Corp | Semiconductor device |
-
1990
- 1990-04-20 JP JP4279190U patent/JPH042024U/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53136230U (en) * | 1977-04-01 | 1978-10-27 | ||
JPS5914217Y2 (en) * | 1977-04-01 | 1984-04-26 | 定 片岡 | Fan-shaped notebook |
JPS53158316U (en) * | 1977-05-16 | 1978-12-12 | ||
JPH08203924A (en) * | 1995-01-27 | 1996-08-09 | Nec Corp | Semiconductor device |