JPH042024U - - Google Patents

Info

Publication number
JPH042024U
JPH042024U JP4279190U JP4279190U JPH042024U JP H042024 U JPH042024 U JP H042024U JP 4279190 U JP4279190 U JP 4279190U JP 4279190 U JP4279190 U JP 4279190U JP H042024 U JPH042024 U JP H042024U
Authority
JP
Japan
Prior art keywords
hole structure
metal
semiconductor device
plated
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4279190U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4279190U priority Critical patent/JPH042024U/ja
Publication of JPH042024U publication Critical patent/JPH042024U/ja
Pending legal-status Critical Current

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Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Junction Field-Effect Transistors (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の一実施例による半導体装置
の断面図、第2図は従来の半導体装置の断面図で
ある。 図において、1はGaAs,2はAuめつき、
3はソース電極、4はゲート電極、5はドレイン
電極、6は半田、7はパツケージ基体、8メツキ
かる成るCu材を示す。なお、図中、同一符号は
同一、又は相当部分を示す。
FIG. 1 is a sectional view of a semiconductor device according to an embodiment of this invention, and FIG. 2 is a sectional view of a conventional semiconductor device. In the figure, 1 is GaAs, 2 is Au plating,
3 is a source electrode, 4 is a gate electrode, 5 is a drain electrode, 6 is solder, 7 is a package base, and 8 indicates a Cu material consisting of plating. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] via−hole構造からなる電界効果型トラ
ンジスタにおいて、via−holeの構造を形
成する金属にAu以外の金属を用い、その表面を
Auめつきしたことを特徴とする半導体装置。
1. A semiconductor device comprising a field effect transistor having a via-hole structure, in which a metal other than Au is used as the metal forming the via-hole structure, and the surface thereof is plated with Au.
JP4279190U 1990-04-20 1990-04-20 Pending JPH042024U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4279190U JPH042024U (en) 1990-04-20 1990-04-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4279190U JPH042024U (en) 1990-04-20 1990-04-20

Publications (1)

Publication Number Publication Date
JPH042024U true JPH042024U (en) 1992-01-09

Family

ID=31554642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4279190U Pending JPH042024U (en) 1990-04-20 1990-04-20

Country Status (1)

Country Link
JP (1) JPH042024U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53136230U (en) * 1977-04-01 1978-10-27
JPS53158316U (en) * 1977-05-16 1978-12-12
JPH08203924A (en) * 1995-01-27 1996-08-09 Nec Corp Semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53136230U (en) * 1977-04-01 1978-10-27
JPS5914217Y2 (en) * 1977-04-01 1984-04-26 定 片岡 Fan-shaped notebook
JPS53158316U (en) * 1977-05-16 1978-12-12
JPH08203924A (en) * 1995-01-27 1996-08-09 Nec Corp Semiconductor device

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