JPH0419804Y2 - - Google Patents

Info

Publication number

JPH0419804Y2

JPH0419804Y2 JP9265987U JP9265987U JPH0419804Y2 JP H0419804 Y2 JPH0419804 Y2 JP H0419804Y2 JP 9265987 U JP9265987 U JP 9265987U JP 9265987 U JP9265987 U JP 9265987U JP H0419804 Y2 JPH0419804 Y2 JP H0419804Y2

Authority

JP

Japan

Prior art keywords

lead

leads

lead frame

chip

sectional area

Prior art date

1987-06-16

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
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• 229910000679 solder Inorganic materials 0.000 description 7
• 238000004519 manufacturing process Methods 0.000 description 5
• 239000006071 cream Substances 0.000 description 4
• 230000000694 effects Effects 0.000 description 4
• 238000000034 method Methods 0.000 description 4
• 238000003825 pressing Methods 0.000 description 4
• 239000011347 resin Substances 0.000 description 3
• 229920005989 resin Polymers 0.000 description 3
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
• 229910052802 copper Inorganic materials 0.000 description 2
• 239000010949 copper Substances 0.000 description 2
• 239000003990 capacitor Substances 0.000 description 1
• 238000007796 conventional method Methods 0.000 description 1
• 230000008878 coupling Effects 0.000 description 1
• 238000010168 coupling process Methods 0.000 description 1
• 238000005859 coupling reaction Methods 0.000 description 1
• 238000005516 engineering process Methods 0.000 description 1
• 238000010438 heat treatment Methods 0.000 description 1
• 239000002184 metal Substances 0.000 description 1
• 229910052751 metal Inorganic materials 0.000 description 1
• 238000004080 punching Methods 0.000 description 1
• 239000000565 sealant Substances 0.000 description 1
• 238000007789 sealing Methods 0.000 description 1