JPH0419799Y2 - - Google Patents

Info

Publication number
JPH0419799Y2
JPH0419799Y2 JP1986076334U JP7633486U JPH0419799Y2 JP H0419799 Y2 JPH0419799 Y2 JP H0419799Y2 JP 1986076334 U JP1986076334 U JP 1986076334U JP 7633486 U JP7633486 U JP 7633486U JP H0419799 Y2 JPH0419799 Y2 JP H0419799Y2
Authority
JP
Japan
Prior art keywords
resin
sop
semiconductor element
die island
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986076334U
Other languages
English (en)
Japanese (ja)
Other versions
JPS62188149U (cg-RX-API-DMAC10.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986076334U priority Critical patent/JPH0419799Y2/ja
Publication of JPS62188149U publication Critical patent/JPS62188149U/ja
Application granted granted Critical
Publication of JPH0419799Y2 publication Critical patent/JPH0419799Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W72/932—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1986076334U 1986-05-22 1986-05-22 Expired JPH0419799Y2 (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986076334U JPH0419799Y2 (cg-RX-API-DMAC10.html) 1986-05-22 1986-05-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986076334U JPH0419799Y2 (cg-RX-API-DMAC10.html) 1986-05-22 1986-05-22

Publications (2)

Publication Number Publication Date
JPS62188149U JPS62188149U (cg-RX-API-DMAC10.html) 1987-11-30
JPH0419799Y2 true JPH0419799Y2 (cg-RX-API-DMAC10.html) 1992-05-06

Family

ID=30923315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986076334U Expired JPH0419799Y2 (cg-RX-API-DMAC10.html) 1986-05-22 1986-05-22

Country Status (1)

Country Link
JP (1) JPH0419799Y2 (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5120087B2 (ja) * 2008-06-16 2013-01-16 サンケン電気株式会社 半導体装置及びその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59115653U (ja) * 1983-01-25 1984-08-04 サンケン電気株式会社 絶縁物封止半導体装置

Also Published As

Publication number Publication date
JPS62188149U (cg-RX-API-DMAC10.html) 1987-11-30

Similar Documents

Publication Publication Date Title
JP4244318B2 (ja) 半導体装置
US8367481B2 (en) Four MOSFET full bridge module
US7211471B1 (en) Exposed lead QFP package fabricated through the use of a partial saw process
US11574855B2 (en) Package with dies mounted on opposing surfaces of a leadframe
US7777315B2 (en) Dual side cooling integrated power device module and methods of manufacture
JPS63233555A (ja) 樹脂封止型半導体装置
WO2022218031A1 (zh) 一种功率半导体器件的封装结构
JPH0878723A (ja) 光結合器用パッケージ・リードフレームおよびその方法
CN100423251C (zh) 一种半导体器件以及一种半导体器件封装件
TWI452662B (zh) 雙邊冷卻整合電源裝置封裝與模組及製造方法
US6791172B2 (en) Power semiconductor device manufactured using a chip-size package
CN100435329C (zh) 微引线框封装及制造微引线框封装的方法
JPH0419799Y2 (cg-RX-API-DMAC10.html)
JPS6180842A (ja) 半導体装置
JP3519229B2 (ja) 半導体装置
JPH04154155A (ja) 半導体装置
JP2963832B2 (ja) 樹脂封止型半導体装置の製造方法
EP1357594A1 (en) Power semiconductor device manufactured using a chip-size package
JPH02188946A (ja) 樹脂封止型半導体装置及びその製造方法
JPS61194861A (ja) 樹脂封止型半導体装置
JPH098209A (ja) 半導体装置およびモールド金型
KR0119764Y1 (ko) 반도체 패키지
JPH04118952A (ja) 樹脂封止型半導体装置及びその製造方法
JPH0422159A (ja) 半導体集積回路装置およびその製造方法
JPS6169162A (ja) 半導体装置