JPH04171803A - Through-hole wiring board - Google Patents

Abstract

PURPOSE:To realize a circuit configuration of a higher density by forming lands around holes for conducting wiring patterns formed on the first and second surfaces of a wiring board to each other and inserting and soldering coils into and to the holes. CONSTITUTION:At the time of soldering air-core coils inserted into through holes for conducting the first and second surfaces of a wiring board to each other to the holes, the solder is sucked up from the lands formed on the second surface (dip surface formed on the rear) of a double-sided wiring board to the lands formed around the through holes on the first surface (parts inserting surface) of the board through the through holes and, as a result, the peeling off of foil can strongly be prevented at the time of coil adjustment and a soldering quality can be secured, since the coils are soldered to both surfaces. In addition, since the aircore coil inserting holes are also used as the through holes for conducting the wiring patterns on both surfaces to each other, the ratio of the area occupied by the through holes to the total area of the board can be reduced and, in addition, the areas of the lands can be reduced from those of the lands used for inserting air-core coils.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a through-hole wiring board used in various electronic and electrical equipment.

Conventional Technology In recent years, it is true that through-hole wiring boards have been required to miniaturize components as various electronic and electrical devices become smaller and cheaper, but there are limits to this. For this reason, on the one hand, high-density mounting on boards is becoming important, and there is a need to improve the quality of the mounting accordingly.

An example of a conventional through-hole wiring board will be described below with reference to the drawings. FIG. 2 is a configuration diagram of a conventional through-hole wiring board. 21 is a ceramic substrate, 22 is a through hole (conductive hole), 23 is a hole (insertion hole), 2
4 is a land, 25 is a pattern on the back side of the first board (copper foil)
, 26 is a substrate surface pattern (copper foil), 27 is an air-core coil, 28 is solder, and 29 is a second pattern (copper foil) on the back surface of the substrate. 29 of the back surface pattern 2 of the circuit board is formed by soldering the air-core coil 1v27 inserted into the hole 23 to the land 24 with the solder 28, thereby forming the pattern 25 of the back surface pattern 2 of the first circuit board.
The structure is such that it is connected to the substrate surface pattern 26 via the through hole 22.

Problems to be Solved by the Invention However, with the above configuration, it is necessary to strengthen the prevention of the whistle from peeling off during coil adjustment, and to ensure the quality of soldering, it is necessary to have a large land area, and the front and back surfaces of the board are fully connected. However, the problem was that it took up some space.

In view of the above-mentioned problems, the present invention has been developed using the current board of the same area.
It provides a through-hole wiring board that enables higher-density circuit configurations, improves soldering quality, and strengthens foil peeling during coil adjustment.

Problems and Means for Solving Therefore, in order to solve the above-mentioned problem, the full-hole wiring board of the present invention has a wiring pattern formed on both sides of the board, the first side (component insertion side) and the second side. An arbitrary wiring pattern on the second surface (deep surface) is connected with the first full hole (hole for conduction), a first land is formed around the through hole on the first surface, and a first land is formed around the through hole on the second surface. A second land is formed around the through hole, one end of the air-core coil is inserted into the through hole, and the first land of the second through hole is connected to an arbitrary wiring pattern on the second surface. A third land is formed on the surface (-side), a fourth land is formed on the second surface (side), and the other end of the air-core coil is inserted into the second through-hole, and the Hunter Dip do. During the dip, the solder is sucked up from the second and fourth lands through the first and second suholes, and the solder is sucked up from the second and fourth lands through the first and second suholes. Does that mean the third land and air core coil are soldered? Featured configuration? It is prepared.

Effect of the present invention With the above-described configuration, when Lyf soldering (air-core coil inserted into the through hole) is performed (dip time), the solder flows from the land on the second surface of the double-sided board to the coil insertion hole, and The first side and the second side? Null to conduct
Through the hole, solder the air-core coil (9) to the land formed around the through-hole on the first surface from both the first and second surfaces, and use the foil for adjusting the coil. It strengthens the prevention of peeling and ensures the quality of soldering.

In addition, by sharing the role of the insertion hole of the air core coil and the through hole that connects the wiring pattern on the first side and the wiring pattern on the second side, it can be used as a through hole board with the same area as the conventional one. The proportion of holes occupied can be reduced, and the land area is smaller than that used when inserting conventional air-core coils. Since it can be made smaller (-30%), components can be mounted even more densely.

EXAMPLE Hereinafter, a through-hole wiring board according to an example of the present invention will be described with reference to the drawings.

FIG. 1 shows the structure of a through-hole/wiring board according to an embodiment of the present invention. 21 is a ceramic substrate, 26 is a substrate surface pattern, 27 is an air-core coil, 28 is solder, 29 is a second substrate back pattern, 30 is a first through hole, 31 is a second through hole, 32.33
．． 34 and 35 are lands (copper foil).

The second substrate back surface pattern 29 is similar to the first substrate pattern 29. When the air-core coil 1v27 inserted into the second through-hole 30.31 is dipped, the solder 28 spreads from each land 32.34 to the first. 2nd through hole 30°31? via land 33
．． 35, the air core coil/L/27 is soldered and electrically connected to the substrate surface pattern 26.

As a result of the above configuration, when the air-core coil inserted into the through-hole is soldered, the solder is transferred to the second layer of the double-sided board.
From the land on the surface (deep surface, back surface of the board), through the through hole that is the insertion hole for the coil and connects the first surface and the second surface, and around the through hole on the first surface (component insertion surface). The air-core coil is suctioned up to the formed land, and the air-core coil is soldered from both the first and second surfaces, thereby strengthening the prevention of peeling of the foil during coil adjustment and ensuring soldering quality. Also, does the air-core coil insertion hole serve as a through-hole that connects the wiring pattern on the first side and the wiring pattern on the second side? By sharing the holes, the proportion of holes in a conventional through-hole board with the same area can be reduced, and air-core coil/L
By being able to solder / from both sides of the board, the land area can be made smaller (-30%) than the nine land area used when inserting a conventional air-core coil, allowing for even higher density components. It will be implemented.

According to the present invention, there are wiring patterns on both sides, which is more than the effect of the invention. The wiring pattern on the first side and the wiring pattern on the second side of the formed board? A land around the hole on the first surface with a hole for conduction? When the air-core coil inserted into the through-hole is soldered by forming a land around the hole and inserting the coil into the hole and soldering it, the solder will form on the second surface of the double-sided board. The coil is inserted from the land on the surface (deep surface) through the null hole 71zi that connects the first surface and the second surface.
The solder will be drawn up to the land formed around the L/-4 hole, and the air-core coil will be soldered on both the first and second surfaces, strengthening the prevention of foil peeling during coil adjustment, and soldering. Quality can be ensured.

In addition, by sharing the role of a through hole that connects the air-core coil insertion hole, the wiring pattern on the first side, and the wiring pattern on the second side, the hole occupied by the conventional through-hole board with the same area can be reduced. The ratio can be reduced, and air-centered carp) L
Since it is possible to solder from both sides of the tf board, the land area can be made smaller (-3Q%) than the land area used when inserting the conventional core coil, and components can be mounted with higher density. .

[Brief explanation of the drawing]

Figure 1 is a configuration diagram of the through-hole wiring board of the present invention, Figure 2
The figure is a configuration diagram of a conventional through-hole wiring board. 21... Ceramic board, 22... Through hole, 23... Hole (insertion hole), 24...
... Land, 25 - ... Pattern on first substrate M surface, 26 ... Pattern on substrate surface, 27 ...
Zenshin Koinope 28... Handa, 29... 2nd
Pattern on the back side of the board, 3°...First through hole, 31...Second through hole, 32 to 36
...Rant.

Claims (2)

[Claims] (1) A hole that connects the wiring pattern on the first side of the board with wiring patterns formed on both sides and the wiring pattern on the second side, and a land is formed around the hole on the first and second sides. A through-hole wiring board, characterized in that a coil is formed in the hole, and a coil is inserted into the hole and soldered. (2) The through-hole wiring board according to claim 1, characterized in that a ceramic substrate is used.