JPH0338001A - Ceramic chip parts - Google Patents

Abstract

PURPOSE:To enable high-density mounting through grade separation by installing leg sections at both ends of a ceramic base body and forming a recessed section at a central section. CONSTITUTION:A ceramic base body 1 is manufactured by coating the upper section of the sheet of ceramics with a resistor material and covering the resistor material with a protective film, etc., and leg sections 2 are composed of ceramics, etc., and attached to both ends of the ceramic base body 1. Electrode sections 3 are manufactured by coating side faces at both ends of the ceramic base body 1 with a conductive material, and continue with the resistor material in the ceramic base body 1. Space is shaped between a printed wiring board and the center of the ceramic base body 1 by the two leg sections 2 formed at both ends of the ceramic base body 1. Consequently, the ceramic chip part of a conventional parallelopiped is mounted onto the printed wiring board by utilizing the space. Accordingly, the ceramic chip parts can be superposed and mounted, thus efficiently improving mounting density.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to ceramic knob parts used for high-density mounting of electronic circuit boards used in television receivers, audio equipment, and the like.

BACKGROUND OF THE INVENTION In recent years, as devices have become smaller and lighter, there has been a strong desire for electronic circuit boards used in devices to be smaller and more densely packaged. On the other hand, the components mounted on printed circuit boards are shifting from conventional insertion components to surface mount components. Among these, ceramic-based resistors, capacitors, inductors, etc. called chip components have been used as surface-mounted components.

This will be explained in detail below using FIG. 3. Ceramics base 1
A thin ceramic plate is coated with, for example, a resistor material and covered with a protective film or the like. Other types include those with a dielectric material embedded inside, and those with a magnetic material embedded inside.

The conductor land 4 is a part of the electric circuit pattern on the circuit board, and is made of copper foil or the like, for example. The pole portion 3 is a portion that is electrically connected to the conductor land 4 by solder 5, and is constructed by applying a conductive material to the surface of the ceramic base 1.

In other words, a circuit is formed by mounting chip components on wiring on a printed wiring board and soldering electrodes at both ends.

Problems to be Solved by the Invention However, with conventional ceramic chip components, as shown in Figure 3, ceramic chip components can only be mounted in one level on the plane of a printed wiring board, and the maximum mounting area is limited to the surface area of the printed wiring board. They were equal.

However, as printed wiring boards become smaller due to multi-layered printed wiring and finer conductor patterns, the miniaturization of ceramic chip components means that the price gradually increases as the size of the components gets smaller. There were many issues with ultra-high-density packaging from a cost perspective. In other words, in order to high-density mount chip components at the same cost as before onto printed wiring boards, which are becoming more compact, the shape requires only one level of mounting on the printed wiring board. It was a disadvantage.

In view of the above-mentioned problems, the present invention provides a ceramic chip component that enables high-density mounting by mounting the ceramic chip components in a three-dimensionally intersecting manner.

Means for Solving the Problems In order to solve the above problems, the ceramic 7-chip component of the present invention has a concave portion in the center of the ceramic base by providing legs at both ends of the ceramic base. It is.

According to the present invention, by providing the legs at both ends of the ceramic base, a recess is formed in the center of the ceramic base.

In other words, when the ceramic two-chip component according to the present invention is mounted on a printed wiring board, a space is created between the recess in the center of the ceramic chip component and the printed wiring board, and the conventional rectangular ceramic chip component is mounted in that space. Then, the Cerakotta chip parts are mounted in a three-dimensional intersection,
High-density packaging becomes possible.

EXAMPLE An example of the present invention will be described below with reference to FIGS. 1 and 2.

In FIG. 1, the ceramic base l is made of, for example, a ceramic mFi coated with a resistor material and covered with a protective film, etc. The leg part 2 is made of, for example, ceramic, and the ceramic base l It is attached to both ends of. The electrode portion 3 is a portion in which a conductive material is applied to the side surfaces of both ends of the ceramic substrate 1, and is electrically connected to, for example, a resistor material within the ceramic substrate 1.

Next, the operation of the present invention will be explained using FIG. 2.

A ceramic chip component with this configuration is mounted on a printed wiring board. Then, a space is created between the printed wiring board and the center of the ceramic base 1 by the two legs 2 formed at both ends of the ceramic base 1. This space is used to mount conventional rectangular parallelepiped ceramic chip components onto a printed wiring board. in this way,
By providing two legs 2, it is possible to mount various components and circuit patterns in a three-dimensionally intersecting manner.
This makes it possible to mount more components than was possible with conventional ceramic chip components alone.

Note that the shape of the leg portion 2 is not limited to the rectangular parallelepiped shown in FIG. Further, the distance and height between the two legs 2 can be arbitrarily selected depending on the use of the ceramic chip component of the present invention.
The shape of the electrode section 3 is also not limited to the shape shown in FIG.

The conductor lands 4 in FIG. 2 are made of, for example, copper foil, and the solder 5 is soldered by passing cream solder through a reflow oven, for example.

Note that 1' is a ceramic chip base of a rectangular parallelepiped ceramic chip component, and 3' is an electrode portion.

Effects of the Invention As described above, according to the present invention, by providing the legs at both ends of the ceramic substrate, a space is created in the center of the ceramic substrate, and this space is used to mount components on the printed wiring board. Chip components can be mounted by crossing printed wiring etc. That is, it becomes possible to stack ceramic chip components and mount them, thereby making it possible to increase the mounting density more efficiently.

[Brief Description of the Drawings] Fig. 1 is a perspective view of a ceramic cutter chip component according to an embodiment of the present invention, Fig. 2 is a perspective view of a state in which a ceramic cutter chip component according to an embodiment of the present invention is mounted, and Fig. 3 is a perspective view of a conventional ceramic chip component. l...ceramic base, 2...legs,
3... Electrode section.

Claims (1)

[Claims] A ceramic chip component comprising leg parts provided at both ends of a ceramic base, electrodes formed on the leg parts, and a recessed part provided at the center of the ceramic base.