JPH04170081A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH04170081A JPH04170081A JP2295315A JP29531590A JPH04170081A JP H04170081 A JPH04170081 A JP H04170081A JP 2295315 A JP2295315 A JP 2295315A JP 29531590 A JP29531590 A JP 29531590A JP H04170081 A JPH04170081 A JP H04170081A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- wiring pattern
- clearance
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003745 diagnosis Methods 0.000 claims abstract description 10
- 229910000679 solder Inorganic materials 0.000 claims abstract description 10
- 239000000523 sample Substances 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Tests Of Electronic Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、印刷配線板に搭載された電子部品を検査する
ことを目的として、印刷配線板に設けるブロービング用
印刷配線パッドの生成に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to the production of printed wiring pads for blobbing provided on a printed wiring board for the purpose of inspecting electronic components mounted on the printed wiring board.
従来、印刷配線板に搭載された面付電子回路部品をイン
サーキット診断するには、面付電子回路部品と他の部品
を接続する印刷配線パターン上。Conventionally, in-circuit diagnosis of surface-mounted electronic circuit components mounted on a printed wiring board involves checking the printed wiring patterns that connect the surface-mounted electronic circuit components and other components.
あるいは、インサーキット診断を実施する為、特に設け
られた印刷配線パターンに付属した印刷配線パッドを用
いていた。Alternatively, printed wiring pads attached to specially provided printed wiring patterns have been used to perform in-circuit diagnostics.
従って、本発明に係わる印刷配線パッド以外の手法を用
いて、パッド類似のものを生成する公知例は、ない。Therefore, there is no known example of producing something similar to a pad using a method other than the printed wiring pad according to the present invention.
上記従来技術は、印刷配線板上に余分なパッドを設ける
事による印刷配線パターンの接続設計の妨げ（最悪の場
合は、印刷配線板パターンが全て接続出来ず、ジャンパ
ー線配線や印刷配線板の暦数を増加させねばならない場
合もある。）について配慮がされておらず、また、パタ
ーンが余分な容量を持つことにより、電気回路に悪影響
を与える要因ともなり、費用、信頼性、共に問題があっ
た。The above conventional technology hinders the connection design of printed wiring patterns by providing extra pads on the printed wiring board (in the worst case, all printed wiring board patterns cannot be connected, and jumper wire wiring and printed wiring board In some cases, it may be necessary to increase the number of patterns), and the excess capacity of the pattern may have a negative impact on the electrical circuit, causing problems in terms of cost and reliability. Ta.
本発明は、上記に示すような、余分な費用発生や信頼性
を失うことなく、インサーキット回路診断可能な印刷配
線板を提供することを目的とする。An object of the present invention is to provide a printed wiring board capable of in-circuit circuit diagnosis without incurring extra costs or losing reliability, as described above.
本発明は、上記目的を達成するために、印刷配線パター
ンは、電気回路の接続設計のみに使用し。In order to achieve the above object, the present invention uses a printed wiring pattern only for connection design of an electric circuit.
インサーキット回路診断用には、印刷配線パターン上の
任意の場所のソルダレジスト層にクリアランスパッドを
設け、露出するパターン部分をプローブポイントとして
使用するものである。For in-circuit circuit diagnosis, clearance pads are provided in the solder resist layer at arbitrary locations on the printed wiring pattern, and the exposed pattern portions are used as probe points.
本発明は、印刷配線パターンの接続設計後、該当する試
験パターン上のどの位置にもブロービング位置を設定で
きるため、何の妨げもなく、印刷配線パターンの接続設
計が可能である。In the present invention, after connection design of a printed wiring pattern, a blobbing position can be set at any position on a corresponding test pattern, so that connection design of a printed wiring pattern can be performed without any hindrance.
〔実施例〕
以下、本発明の一実施例を第１図〜第５図により説明す
る。[Example] An example of the present invention will be described below with reference to FIGS. 1 to 5.
まず、第１図〜第４図に従来手法を示す。First, conventional methods are shown in FIGS. 1 to 4.
従来、印刷配線板１に搭載された面付電子回路部品２を
インサーキット診断するには、第１図に示す様に、印刷
配線パターン５上に、ブロービング用印刷配線パッド４
を付けていた。Conventionally, in order to perform in-circuit diagnosis of surface-mounted electronic circuit components 2 mounted on a printed wiring board 1, as shown in FIG.
was attached.
しかし、第２図の拡大図に示す様に、ブロービング用印
刷配線パッド４を付けた時、印刷配線導体間の電位差に
見合う様な導体間隔が必要で、印刷パターンの接続設計
に阻害する要因となる。However, as shown in the enlarged view of Fig. 2, when the printed wiring pad 4 for blobbing is attached, a distance between the printed wiring conductors is required to match the potential difference between the printed wiring conductors, which is a factor that hinders the connection design of the printed pattern. becomes.
従って、第３図に示す様に、面付電子回路部品２のリー
ドに直接プローブ端子６を接触する方法があるが、この
方法は、上方から部品リード、面付部品パッド３の間が
、はんだ接続されていなくても、加圧により、接続され
るため、診断結果が誤りとなってしまう。Therefore, as shown in FIG. 3, there is a method in which the probe terminal 6 is brought into direct contact with the lead of the surface-mounted electronic circuit component 2, but in this method, between the component lead and the surface-mounted component pad 3 from above, the solder is removed. Even if they are not connected, they will be connected by pressurization, resulting in incorrect diagnostic results.
又、第４図に示す様に、面付部品パッド３を長くし、面
付電子回路部品２の部品リードに直接接触しない様にす
る方法もあるが、本方法も面付部品パッド３が大きくな
るため、パターンの接続設計が阻害される。Alternatively, as shown in FIG. 4, there is a method of making the surface-mounted component pad 3 long so that it does not come into direct contact with the component leads of the surface-mounted electronic circuit component 2, but this method also makes the surface-mounted component pad 3 large. As a result, pattern connection design is hindered.
第５図は、本発明の一実施例であり、印刷配線パターン
５の接続は、ブロービング用印刷配線パッド４を考慮せ
ずに自由に接続しておき、インサーキット回路診断対象
となる面付電子回路部品２の部品リードに接続される印
刷配線パターン５の任意の箇所のソルダレジスト層８に
、クリアランスを設ける事により、ブロービング用印刷
配線パッド４と同等なプローピングポイント７が実現で
きる。FIG. 5 shows an embodiment of the present invention, in which the printed wiring pattern 5 is connected freely without considering the printed wiring pad 4 for blobbing, and the printed wiring pattern 5 is connected freely without considering the printed wiring pad 4 for blobbing. By providing a clearance in the solder resist layer 8 at any location of the printed wiring pattern 5 connected to the component lead of the electronic circuit component 2, a probing point 7 equivalent to the printed wiring pad 4 for blobbing can be realized.
第８図に印刷配線板１のプローピングポイント７部分ソ
ルダレジスト層８のクリアランス形状例を示す。FIG. 8 shows an example of the clearance shape of the solder resist layer 8 at the probing point 7 portion of the printed wiring board 1.
本方法は、プローブ端子６と印刷配線パターン５との接
触部分を大きくする事にあり、印刷配線パターン５の配
線方向に対し、クリアランスを直角方向よりもライン方
向を長くした事を特徴としている。This method consists in enlarging the contact area between the probe terminal 6 and the printed wiring pattern 5, and is characterized by making the clearance longer in the line direction than in the perpendicular direction with respect to the wiring direction of the printed wiring pattern 5.
以上述べた手法により、本発明によって、次の如き効果
を得ることができる。By the method described above, the following effects can be obtained by the present invention.
１、印刷配線パターンの配線効率を低下させずにインサ
ーキット回路診断用のプローブ接触部分を有する印刷配
線板設計が可能である。1. It is possible to design a printed wiring board having a probe contact portion for in-circuit circuit diagnosis without reducing the wiring efficiency of the printed wiring pattern.
２、印刷配線パッドを診断用として、余分に付加しない
手法であり、電気回路に悪影響を与えない印刷配線パタ
ーン設計が可能である。2. It is a method that does not add extra printed wiring pads for diagnostic purposes, and it is possible to design a printed wiring pattern that does not adversely affect the electric circuit.
３、印刷配線パッドを考慮しなくて済む事から。3. There is no need to consider printed wiring pads.
印刷配線パターン設計が短時間となる。Printed wiring pattern design takes less time.
なお１本発明は、印刷配線板自身のソルダレジスト等を
用いているため、余分な費用は発生しない。Note that the present invention uses the solder resist etc. of the printed wiring board itself, so no extra cost is incurred.
第１図は本発明に関する従来の実施例の平面図、第２図
は第１図の部分拡大図、第３図、第４図は従来の他の実
施例の側面図、第５図は本発明の印刷配線板の一実施例
の平面図、第６図は第５図の部分拡大図、第７図は側面
図、第８図は本発明の応用実施例の平面図である。
１・・・・−・・印刷配線板、
２・・・・・・面付電子回路部品。
３・・・・・・面付部品パッド、
４・・・・・・ブロービング用印刷配線１パツド、５・
・・・・・印刷配線パターン、
６・・・・・・プローブ端子、
７・・・・・・プローピングポイント、８・・・・・・
ソルダレジスト層。
第 １図 笛３ 図
多！図FIG. 1 is a plan view of a conventional embodiment of the present invention, FIG. 2 is a partially enlarged view of FIG. 1, FIGS. 3 and 4 are side views of other conventional embodiments, and FIG. FIG. 6 is a partially enlarged view of FIG. 5, FIG. 7 is a side view, and FIG. 8 is a plan view of an applied embodiment of the invention. 1...--Printed wiring board, 2... Surface-mounted electronic circuit parts. 3... Surface-attached component pad, 4... Printed wiring 1 pad for blobbing, 5...
...Printed wiring pattern, 6...Probe terminal, 7...Proping point, 8...
solder resist layer. Figure 1 Flute 3 Many diagrams! figure
Claims (2)
プローブとの接触部分を有する印刷配線板に於いて、印
刷配線パターンを覆うソルダレジストにクリアランスを
設け、クリアランス内の印刷配線パターンをインサーキ
ット回路診断時のプローピングポイントに用いることを
特徴とする印刷配線板。1. For the purpose of in-circuit circuit diagnosis, a clearance is provided in the solder resist that covers the printed wiring pattern on a printed wiring board that has a contact part with the probe of a diagnostic device, and the printed wiring pattern within the clearance is used for in-circuit circuit diagnosis. A printed wiring board characterized in that it is used as a proping point.
トのクリアランス形状を印刷配線パターン方向に対し、
直角方向よりもライン方向を長くしたことを特徴とする
印刷配線板。2. In the printed wiring board according to claim 1, the clearance shape of the solder resist is set in the direction of the printed wiring pattern.
A printed wiring board characterized by being longer in the line direction than in the perpendicular direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2295315A JPH04170081A (en) | 1990-11-02 | 1990-11-02 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2295315A JPH04170081A (en) | 1990-11-02 | 1990-11-02 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04170081A true JPH04170081A (en) | 1992-06-17 |
Family
ID=17819019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2295315A Pending JPH04170081A (en) | 1990-11-02 | 1990-11-02 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04170081A (en) |
-
1990
- 1990-11-02 JP JP2295315A patent/JPH04170081A/en active Pending
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