JPH05234649A - Ic socket - Google Patents

Abstract

PURPOSE:To easily switch an insert, an emulator and a microcomputer by providing the first part which consists of a terminal B connected with a terminal A in the same array as the packaging pattern of a printed substrate; and the second part which consists of a terminal D connected with a terminal C connectable with the packaged IC, to which the terminals D and B can be pressure-connected. CONSTITUTION:The first part is composed of a terminal 11 in the array the same as the packaging pattern on a printed substrate for surface packaging, and the terminal 12 which can connect with the terminal 11 through a wiring 18. The second part is composed of a terminal 13 which can connect with an IC packaged on a substrate, and a terminal 14 connecting with the terminal 13 through wirings 16, 19, and 17, and the wiring 19 is formed on the printed substrate 15. The wiring 18 is formed of an elastic material, the terminals 12 and 14 are pressure-connected, and an IC socket 10 is composed of the first and the second parts. As a result, an insert, an emulator and a surface mount microcomputer can be connected easily.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket, and more particularly to an IC socket used for connecting a microcomputer application system equipped with a surface mount type microcomputer and an in-circuit emulator.

[0002]

2. Description of the Related Art A conventional connection technique for connecting an in-circuit emulator to a microcomputer application system (hereinafter, microcomputer application system) equipped with a surface-mount type microcomputer (hereinafter, surface-mount microcomputer) will be described.

FIG. 7 shows a first example of a conventional connection technique. The printed circuit board 70 is a microcomputer application system equipped with a surface mount microcomputer. The connecting device 71 has terminals 72 having the same arrangement as the surface-mounting microcomputer on the bottom surface, and terminals 73 connected to the terminals 72 on the upper surface. The terminal 73 has a structure that can be easily connected to the terminal 75 of the probe 74 of the in-circuit emulator. The terminal 72 of the connection device 71 is soldered to the place on the printed circuit board 70 where the microcomputer is originally mounted.

By using such a connecting device 71, the connection between the in-circuit emulator and the microcomputer application system in which the surface mount microcomputer is planned to be mounted has been realized.

FIG. 8 shows a second example of the prior art. The printed circuit board 80 is a microcomputer application system equipped with a surface mount microcomputer, and the connection device 81 is provided with terminals 82 having the same arrangement as that of the surface mount microcomputer on the bottom surface, as in the first example of the prior art described above. A terminal 83 connected to the terminal 82 is provided on the upper surface. Terminal 83 is an in-circuit
The structure is such that it can be easily attached to and detached from the terminal 88 of the probe 87 of the emulator.

The terminal 82 of the connecting device 81 is brought into pressure contact with the place where the microcomputer is originally mounted on the printed circuit board 80 by using a screw 84 and a nut 86. Hole 85
Is a hole formed in the printed circuit board 80 for passing the screw 84.

In the second example, by using such a connection device 81, the connection between the in-circuit emulator and the microcomputer application system in which the surface mount microcomputer is planned to be mounted is realized.

[0008]

In the above-mentioned first conventional connecting technique, the connecting device 71 is directly soldered to the printed circuit board 70. Therefore, after the evaluation work by the in-circuit emulator is completed, the original There is a problem that the microcomputer cannot be installed even if it is installed.

Further, since there is a difference in electrical characteristics between the original microcomputer and the in-circuit emulator, which is difficult to avoid due to its operating principle, the in-circuit emulator is often removed even during evaluation. The work of connecting the original microcomputer and comparing the operation of the application system occurs, but this also has a problem that the above-mentioned first connection technique cannot do.

Next, in the above-mentioned second conventional connection technique, the screw 84 and the nut 85 are used to crimp the connection device 81 to the printed circuit board 80. In this system, the screw 84 is used. Holes 85 must be drilled in the printed circuit board 80 for passage.

The hole 85 is necessary only for connecting the in-circuit emulator, and has nothing to do with the function of the microcomputer application system which is the final goal. Also, because of the fact that the hole 85 is formed, this hole 85
There is a problem in that wiring cannot be placed around the wiring, and therefore there are restrictions on the wiring.

Particularly, due to recent advances in large-scale LSI technology, microcomputers having terminals of 200 pins or more have appeared. In mounting such a multi-terminal surface mounting type microcomputer, the above-mentioned part is mounted. There is a problem that the existence of the wiring restricted area is a serious obstacle in designing the printed circuit board.

[0013]

An IC socket according to the present invention is mounted on a surface-mounting printed circuit board in order to arbitrarily connect a microcomputer application system equipped with a surface-mounting microcomputer, an in-circuit emulator, and a surface-mounting microcomputer. A first component composed of a first terminal having the same arrangement as the pattern and two terminals of a second terminal connected to the first terminal; and a first component connectable to an IC mounted on the mounting pattern It has a 2nd part which can be connected to 3 terminals and a 2nd terminal, and is comprised by 2 terminals of the 4th terminal connected to the 3rd terminal.

[0014]

The present invention will be described below with reference to the drawings. FIG. 1 is a first embodiment of the present invention, and FIG. 2 is a connection diagram between the first embodiment and a surface mount microcomputer. Figure 3
An example of connecting the in-circuit emulator to the microcomputer application system by using the first embodiment is shown.

The IC socket 10 according to the present invention is composed of two independent parts. The first component is a component including a terminal 11 having the same arrangement as the mounting pattern on the surface-mounting printed board and a terminal 12 connected to the terminal 11 by a wiring 18. The second component is a terminal 13 that can be connected to a microcomputer mounted on a surface mounting printed circuit board.
And the terminal 14 connected to the terminal 13 by the wiring 16, the wiring 19, and the wiring 17. The wiring 19 is a wiring formed on the printed board 15. The wiring 18 is formed of a material having elasticity, which allows the terminal 12 and the terminal 14 to be in pressure contact with each other.

Therefore, the second part of the first part is the terminal 1
Electrical connection can be made freely by 2 and terminal 14. Usually, the terminal 11 of the first component is soldered on the printed circuit board of the microcomputer application system, and the terminal 13 of the second component is connected to the surface mount microcomputer.

FIG. 2 is a connection diagram between the present invention and a surface mount microcomputer. The printed circuit board 22 is a printed circuit board of the microcomputer application system, and the terminal 13 is the surface mount microcomputer 2
It is soldered to the IC lead wire 21 of 0.

Next, FIG. 3 shows an example in which the in-circuit emulator is connected to the microcomputer application system using the first component as it is. The wiring 31 is a wiring that connects the in-circuit emulator and the microcomputer application system, and is generally called a probe cable. In this example, in order to connect the wiring 31 to the terminal 12 of the first component, the terminal 1 using the second component described above is used.
4 and the printed circuit board 15 and the wiring 19 and the wiring 3
A third component having a terminal 30 connectable with the first component is prepared.

As described above, by soldering the first component of the IC socket according to the present invention to the microcomputer application system, both the surface mount microcomputer and the in-circuit emulator can be arbitrarily connected.

FIG. 4 shows a second embodiment of the present invention, and FIG.
FIG. 7 is a connection diagram of the second embodiment and a surface mount microcomputer.
FIG. 6 shows an example in which the in-circuit emulator is connected to the microcomputer application system using the second embodiment.

The difference between the first embodiment and the second embodiment is that the connection method of the terminals 12 and 14 shown in the first embodiment is replaced with another method. The functions and handlings of the other terminals and wirings other than the above are exactly the same as in the first embodiment. Therefore, the description of the terminals 41 and the wirings 47 of the first component and the terminals 43, the wirings 46, the wirings 48, and the printed circuit board 45 of the second component in this embodiment will be omitted.

In this embodiment, the connection between the terminal 42 of the first component and the terminal 44 of the second component is realized by crimping contact by inserting the terminal. FIG. 5 is a connection diagram of the present invention and a surface mount microcomputer, and the connection is realized by the same method as in the first embodiment.

FIG. 6 shows an example of connecting the in-circuit emulator using the first component as it is. In this example, in order to connect the wiring 31 and the terminal 42 of the first component, a third component including a terminal 60 connectable to the wiring 31 and connected to the terminal 44 and a printed circuit board 61 is prepared. ..

[0024]

As described above, the IC socket according to the present invention is mounted on a surface mounting printed circuit board in order to arbitrarily connect a microcomputer application system mounting a surface mounting microcomputer, an in-circuit emulator and a surface mounting microcomputer. A first component including two terminals, a first terminal having the same arrangement as the mounting pattern and a second terminal connected to the first terminal, and an IC mounted on the mounting pattern can be connected. The above-mentioned conventional first connection because it has a second component that is connectable to the third terminal and the second terminal and is composed of two terminals, the fourth terminal connected to the third terminal. Like the technology, the advantage that the inconvenience that the original microcomputer cannot be installed after the evaluation work by the in-circuit emulator is completed does not occur, and the microcomputer application Stem and in-circuit emulator, because that can be changed easily splicing the surface mount microcomputer, there is an advantage that can be performed flexible evaluation work.

Further, as in the above-mentioned second conventional connection technique, it is necessary to make a hole in the printed circuit board which has nothing to do with the function of the original microcomputer application system, just to connect the in-circuit emulator. Therefore, there is an advantage that there is no wiring restricted area caused by this, and the design of the printed circuit board is not hindered.

[Brief description of drawings]

FIG. 1 is a diagram showing a first embodiment of the present invention.

FIG. 2 is a connection diagram of the first embodiment of the present invention and a surface mount type microcomputer.

FIG. 3 is a diagram showing a connection example of the first embodiment of the present invention and an in-circuit emulator.

FIG. 4 is a diagram showing a second embodiment of the present invention.

FIG. 5 is a connection diagram of a second embodiment of the present invention and a surface mount type microcomputer.

FIG. 6 is a diagram showing a connection example between a second embodiment of the present invention and an in-circuit emulator.

FIG. 7 is a diagram showing a first example of a conventional technique.

FIG. 8 is a diagram showing a second example of the prior art.

[Explanation of symbols]

 10 IC Sockets 11-14 Terminals 15 Printed Circuit Boards 16-19 Wiring 20 Surface Mounted Microcomputer 21 IC Lead Wires 22 Printed Circuit Boards 30 Terminals 31 Wiring 40 IC Sockets 41-44 Terminals 45 Printed Circuit Boards 46-48 Wiring 60 Terminals 61, 70 Printed circuit board 71 Connection device 72,73 terminal 74 Probe 75 terminal 80 Printed circuit board 81 Connection device 82,83 terminal 84 Screw 85 hole 86 Nut 87 Probe 88 terminal

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification number Internal reference number FI Technical indication H01L 23/32 A 7220-4M H01R 33/76 9057-5E

Claims (1)

[Claims] 1. I mounted on a surface mounting printed circuit board
A first terminal having the same arrangement as the mounting pattern on the surface mounting printed circuit board,
A first terminal composed of two terminals of a second terminal connected to the terminal of
Part, a third terminal connectable to an IC mounted on the mounting pattern, and a fourth terminal connectable to the second terminal and connected to the third terminal. An IC socket having a second part and a component.