JPH04106890A - Surface-mount ic socket device - Google Patents

Abstract

PURPOSE:To stably support surface-mount ICs and the device on a substrate, and improve reliability of verification and analysis to surface-mount ICs, by electrically connecting a lead part of the surface-mount ICs with a corresponding pad part via an IC socket and an adapter. CONSTITUTION:An adapter 6 is attached onto a printed-circuit board 1 by soldering a pattern 6 to a pad part 2, nextly an IC socket 4 is attached to the adapter 6 by inserting a socket lead part 4d into an adapter socket part 6b. After that, a surface-mount IC 3 is placed on a base 4a in such a war that its lead part overlaps respectively with corresponding pins 4e, then a lid 4b is closed to lock it. A lead part of the surface-mount IC 3 is electrically connected respectively with the corresponding pad part 2 via a pin 4e, a socket lead tart 4d, an adapter socket 6b, and a pattern 6a. Consequently, the surface- mount IC 3 and the device itself can be stably supported onto the substrate 1, and reliability of verification and analysis to a surface-mount IC 3 can be improved.

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention is applicable to surface-mounted ICs mounted on a board, for example, when verifying and analyzing the functions and operations of the surface-mounted IC mounted on the board. Board and surface mount IC for removable mounting.
This invention relates to a socket device for a surface-mounted IC that is interposed between the two.

[Prior Art] FIG. 2 is a side view showing an example of a state in which a surface-mounted IC is mounted on a board.

In the figure, code (1) is a printed wiring board, which is a substrate;
(2) is a soldering pad provided on the printed wiring board (1), and (3) is two surface-mounted RCs soldered and mounted on the pad (2).

When verifying and analyzing the functions and operations of the surface-mounted IC (3) in the mounted state as described above, the surface-mounted IC (3) may be attached to and removed from the printed wiring board (1) many times. At this time, when the surface mount IC (3) is directly attached/detached to/from the printed wiring board (1), the heat from the soldering iron causes the pad portion (2) to
There is a risk of peeling off. For this reason, surface mount ICs (3) and printed wiring boards (1) are usually subject to verification and analysis.
An IC socket as shown below is interposed between the two.

Figure 3 shows one surface mount ■c (3>) in Figure 2 for conventional I
It is a side view which shows the state mounted on the printed wiring board (1) via C socket I7.

In the figure, (4) is an IC socket that is connected to the pad part (2) via a large number of connection wires (5), and this ■C socket (4) is for surface-mounted IC<3. A base (4a) to which the base (4a) is attached, a lid <4b) attached to the base (4a) so as to be openable and closable, a locking part (4c) that locks the lid (4b) in the closed position, and a locking part (4c) protruding from the bottom surface of the base (4a). and a socket lead part (4d) to which a connection lead wire (5) is connected.

A conventional IC socket (4) as shown below connects the connecting lead wire (5) to the pad part (2) and the socket lead part (4d).
It is mounted on the printed wiring board <1) by soldering to and electrically connecting each socket lead part (4d) to the corresponding pad part (2). In this state, set the surface mount ■c (3) on the base (4a), and close and lock 11 (4b). Thereby, the surface mount IC (3) is removably mounted on the printed wiring board (1) via the IC socket (4). That is,
The lead portions of the mounted surface-mounted IC (3) are electrically connected to the corresponding pad portions (2) via socket lead portions (4d) and connection lead wires (5), respectively.

After this, we will verify the functionality and operation of the surface mount IC (3).
Analysis is performed.

By the way, the above IC socket (4) has a pad part (2).
) It is difficult to provide the socket lead part (4d) so as to correspond directly to the position of the connection lead wire. (5) is used to attach it to the printed wiring board (1).

[Problems to be Solved by the Invention] In the conventional IC socket refined as described above, since it is attached to the printed wiring board (1) via the connection lead wire (5), the supporting state is unstable,
In addition, noise may enter from the connection lead a (5), and the timing of the signal may be delayed due to the resistance of the connection lead (5), reducing the reliability of verification and analysis of the surface mount IC (3). There were problems such as the fact that soldering the lead wires (5) required a considerable amount of effort.

This invention was made with the aim of solving the above-mentioned problems, and it not only makes it possible to stably support surface-mounted ICs and devices themselves on a substrate, but also improves the reliability of verification and analysis of surface-mounted ICs. It is an object of the present invention to provide a socket device for a surface-mounted IC that can improve the performance of the IC and can be easily attached to a board.

[Means for Solving the Problems] A socket device for a surface-mounted IC according to the present invention includes a pattern soldered to a pad portion on a board, and an adapter socket portion electrically connected to this pattern. The adapter is interposed between the IC socket and the board.

[Operation] In the present invention, by mounting a surface-mounted IC on an IC socket, the lead portion of the surface-mounted IC is electrically connected to the corresponding pad portion via the IC socket and the adapter.

[Example] Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is an exploded perspective view showing a surface mount IC socket device according to an embodiment of the present invention, and the same or equivalent parts as in FIG.

In the figure, code (6) indicates printed wiring board (1) and IC.
It is an adapter interposed between the socket (4),
The lower surface of the adapter (6) is provided with a pattern (6a) that corresponds to the pad (2) and is soldered to the pad (2). Moreover, each socket lead part (4d) is inserted into the upper surface of the adapter (6) and electrically connected to it, and the adapter socket part (6b) is electrically connected to the corresponding part of the pattern (6a).
) is provided. Furthermore, the surface mount IC of this example
IC socket (4) and adapter (6)
).

Note that (4e) are arranged in multiple stages on the upper surface of the base (4a), and are electrically connected to the lead part of the corresponding surface mount IC (3) by pressure contact, and are also connected to the corresponding socket lead part (4d). A bin that is electrically connected.

When mounting a surface mount IC < 3) on a printed wiring board (1) via the socket device for surface mount device C configured as described above, first place the pattern (6a) on the pad portion (2). The adapter (6) is attached onto the printed wiring board (1) by soldering.

Next, the IC socket (4) is attached to the adapter (5) by inserting the socket lead part (4d) into the adapter socket part (6b).

Thereafter, the surface-mounted IC (3) is placed on the base (4a) so that its lead portions overlap the corresponding bins (4e). Then, close the lid (4b) and sip. As a result, the lead part of the surface mount IC < 3) is placed in the bin (4e).
, socket lead part (4d), adapter socket part <6
b) and the pattern (6a), and are electrically connected to the corresponding pad portions (2), respectively.

After this, a verification analysis is performed on the functional operation of the surface mount IC (3) in its mounted state. At this time, surface mount IC (3
) can be easily attached to and detached from the socket (4) any number of times by simply opening and closing the cover (4b) as in the conventional case.

Such a device for surface real estate device C connects an IC socket (4) to a printed wiring board (via an adapter (6)).
1) Since it is mounted on the top, the support state of the surface mount IC (3) and the device itself is stable.

In addition, since the conventional connection lead wire (5) is not required, noise is reduced and signal timing delays are also prevented, improving the reliability of verification and analysis of surface-mounted ICs (3).Furthermore, , the soldering pattern (
6a) and the pad portion (2), it is easy to attach it to the printed wiring board (1). In addition, the area of the pattern (6a) of the adapter (6) is the minimum necessary size and is smaller than the base (4a), so it does not come into contact with the adjacent surface mount IC (3). Needless to say.

Note that the shapes of the IC socket (4) and the adapter (6) are not limited to those of the above embodiments. In addition, in the above embodiment, the IC socket T-(4) was shown to hold the surface-mounted IC (3) by locking the lid (4b), but if the surface-mounted IC<3 can be attached and detached, However, it may be attached using other methods.

Furthermore, in the above embodiment, the case where the socket device for surface mount IC (3) is used to verify and analyze the function and operation of the surface mount IC (3) in the mounted state has been described, but in other applications, surface mount IC (3) It goes without saying that the apparatus of the present invention can also be applied to cases where 3) is temporarily mounted on a board.

[Effects of the Invention] As explained above, the surface mount IC socket device of the present invention has a pattern soldered to a pad portion on a board and an adapter socket portion electrically connected to this pattern. Since the adapter is interposed between the IC socket and the board, surface-mounted ICs and devices themselves can be stably supported on the board, and the connection lead wires that were conventionally required can be eliminated. This reduces noise and prevents signal timing delays.As a result, the reliability of verification analysis for surface-mounted ICs can be improved, and mounting on the board can be simplified. It has the effect of

[Brief explanation of drawings]

Fig. 1 is an exploded perspective view showing an embodiment of the present invention, Fig. 2 is a side view showing a surface mount IC mounted on a normal printed wiring board, and Fig. 3 is an example of a conventional IC socket. FIG. In the figure, (1) is a printed wiring board (substrate), (2)
is the pad part, (3) is the surface mount IC3, (4) is the IC socket, (4d) is the socket lead part, (6) is the adapter,
(6a) is a pattern, and (6b) is an adapter socket part. In each figure, the same reference numerals indicate the same or corresponding parts.

Claims (1)

[Claims] An adapter having a pattern to be soldered to a pad part on a board, an adapter socket part electrically connected to this pattern, and a socket lead inserted into the adapter socket part and electrically connected. and an IC socket into which a surface-mounted IC is removably mounted, and by mounting the surface-mounted IC in the IC socket, the lead part of the surface-mounted IC is connected to the surface-mounted IC.
A socket device for a surface-mounted IC, characterized in that it is electrically connected to a corresponding pad portion via a C socket and the adapter.