JPH0650352U - IC socket with built-in delay board - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide an IC socket with a built-in delay board that does not require an external circuit when delaying between pins of a device and can easily perform a delay between desired pins with good work efficiency. thing. [Structure] The IC socket with built-in delay board includes a fixed plate 3,
It is composed of a socket pin 4, a delay substrate 5, an insulating plate 24 and an IC socket 8. The delay board 5 is a delay board having a built-in delay circuit used for giving a constant delay between desired pins of the mounted device. The delay board 5 has a shape that is substantially the same as the shape of the IC socket 8 to be attached, and the hole 1 corresponds to the pin of the device to be mounted.
5 is drilled. On the delay board, for example, output pins between the pins to be delayed and holes 15 for input pins are provided with a delay circuit using a capacitor or the like.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an IC socket, and more specifically, to an IC socket with a built-in delay board that includes a delay circuit board that delays between terminals of a device mounted in the IC socket.

[0002]

[Prior art]

 In the case of an electronic device, for example, it may be necessary to attach a program ROM, the contents of which may be changed later, or a processor, which may be added or changed, to the printed circuit board. In such a case, if soldering is directly performed on the printed circuit board, it is not possible to flexibly deal with replacement, addition or change. Therefore, by connecting such a device to the printed circuit board through the IC socket, it is possible to easily remove the device. It is designed so that it can be mounted and can flexibly respond to various applications.

Further, since the device can be easily removed by using the IC socket, it is also used when measuring the same type of device. When measuring a device, data may be latched by delaying a predetermined pin (terminal) of the device under test mounted in the IC socket. FIG. 12 shows a delay circuit between pins of a device mounted on an IC socket 8 in such a conventional technique. FIG. 12 (a) shows a delay by a delay line 7 and FIG. 12 (b). Shows the case where the delay circuit 18 delays.

Generally, the delay due to the wire rod is 5 ns / m. Therefore, for example, if the delay part of the device under test 16 as shown in FIG. 12 (a) is shown in FIG. 13 (a), the clock of the output pin (Pin 1 in the figure) is delayed by 5 ns and the input pin is delayed. When inputting to (Pin 2 in the figure) and latching other data in the IC to be measured, a wire of about 1 m must be wired between Pin 1 and Pin 2. A timing chart of this is shown in FIG. Similarly, when the delay circuit 18 is used, it is necessary to secure a corresponding space on the printed board 28.

[0005]

[Problems to be solved by the device]

 However, in such a conventional technique, in addition to the IC socket 8 as shown in FIG. 11, it is necessary to secure a space for delay on the printed circuit board 28. Moreover, it is flexible when changing the delay pin. Couldn't respond to. As described above, in the conventional technique, high-density mounting of the printed circuit board 28 is hindered, and workability is poor when wiring is redone.

The present invention solves the above-mentioned drawbacks of the prior art, eliminates the need for an external circuit when delaying between pins of a device, and easily delays between desired pins. Delay with good work efficiency. It is an object to provide an IC socket with a built-in substrate.

[0007]

[Means for Solving the Problems]

 In order to solve the above problems, the present invention has an IC socket 8 to which a device 16 is removably mounted. An IC socket 8 has a delay circuit 5 for delaying a desired terminal of the device 16 and a delay board 5 preliminarily arranged. The device 16 is detachably attached to the IC socket 8 via the delay substrate 5.

[0008]

[Action]

 According to the present invention, when delaying between desired terminals of the device 16, the device 16 is mounted on the IC socket 18 via the delay board 5 that matches the delay. As a result, a delay circuit is inserted between the terminals that perform the delay, and a predetermined time delay occurs between these terminals.

[0009]

【Example】

 An embodiment of an IC socket with a built-in delay substrate according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a block diagram showing an embodiment of an IC socket with a built-in delay board according to the present invention. As shown in this figure, the IC socket with built-in delay board of this embodiment is composed of a fixed plate 3, socket pins 4, a delay board 5, an insulating plate 24 and an IC socket 8.

The delay board 5 is a delay board having a built-in delay circuit used to give a fixed delay between desired pins of the mounted device. Further, as is apparent from the perspective view shown in FIG. 2, the IC socket 8 has substantially the same shape as that of the IC socket 8 to be attached, and the holes 15 are formed corresponding to the pins of the device to be attached. FIG. 3 shows a top view of this delay board. As shown in FIG. 3, for example, the output pin (pin 1) between the pins to be delayed and the hole 15 for the input pin (pin 2) Connects the delay circuit 6 using a capacitor 30 or the like. The delay substrate 5 has a power supply layer (or GND layer) 29 and serves as a power supply (or GND) for the delay circuit 6. The power supply (or GND) layer is connected to the pin of the device or is wired from the printed circuit board by a lead wire.

FIG. 4 is a circuit diagram showing an example of the delay circuit 6 shown in FIG. In this way, the delay circuit 6 is formed using the capacitor C and the like. When pin 1 is the output pin and pin 2 is the input pin, capacitor C charges the voltage from pin 1 and outputs it to pin 2 as the waveform shown in FIG. The delay time is from the point where the capacitor C starts charging (point) to the point (point) where the output reaches the voltage which is the operating point. Therefore, the delay time can be changed by changing the capacitance of the capacitor C or wiring a circuit using a resistor or the like between the pins.

FIG. 6 is a partial cross-sectional perspective view of the hole 15 formed in the delay substrate 5. As shown in FIG. 6, the hole 15 has a contact surface 7 as shown in FIG. 6A when the delay circuit is wired or when the power supply (or GND) is brought from the device pin. In other cases, it does not have a contact surface as shown in FIG. 6 (b).

FIG. 7 is a perspective view of the fixing plate 3 for fixing the delay board 5 and the insulating plate 24 to the IC socket 8. As shown in FIG. 7, the fixing plate 3 is provided with an arm 10. The arm 10 is processed into an L-shape, matches the bottom surface of the mold portion 1 of the IC socket 8 as shown in FIG. 9, and fixes the whole.

FIG. 8 is a view for explaining that the hole of the fixing plate 3 is recessed, and when the whole is fixed as shown in FIG. 9, the upper portion of the socket pin 4 is housed. FIG. 9 is a cross-sectional view of FIG. 10 when the fixing plate 3 is used to fix all the components. Reference numeral 28 in FIG. 9 is a printed circuit board on which the socket pins 2 of the IC socket 8 are wired. As shown in FIG. 9, when the socket pin 4 contacts the contact surface 7 of the delay substrate 5, a certain amount of delay is provided between the pins to be delayed (between pin 1 and pin 2 in this figure).

The IC socket 8 is used for transmitting signals between the printed circuit board and the socket pins 4. This is because the socket pins 4 cannot be connected to the printed board by soldering or the like. The insulating plate 24 is used to insulate the delay circuit 6 and the IC socket. In the embodiments shown in these drawings, the PGA (pin grid array) type is described as an example of the shape of the IC socket, but of course the present invention is not limited to this shape and the DIP (dual・ Inline package) type is also acceptable.

[0017]

[Effect of device]

 As described above, according to the IC socket with a built-in delay board of the present invention, the delay board 5 in which the delay circuit 6 is wired is built in the IC socket 8 to give a certain amount of delay between the pins of the printed circuit board. It is not necessary to secure a space for mounting a delay circuit or a coaxial delay line on the 28. Further, when changing the delay pin, it is only necessary to change the delay substrate 5, so that it is not necessary to rewire or remake the base substrate. Furthermore, since an external delay circuit is eliminated, high-density mounting can be realized.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing an embodiment of an IC socket with a built-in delay substrate according to the present invention.

2 is a perspective view of a delay board in the IC socket with a built-in delay board of FIG. 1. FIG.

FIG. 3 is a top view of the delay substrate shown in FIG.

FIG. 4 is a diagram of an example of a delay circuit.

FIG. 5 is a waveform diagram of a delay circuit.

FIG. 6 is an explanatory view of a hole 15 in the delay board of FIG.

FIG. 7 is an explanatory diagram of a fixing plate 3.

8 is an explanatory view of a hole 11 of the fixing plate 3 of FIG.

FIG. 9 is a partial sectional view of an embodiment of an IC socket with a built-in delay substrate according to the present invention.

FIG. 10 is a side view of an embodiment of an IC socket with a built-in delay substrate according to the present invention.

FIG. 11 is a perspective view of a conventional IC socket.

FIG. 12 is an explanatory diagram of a delay circuit in the related art.

13A and 13B are an explanatory view (a) and a timing chart (b) of the conventional delay circuit.

[Explanation of symbols]

 3 fixing plate 4 socket pin 5 delay board 6 delay circuit 7 contact surface 8 IC socket 15 hole

Claims (1)

[Scope of utility model registration request] 1. A device (16) to which a device (16) is detachably mounted
Delay circuit (6) for delaying between desired terminals of device (16) in C socket (8)
Has a delay board (5) arranged in advance, and the device (16) has an IC socket (8) through the delay board (5).
An IC socket with a built-in delay board, which is detachably attached to the IC socket.