JPH0364987A - Electronic component fitting device - Google Patents
Electronic component fitting deviceInfo
- Publication number
- JPH0364987A JPH0364987A JP20187889A JP20187889A JPH0364987A JP H0364987 A JPH0364987 A JP H0364987A JP 20187889 A JP20187889 A JP 20187889A JP 20187889 A JP20187889 A JP 20187889A JP H0364987 A JPH0364987 A JP H0364987A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- pin
- circuit board
- printed circuit
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は小型化を必要とするカメラ一体型ＶＴＲなどに
使用される電子部品取付装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component mounting device used in a camera-integrated VTR, etc., which requires miniaturization.
従来の技術
近年、機器の小型・軽Ｉ化に伴なって部品の小型化・両
面リフローなどにより電子部品の高密度実装がなされて
いる。第５図〜第８図に従来の電子部品取付装置の一例
を示しており、以下図面に基づき説明する。BACKGROUND OF THE INVENTION In recent years, as equipment has become smaller and lighter, electronic components have been mounted in high density by miniaturizing components and double-sided reflow. An example of a conventional electronic component mounting device is shown in FIGS. 5 to 8, and will be explained below based on the drawings.
図において、１はケース２の内部に２枚のガラス超音波
遅延線（図示せず〉を収納してなる電子部品で、平面形
状が長方形を呈し、その長手方向両端下面に信号伝達の
ためとプリント基板３に対する保持のためにピン４が突
設されている。この電子部品１はプリント基板３上に取
り付けられ、そのとき前記ピン４をプリント基板３の孔
に貫通させて半田付けしている。なお、プリント基板３
の下面にはハイブリッドＩＣ５が取り付けられる。In the figure, reference numeral 1 denotes an electronic component consisting of two glass ultrasonic delay lines (not shown) housed inside a case 2, which has a rectangular planar shape, and has wires for signal transmission on the bottom surface of both longitudinal ends. A pin 4 is provided to protrude to hold the electronic component 1 on the printed circuit board 3. At this time, the electronic component 1 is mounted on the printed circuit board 3, and the pin 4 is passed through a hole in the printed circuit board 3 and soldered. .In addition, the printed circuit board 3
A hybrid IC 5 is attached to the bottom surface of the .
発明が解決しようとする課題
しかしながら、上記構成ではプリント基板３に電子部品
１およびハイブリッドＩＣ５を実装するのに、第８図か
らもわかるようにオーバーラツプ部が発生して実装時の
作業性が非常に悪いという問題があった。Problems to be Solved by the Invention However, with the above configuration, when the electronic component 1 and the hybrid IC 5 are mounted on the printed circuit board 3, as can be seen from FIG. There was a problem with it being bad.
本発明はこのような課題を解決するもので、電子部品実
装時の作業性を向上させることを目的とするものである
。The present invention solves these problems and aims to improve workability when mounting electronic components.
課題を解決するための手段
この課題を解決するために本発明は、プリント基板の上
面および下面にそれぞれ電子部品を互いにオーバーラツ
プするように実装するに際２シ、−方の電子部品には長
手方向両端下面に一端側では下向きに真直ぐなピンを、
他端側ではＬ字形に折曲され下面が前記ピンの下端面よ
りも上方に位置するピンを設け、この電子部品の前記り
字形のピンを他方の電子部品とのオーバーラツプ部分に
位置させてプリント基板に半田付けするようにしたもの
である。Means for Solving the Problems In order to solve the problems, the present invention provides that when electronic components are mounted on the upper and lower surfaces of a printed circuit board so as to overlap with each other, the electronic components on the - side are mounted in the longitudinal direction. One end has a straight pin pointing downward on the bottom surface of both ends,
On the other end side, a pin is bent into an L shape and the lower surface is located above the lower end surface of the pin, and the electronic component is printed by positioning the L-shaped pin in the overlapping part with the other electronic component. It is designed to be soldered to the board.
作用
この構成により、他方の電子部品とオーバーラツプする
部分において一方の電子部品のＬ字形のピンをプリント
基板に当てがって半田付けすることにより、一方の電子
部品の実装が容易に行なえる。Function: With this configuration, one electronic component can be easily mounted by applying the L-shaped pin of one electronic component to the printed circuit board and soldering it at the portion overlapping with the other electronic component.
実施例
以下、本発明の一実施例について、図面（第１図〜第４
図）に基づいて説明する。なお図中、前記従来例と同一
部材は同一符号で示し、その詳細説明は省略する。EXAMPLE Hereinafter, an example of the present invention will be explained using the drawings (Figs. 1 to 4).
The explanation will be based on Figure). In the drawings, the same members as those in the conventional example are indicated by the same reference numerals, and detailed explanation thereof will be omitted.
図において、ケース２の内部に２枚のガラス超音波遅延
線を収納してなる電子部品１の長平方向両端下面には一
端側では下向きに真直ぐなピン４ａが、他端側では先端
が電子部品１の一関方に突出するようにＬ字形に折曲さ
れ下面が前記ピン４ａの下端面よりも上方に位置するピ
ン４ｂが設けられている。In the figure, on the lower surface of both ends in the long plane direction of an electronic component 1, which is made up of two glass ultrasonic delay lines housed inside a case 2, there is a pin 4a that is straight downward at one end, and a pin 4a whose tip is the electronic component at the other end. A pin 4b is provided which is bent into an L-shape so as to protrude in one direction of the pin 1, and whose lower surface is located above the lower end surface of the pin 4a.
このように構成された電子部品１はプリント基板３に対
し第３図および第４図に示す状態で取り付けられる。す
なわち、プリント基板３の下面にハイブリッドＩＣ５を
半田付けにて取り付けた後で、前記電子部品１の取り付
けがなされるのであるが、そのとき、ハイブリッドＩＣ
５とオーバーラツプする部分においては電子部品１の前
記り字形のピン４ｂをプリント基板３の上面に当接させ
、また前記一端側のピン４ａはプリント基板３の孔を貫
通させ、これらピン４ａ、４ｂをプリント基板３に対し
半田付けすることにより電子部品１の取り付けがなされ
る。The electronic component 1 constructed in this manner is attached to the printed circuit board 3 in the state shown in FIGS. 3 and 4. That is, after the hybrid IC 5 is attached to the bottom surface of the printed circuit board 3 by soldering, the electronic component 1 is attached.
5, the above-mentioned bent pin 4b of the electronic component 1 is brought into contact with the upper surface of the printed circuit board 3, and the pin 4a on the one end side is passed through a hole in the printed circuit board 3, and these pins 4a, 4b are brought into contact with the upper surface of the printed circuit board 3. The electronic component 1 is attached by soldering to the printed circuit board 3.
以上のように本実施例によれば、ハイブリッドＩＣ５と
オーバーラツプする部分において電子部品ｌのＬ字形の
ピン４ｂをプリント基板３上に当てがって半田付けする
ことにより、電子部品１の実装が容易に行なえる。As described above, according to this embodiment, mounting of the electronic component 1 is facilitated by applying and soldering the L-shaped pin 4b of the electronic component 1 onto the printed circuit board 3 at the portion overlapping with the hybrid IC 5. can be done.
発明の効果
以上のように本発明によれば、プリント基板の上面およ
び下面にそれぞれ電子部品を互いにオーバーラツプする
ように実装するに際し、作業性の向上を図り、電子部品
の高密度実装に寄与することができる。Effects of the Invention As described above, according to the present invention, it is possible to improve workability when mounting electronic components on the top and bottom surfaces of a printed circuit board so as to overlap each other, thereby contributing to high-density mounting of electronic components. I can do it.
第１図〜第４図は本発明の一実胸例を示すもので、第１
図は電子部品の側面図、第２図は同正面図、第３図は電
子部品実装状態を示す側面図、第４図は同平面図、第５
図〜第８図は従来例を示すもので、第５図は電子部品の
側面図、第６図は同ｉ面図、第７図は電子部品実装状態
を示す側面図、第８図は同平面図である。
１・・・電子部品、２・・・ケース、３・・・プリント
基板、４ ａ ＋ ４ ｂ ・□・ピン、５・・・ハイ
ブリッドＩＣ。Figures 1 to 4 show an example of the present invention.
The figure is a side view of the electronic component, FIG. 2 is a front view of the same, FIG. 3 is a side view showing the electronic component mounted state, FIG.
Figures to Figures 8 show conventional examples. Figure 5 is a side view of the electronic component, Figure 6 is an i-side view of the electronic component, Figure 7 is a side view showing the state in which the electronic component is mounted, and Figure 8 is the same. FIG. DESCRIPTION OF SYMBOLS 1...Electronic component, 2...Case, 3...Printed circuit board, 4a+4b・□・pin, 5...Hybrid IC.
Claims (1)
品を互いにオーバーラップするように実装するに際し、
一方の電子部品には長手方向両端下面に一端側では下向
きに真直ぐなピンを、他端側ではＬ字形に折曲され下面
が前記ピンの下端面よりも上方に位置するピンを設け、
この電子部品の前記Ｌ字形のピンを他方の電子部品との
オーバーラップ部分に位置させてプリント基板に半田付
けするようにした電子部品取付装置。1. When mounting electronic components on the top and bottom surfaces of a printed circuit board so that they overlap each other,
One electronic component is provided with a pin that is straight downward at one end on the lower surface of both longitudinal ends, and a pin that is bent into an L shape and whose lower surface is located above the lower end surface of the pin at the other end,
An electronic component mounting device in which the L-shaped pin of this electronic component is positioned in an overlapping portion with another electronic component and soldered to a printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20187889A JPH0364987A (en) | 1989-08-03 | 1989-08-03 | Electronic component fitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20187889A JPH0364987A (en) | 1989-08-03 | 1989-08-03 | Electronic component fitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0364987A true JPH0364987A (en) | 1991-03-20 |
Family
ID=16448361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20187889A Pending JPH0364987A (en) | 1989-08-03 | 1989-08-03 | Electronic component fitting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0364987A (en) |
-
1989
- 1989-08-03 JP JP20187889A patent/JPH0364987A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6246016B1 (en) | Edge-mountable integrated circuit package and method of attaching the same to a printed wiring board | |
| JPH05226803A (en) | Mounting circuit board | |
| JPH0364987A (en) | Electronic component fitting device | |
| JPH02301182A (en) | Printed circuit board for flat mounting structure | |
| JPH02134890A (en) | Circuit element mounting board | |
| JPH03225890A (en) | Printed wiring board | |
| JP2581397B2 (en) | Mounting / connection board for multi-pin circuit elements | |
| JPH0355896A (en) | Integrated circuit device | |
| JPH051098Y2 (en) | ||
| JPH04105390A (en) | Substrate mechanism | |
| JPS6097656A (en) | Method for mounting hybrid integrated circuit | |
| JPS60225324A (en) | Small-sized relay terminal | |
| JPS6148986A (en) | Both-side printed circuit board | |
| JPS631093A (en) | Electronic parts mounting board device | |
| JPS63157076A (en) | Chip test post | |
| JPS5863195A (en) | Method of connecting pattern | |
| JPS5828371Y2 (en) | circuit connection element | |
| JPH08321665A (en) | Printed board | |
| JPH01273384A (en) | Integrated circuit device | |
| JPH07326705A (en) | Electronic parts and packaging method using the same | |
| JPH02265177A (en) | Connection construction of lead terminal | |
| JPS62243393A (en) | Printed board | |
| JPS62120100A (en) | Method of mounting chip parts on printed wiring board | |
| JPH05166557A (en) | Connector | |
| JPH02161792A (en) | Printed-circuit board connection device |