JPH0355896A - Integrated circuit device - Google Patents

Abstract

PURPOSE:To improve flexibility of a circuit configuration with small size and soldering strength of a mother board by mounting a platelike elastic material for holding two module boards therebetween at a predetermined distance. CONSTITUTION:Two module boards 1, 1' in which components are mounted on both side surfaces are connected at one end with module board connecting wiring materials, and so bent from the part of a wiring material 3 that components mounted on the opposed surfaces are not brought into contact with each other. Platelike elastic materials 2, 2' are mounted, and secured by soldering. Reference numeral 4 denotes a terminal. Since the two boards are so held at a distance that the components mounted on the opposed surfaces are not brought into contact with each other, the boards mounted with the components on both side surfaces can be used, the boards can be reduced in size, and the flexibility of the circuit configuration can be enhanced. Since the two boards are connected with module connecting wiring materials and platelike elastic materials, soldering positions of a mother board are increased twice as many as a conventional one, and soldering strength to the mother board is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to integrated circuit devices used in electrical equipment.

(D (2) Prior Art Conventionally, integrated circuit devices used in certain types of electronic equipment have a structure as shown in the perspective view of FIG. 5(a). Two module boards with electronic components mounted on the printed circuit board shown are connected by a flexible board 11. 4 is a terminal section for directly inserting into the motherboard for electrical connection, and 13 is a mounted module board. The electronic component 12 is a conductor for electrically connecting the two module boards 10 and 10' printed on the flexible board 11. Figs. 5(b) and 5(c)
are the plan view and front view, respectively. FIG. 6 is a diagram showing a conventional integrated circuit device inserted into a motherboard.

In other words, the two module boards 10 and 10' are placed on the flexible board 11 so that the surfaces opposite to the component mounting surfaces are aligned.
The terminal portion 4 is inserted into the slit portion 14, 14' of the motherboard 5. Thereafter, the terminal portion 4 of the integrated circuit device and the motherboard 5 are electrically connected by hanging. Here, the two module boards 10 and 10' are pressed against the outside of the slit part 14 and 14' in the spreading direction due to the elasticity of the flexible board 11, and the terminal part 4 and the mother board 5 are fixed in close proximity. Therefore, the integrated circuit device and the motherboard can be easily and reliably soldered together. FIG. 6(b) is a cross-sectional view of the integrated circuit device inserted into the motherboard slit and connected by soldering, where 5 is the motherboard and 7, 7' are solders.

Further, there is another conventional example as shown in FIG.

FIG. 7 is an example of an integrated circuit device using a conventional double-sided printed board, and FIG. 7(a) shows a perspective view of the conventional integrated circuit device and its mounting method on a motherboard. . 1
5 is a double-sided printed circuit board, 16 is a mounted electronic component, . Reference numeral 4 denotes a terminal portion for directly inserting into the motherboard for electrical connection. Here, the terminal section indicated by 4 is inserted into the slit section 17 of the motherboard 5, and then connected to the terminal section 4 of the integrated device.
The motherboard 5 is electrically connected by soldering. FIG. 7(b) is a sectional view of the conventional integrated circuit device shown in FIG. 7(a) inserted into the motherboard slit and soldered. It's solder.

Problems to be Solved by the Invention In the conventional structure shown in FIGS. 5 and 6, two module boards are mounted on the motherboard with their component mounting surfaces facing opposite sides, so one side of the module board is in a flat state. It was necessary to keep it. Because of this, it is impossible to use a module board on which components are mounted on both sides, making it impossible to miniaturize the integrated circuit device and causing problems such as a lack of flexibility in the circuit configuration. Further, in the conventional example shown in FIG. 7, when the integrated circuit device is inserted into the slit portion of the mother board, the integrated circuit device is mounted at an angle with respect to the mother board. Another problem was that the soldering strength with the motherboard was low.

The present invention solves these problems and provides an integrated circuit device that is small in size, has a highly flexible circuit structure, and has high soldering strength to a motherboard.

Means for Solving the Problems In order to achieve this object, the present invention provides a terminal section that is directly inserted into a motherboard and for making an electrical connection with the motherboard, and a terminal section that is disposed on the opposite side of the terminal section within the same plane. Two individual module boards provided with electrodes for connection with other board electrodes, a bendable wiring material that electrically connects the electrodes of these module boards, and a gap between the two module boards. and a plate-shaped elastic material to maintain the distance between the two.

According to the present invention, the plate-like elastic material attached between the two module substrates keeps the two module substrates at a distance from each other so that the components mounted on their opposing surfaces do not come into contact with each other. This makes it possible to use a module board with components mounted on both sides, making it possible to reduce the size of the module board and to increase the flexibility of the circuit configuration.

Furthermore, since the two module boards are connected with the wiring material for module connection and the plate-like elastic material, after the two module boards are mounted on the mother board, it becomes an integrated circuit device.
There are twice as many places to solder to the motherboard than in the past, improving the strength of soldering to the motherboard. As a result of the above, it is possible to realize an integrated circuit device that is small in size, has a highly flexible circuit configuration, and has high soldering strength with two motherboards.

Embodiment FIG. 1 is a diagram showing an embodiment of the present invention, in which two sheets of elastic plate material 2, 2' are used to maintain the distance between two module boards 1, 1' on which components are mounted on both sides. FIG. 3 is a diagram showing an example in which a phosphor bronze plate is used and a tin-plated mild steel wire is used as the wiring material 3. In this case, the structure is such that the phosphor bronze plate, which is a distance maintaining material, can also be used for electrical connection. 1(a) and 1(b) are respectively a front view and a side view of an embodiment of an integrated circuit device according to the present invention, and FIG. 1(C) is a plate-shaped elastic material made of phosphor bronze plate used in this embodiment. FIG. 1(d) is an explanatory diagram of a state in which the elastic material of FIG. 1(C) is attached between two module substrates. The two mosule boards 1 and 1' on which double-sided components are mounted are connected at one end with a wiring material 3 for connecting the module board, so that the components mounted on the opposing sides face each other at a distance that does not touch them. The wiring material 3 is bent and formed.

After this, as shown in FIG. 1(d), the plate-shaped elastic material 2,
2' is attached and fixed by soldering. 4
is the terminal part.

FIG. 2(a) and FIG. 3(a) are cross-sectional views of the integrated circuit device according to the present invention mounted on the motherboard 5, and FIG. 2(b) and FIG. 3(b) are respectively Slit portion 6 of mother board 5 when mounted on mother board 5.
6' and 8.8'.

Moreover, 7 and 7' are solder, and module boards 1 and 1
Terminal part 4 of 6' is connected to slit part 6.6'. 8 and 8', and are connected and fixed with solders 7 and 7'.

FIG. 4 shows a second embodiment according to the present invention.
It has basically the same structure as the embodiment shown in the figure. In this embodiment, an elastic material 9 is attached to the opposing surfaces of the module substrates 1, 1' instead of the plate-like elastic materials 2, 2' in the above embodiment, so that the distance between the two module substrates 1, 1' is constant. It is designed to keep a distance. Figure 4 (
a) is a developed view from the bottom showing an example in which one elastic material 9 is attached between module boards 1 and 1', FIG. 4(b) is a side view of FIG. 4(a), and FIG. 4(c) , (d) are cross-sectional views showing integrated circuit devices according to the present invention mounted on a motherboard 5 when the terminal portions 4 of the module substrates 1 and 1' are on one side and on both sides, respectively.

Effects of the Invention As described above, according to the present invention, by attaching a plate-shaped elastic material that maintains a constant distance between two module boards,
It is possible to use a Mogicor board with components mounted on both sides, and it is possible to provide an integrated circuit device that is small, has high flexibility in circuit configuration, and has high soldering strength to the mother board.

[Brief explanation of drawings]

1(a) to 1(b) are a front view, a side view, a perspective view of essential parts, and an overall perspective view of an integrated circuit device according to an embodiment of the present invention, and FIGS. 2(a) and 2(b) are and Figure 3(a)
, (b) are respectively a sectional view and a perspective view of an integrated circuit device according to an embodiment of the present invention mounted on a mother board, and FIGS. A developed view, a side view, and a sectional view of the integrated circuit device mounted on the motherboard, FIGS. 5(a), (b), and (c).
are a perspective view, a plan view and a side view showing a conventional example, and FIG.
), (b) is a perspective view and a cross-sectional view of a conventional integrated circuit device mounted on a motherboard, and FIG. 7(a),
(b) is a perspective view and a sectional view of another conventional integrated circuit device mounted on a motherboard. 1, 1'...Double-sided component mounting module board, 2
, 2'... Plate elastic material, 3... Wiring material for module connection, 4... Terminal portion, 9...
...Elastic material.

Claims (2)

[Claims] (1) Two module boards, each having a terminal section that is directly inserted into the motherboard to make an electrical connection with the motherboard, and an electrode on the opposite side of the terminal section for making a connection with another board electrode. an integrated circuit comprising: a bendable wiring material that electrically connects the electrodes of the module substrate; and a plate-like elastic material that maintains a constant distance between the two module substrates. Device. (2) An integrated circuit device characterized in that one or more elastic materials are attached to opposing surfaces of the two module substrates in place of the plate-like elastic material according to claim 1.