JPH0322931Y2 - - Google Patents

Description

[Detailed explanation of the invention] [Summary] A modified wire pull-out part is attached to a bonding pad of a printed circuit board to which mounted parts (hereinafter explained as chip parts) mounted on the board are connected. The pattern is modified by connecting a modified wire to the drawn-out part, thereby eliminating the need for a modified wire bonding pad and making it possible to easily modify the pattern.

[Industrial application field]

TECHNICAL FIELD The present invention relates to a high-density multilayer printed circuit board, and more particularly, to drawing out modified wires when modifying a pattern.

Patterns of printed circuit boards may be modified due to design changes or the like after manufacture, and in this case, conductor patterns that are no longer needed are cut and modified wires are re-wired between the parts. In printed circuit boards that are mounted at a high density, it is desired that the modified wires be wired at a high density, and that the modified wires can be easily drawn out from the components.

[Conventional technology]

Conventionally, in order to draw out the modified wires in the printed circuit board, dedicated pads for wire bonding have been separately provided in connection with pads for chip component bonding. When remodeling, the remodeling wire is soldered to a dedicated pad and pulled out.

[Problem that the invention attempts to solve]

By the way, according to the above-mentioned conventional modified wire drawing method, since a dedicated pad for wire bonding is provided, the area where patterns are prohibited increases accordingly, which is undesirable because high-density packaging is restricted. Furthermore, the presence of special pads for modifying the printed board itself complicates the design. Furthermore, reliability remains a problem when soldering modified wires to dedicated pads.

The present invention was created with these points in mind, and it promotes high-density mounting by eliminating the need for special pads for modified wires, and maintains good soldering reliability when pulling out modified wires. The purpose is to provide printed boards that are possible.

[Means for solving problems]

The present invention is shown in FIGS. 1 to 4 corresponding to the embodiments.
As shown in the figure, the modified wire pull-out part 4 is firmly attached to the bonding pad 3 on which the chip part 2 of the board 1 is mounted, while being soldered together. Alternatively, it also has the function of fixing and holding, and at least properly connects with the terminal 5 of the component.

The modification wire 6 is connected to the above-mentioned extraction part 4 to perform wire extraction during modification.

[Effect]

Based on the above configuration, in the present invention, the wire 6 is directly drawn out from the modified wire drawing part 4 attached to the bonding pad 3 of the chip part 2, and the pattern is modified.

In this way, the present invention eliminates the need for a dedicated pad for wire bonding, and makes it possible to ensure the reliability of soldering when wires are drawn out.

〔Example〕

Hereinafter, embodiments of the present invention will be described based on the drawings.

In FIG. 1, the first embodiment of the present invention will be described. Reference numeral 1 indicates a printed circuit board, and 2 indicates a chip component. This chip component 2 has terminal fittings 5 at both ends placed on bonding pads 3. It is fixed by solder 7. Then, a modified wire pull-out part 4 is attached on top of such a pad 3 adjacent to the chip part 2.

The drawer part 4 has two mounting parts 4a formed in an L-shape having a positioning piece 4e that abuts against the chip part 2 to position the chip part 2, and a wire is easily connected between the two mounting parts 4a. It consists of a pin portion 4b that is bent and protrudes in the opposite direction.

Therefore, when the drawer component 4 is placed on the pad 3 before component mounting, the chip component 2 is positioned by the positioning piece 4e of the mounting portion 4a. Then, the solder 7 at the time of soldering the parts connects the part 2 and the drawer part 4.
However, the mounting portion 4a is brought into contact with the terminal fitting 5 and fixed together, and only the pin portion 4b is exposed outside the solder 7.

As a result, when modifying the pattern, by connecting the modified wire 6 to the pin part 4b by soldering,
Wire drawing is performed.

Various types of drawer parts 4 can be considered in addition to the above embodiments. That is, in the case of the multiple pin type, as shown in FIG.
A' and another set of pin portions 4b' are arranged symmetrically, and both mounting portions 4a, 4a' are integrated by an insulating connecting plate 8.

Next, referring to FIG. 3, a second embodiment of the present invention, which is suitable for mounting after components are mounted, will be described. In this case, the drawer component 4 has an L-shaped mounting portion 4a provided with a horizontal support portion 4c in a stepped manner, and a pin portion 4b protrudes from the support portion 4c. Then, the support portion 4c and the attachment portion 4a are soldered in contact with the terminal fittings 5 of the chip component 2, and the modification wire 4 is connected in the same manner as described above during modification.

[Effect of idea]

As described above, according to the present invention, the modified wire pull-out part is attached to the pad for component bonding on the printed board, and wires are pulled out during modification, so the pad for wire bonding is no longer required. This simplifies the circuit design and facilitates high-density packaging by reducing the area where patterns are prohibited. The lead-out parts are soldered in the same way as other parts, and the wires are connected to the pins of the lead-out parts, so the reliability of the soldering is good and the rigidity of the wire lead-out part is also high.

Furthermore, since the drawer part is provided with a positioning piece, the chip part can be positioned by the drawer part.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing a first embodiment of the printed board of the present invention, Fig. 2 is a perspective view showing another example of the modified wire pull-out part, and Fig. 3 is a perspective view showing the second embodiment. , in Figures 1 to 3, 1 is a board, 2 is a chip component, 3 is a bonding pad, 4 is a modified wire extraction component, 5 is a terminal,
6 is a modified wire.

Claims (1)

[Scope of utility model registration request] A modified wire pull-out component 4 having a terminal 5 to which a modified wire can be connected and a positioning piece 4e for positioning the chip component 2 is attached to a bonding pad 3 to which a chip component 2 mounted on the board 1 is connected. A printed board characterized by being configured to be attached in a state connected to a bonding pad 3.