JP2976916B2 - Socket for J-lead IC - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket for a J-lead IC, and more particularly to a socket for a J-lead IC whose bottom plate can be freely attached and detached.

[0001]

2. Description of the Related Art Conventionally, this type of J-lead IC socket does not require soldering to the J-lead IC leads, allows mounting on a printed wiring board, and facilitates mounting of the J-lead IC from the printed wiring board. It is used for easy desorption.

FIG. 3 is a perspective view showing an example of a conventional J-lead IC socket, and FIG. 4 is a sectional view thereof. 3 and 4, in the J-lead IC socket 1, a contact 2 is disposed on the socket body 5 at a position corresponding to the lead of the J-lead IC at an opening for mounting the J-lead IC. The contact 2 includes a soldering portion 2a for soldering to a printed wiring board, and a spring contact portion 2b for making electrical contact with a lead of a J-lead IC.

[0003] Also, a J-lead IC is mounted on the bottom of the device.
It has a bottom plate 3 for supporting the bottom of the J-lead IC when inserted into the C socket. The bottom plate 3 is fixed to the socket body 5 by a bottom plate fixing portion 7 and covers the soldered portion 2a of the contact 2. Therefore, J-lead IC
To solder the socket for the PCB to the printed circuit board,
After supplying the cream solder to the printed wiring board, there is no method other than mounting the J-lead IC socket and heating the entire printed wiring board by reflow to perform soldering.

[0004]

The conventional J-lead I
In the socket for C, it was difficult to visually confirm the soldering state of the soldered portion, or when the soldering failure occurred in the soldered portion, the solder could not be corrected. further,
If other components are already mounted on the printed wiring board by soldering and it becomes necessary to mount the J-lead IC socket on the printed wiring board as a later operation, solder while supplying thread solder There is a problem that soldering with a trowel cannot be performed.

[0005] The reason is that since the bottom plate covers the soldered portion of the contact, the visibility of the soldered portion is poor.
Also, this is because the soldering iron cannot be brought into contact with the soldering portion.

SUMMARY OF THE INVENTION An object of the present invention is to eliminate the above-mentioned disadvantages, improve the visibility of the soldering condition of a printed wiring board of a J-lead IC socket, and improve the solderability and solderability of a J-lead IC using a soldering iron. To provide sockets.

[0007]

Means for Solving the Problems To solve the above-mentioned problems, in the J-lead IC socket of the present invention, the bottom plate has a structure detachable from the socket body.

According to the invention, since the bottom plate covering the soldering portion can be detached from the socket body, the soldering portion can be easily visually recognized, or the soldering portion can be contacted with the soldering portion.

[0009]

Next, an embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 1 is an exploded perspective view showing an embodiment of the present invention, and FIG. 2 is a sectional view thereof. In FIG.
In the lead IC socket 1, similarly to a conventional J-lead IC socket, a contact 2 is arranged in a socket body 5 at a position corresponding to a lead of the J-lead IC at an opening for mounting the J-lead IC. The contact 2 is a soldering portion 2a for soldering to a printed wiring board.
And a spring contact portion 2b which comes into contact with the lead of the J-lead IC and establishes electrical continuity.

The bottom plate 3 has a guide 4 for fixing to the socket body 5, while the socket body 5 has a guide 4
And a rail 6 for holding the bottom plate 3. The rail portion 6 has a size suitable for the guide 4 to be movable or fixed.

Next, the assembly of the socket 1 shown in FIG. 1 will be described.

Normally, the bottom plate 3 is held on the rail portion 6 of the socket body 5 via the guide 4, and the conventional J lead I
Like the C socket, it covers the soldering portion 2a.
Therefore, similarly to a conventional socket, after solder cream is supplied to a printed wiring board, a J-lead IC socket is mounted, and soldering is performed by heating the entire printed wiring board by reflow.

However, when the soldering state of the soldering portion 2a is checked or the soldering portion 2a is solder-repaired or soldered by a soldering iron while supplying thread solder, the socket body 5 is connected to the socket body 5 via the guide 4. The held bottom plate 3 is pulled upward, and the bottom plate 3 is removed from the socket body 5 along the rail 6.

[0015]

As described above, the J-lead IC socket of the present invention has a structure in which the bottom plate can be freely attached to and detached from the socket body, so that the soldering state of the contact soldering portion can be easily confirmed. In addition, there is an effect that solder correction and soldering can be performed by a solder iron while supplying thread solder.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing one embodiment of a J-lead IC socket of the present invention.

FIG. 2 is a cross-sectional view when FIG. 1 is cut along line AA.

FIG. 3 is an exploded perspective view showing an embodiment of a conventional J-lead IC socket.

FIG. 4 is a cross-sectional view when FIG. 3 is cut along line BB.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Socket 2 Contact 2a Solder part 2b Spring contact part 3 Bottom plate 4 Guide 5 Socket body 6 Rail part 7 Bottom plate fixing part

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01R 33/76

Claims (3)

(57) [Claims] 1. A socket having a contact for electrically connecting an IC having a J-shaped lead to a printed wiring board and a bottom plate for covering a soldered portion of the contact, wherein the bottom plate is detachable from the socket body. A socket for a J-lead IC. 2. The J-lead IC socket according to claim 1, further comprising a guide fixed to said socket body on said bottom plate. 3. The J-lead IC socket according to claim 1, wherein the socket body has a rail groove for holding the guide of the bottom plate.