JPH0416456Y2 - - Google Patents
Info
- Publication number
- JPH0416456Y2 JPH0416456Y2 JP1985177588U JP17758885U JPH0416456Y2 JP H0416456 Y2 JPH0416456 Y2 JP H0416456Y2 JP 1985177588 U JP1985177588 U JP 1985177588U JP 17758885 U JP17758885 U JP 17758885U JP H0416456 Y2 JPH0416456 Y2 JP H0416456Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- sheet
- led
- led lamp
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 35
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 230000002265 prevention Effects 0.000 claims description 8
- 238000004382 potting Methods 0.000 claims description 5
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985177588U JPH0416456Y2 (US07345094-20080318-C00003.png) | 1985-11-19 | 1985-11-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985177588U JPH0416456Y2 (US07345094-20080318-C00003.png) | 1985-11-19 | 1985-11-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6284940U JPS6284940U (US07345094-20080318-C00003.png) | 1987-05-30 |
JPH0416456Y2 true JPH0416456Y2 (US07345094-20080318-C00003.png) | 1992-04-13 |
Family
ID=31118927
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985177588U Expired JPH0416456Y2 (US07345094-20080318-C00003.png) | 1985-11-19 | 1985-11-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0416456Y2 (US07345094-20080318-C00003.png) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6264862B2 (ja) * | 2013-11-29 | 2018-01-24 | 日亜化学工業株式会社 | 発光装置の製造方法 |
-
1985
- 1985-11-19 JP JP1985177588U patent/JPH0416456Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6284940U (US07345094-20080318-C00003.png) | 1987-05-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5167556A (en) | Method for manufacturing a light emitting diode display means | |
US3368114A (en) | Microelectronic circuit packages with improved connection structure | |
JP3907145B2 (ja) | チップ電子部品 | |
US5250470A (en) | Method for manufacturing a semiconductor device with corrosion resistant leads | |
JPH0416456Y2 (US07345094-20080318-C00003.png) | ||
US5062802A (en) | Contact module for a low height multi-chip carrier socket | |
JP3139613B2 (ja) | 表面実装型半導体発光装置及びその製造方法 | |
JPH0422351B2 (US07345094-20080318-C00003.png) | ||
JPS58218149A (ja) | 樹脂封止ダイオ−ド用リ−ドフレ−ム | |
JP2001352105A (ja) | 表面実装型発光素子 | |
US4979017A (en) | Semiconductor element string structure | |
JPH0685327A (ja) | 光半導体装置の製造方法 | |
JPH05114751A (ja) | 光半導体装置 | |
JPH0529662A (ja) | 光半導体装置 | |
JPH0690028A (ja) | 表面実装型ledの製造方法 | |
KR101971436B1 (ko) | 탑뷰 및 사이드뷰 실장이 가능한 cob 타입 엘이디 패키지 및 그 제조 방법 | |
KR0119088Y1 (ko) | 반도체 패키지 | |
JPS5812469Y2 (ja) | 電子回路構体 | |
JPH06120298A (ja) | 半導体パッケージ | |
JPH0432774Y2 (US07345094-20080318-C00003.png) | ||
JPH0639466Y2 (ja) | 表面実装型半導体装置 | |
KR0181796B1 (ko) | 파워 모듈 팩키지 장치 | |
JPS6285286A (ja) | 発光ダイオ−トデイスプレイ装置およびその駆動制御回路基板の製造方法 | |
JP2521493Y2 (ja) | 表面実装型led | |
JP2597267Y2 (ja) | Ledプリントヘッド用表面実装型ledアレイモジュール |