JPH0416425Y2 - - Google Patents
Info
- Publication number
- JPH0416425Y2 JPH0416425Y2 JP1988046333U JP4633388U JPH0416425Y2 JP H0416425 Y2 JPH0416425 Y2 JP H0416425Y2 JP 1988046333 U JP1988046333 U JP 1988046333U JP 4633388 U JP4633388 U JP 4633388U JP H0416425 Y2 JPH0416425 Y2 JP H0416425Y2
- Authority
- JP
- Japan
- Prior art keywords
- bump electrode
- pattern
- electrode
- length measurement
- bump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005259 measurement Methods 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 claims description 11
- 238000012544 monitoring process Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ZTXONRUJVYXVTJ-UHFFFAOYSA-N chromium copper Chemical compound [Cr][Cu][Cr] ZTXONRUJVYXVTJ-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988046333U JPH0416425Y2 (US06373033-20020416-M00071.png) | 1988-04-06 | 1988-04-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988046333U JPH0416425Y2 (US06373033-20020416-M00071.png) | 1988-04-06 | 1988-04-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01157433U JPH01157433U (US06373033-20020416-M00071.png) | 1989-10-30 |
| JPH0416425Y2 true JPH0416425Y2 (US06373033-20020416-M00071.png) | 1992-04-13 |
Family
ID=31272604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988046333U Expired JPH0416425Y2 (US06373033-20020416-M00071.png) | 1988-04-06 | 1988-04-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0416425Y2 (US06373033-20020416-M00071.png) |
-
1988
- 1988-04-06 JP JP1988046333U patent/JPH0416425Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01157433U (US06373033-20020416-M00071.png) | 1989-10-30 |
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