JPH04162971A - Deburring device - Google Patents
Deburring deviceInfo
- Publication number
- JPH04162971A JPH04162971A JP2285824A JP28582490A JPH04162971A JP H04162971 A JPH04162971 A JP H04162971A JP 2285824 A JP2285824 A JP 2285824A JP 28582490 A JP28582490 A JP 28582490A JP H04162971 A JPH04162971 A JP H04162971A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- deburring
- burrs
- workpiece
- determined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005266 casting Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的１
（産業上の利用分野）
本発明は、レーザ光を用いて被加工物のバリ取りを行な
うバリ取り装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention 1 (Industrial Application Field) The present invention relates to a deburring device that deburrs a workpiece using a laser beam.
（従来の技術） 従来のバリ取り装置について図面を用いて説明する。(Conventional technology) A conventional deburring device will be explained using drawings.
第４図に示すように、レーザ発振器１から出力されたレ
ーザ光２は、レーザ光ガイド手段３に導かれて加工テー
ブル４上の被加工物５に照射される。照射されるレーザ
光２の強度や照射タイミング、レーザ光２に対する被加
工物５の相対速度く加工テーブル４の移動速度〉、レー
ザ光２に対する被加工物５の移動位置等を基に加ニブロ
グラムを作成して、予めＮＣ装置６内に記憶されている
。そして、被加工物５に対応した加ニブログラムを選択
して、そのプログラムを実行させることにより、被加工
物５に最適なレーザ光２を照射して被加工物５のバリ取
りを行なっていた。As shown in FIG. 4, a laser beam 2 output from a laser oscillator 1 is guided by a laser beam guide means 3 and irradiated onto a workpiece 5 on a processing table 4. As shown in FIG. The carnivorous program is created based on the intensity and irradiation timing of the laser beam 2 to be irradiated, the relative speed of the workpiece 5 with respect to the laser beam 2, the moving speed of the workpiece 5 with respect to the laser beam 2, the moving position of the workpiece 5 with respect to the laser beam 2, etc. It is created and stored in the NC device 6 in advance. Then, by selecting a cutting program corresponding to the workpiece 5 and executing the program, the workpiece 5 is irradiated with the optimum laser beam 2 to deburr the workpiece 5.
（発明が解決しようとする課題）
しかし、一般に、被加工物である鋳物や半導体パッケー
ジ等に生じるバリの大きさや量が同じ製品であっても生
産ロットや個々に異なることが多いため、従来のバリ取
り装置においては、バリを均一に除去することは困難で
あった。(Problem to be solved by the invention) However, in general, the size and amount of burrs that occur on workpieces such as castings and semiconductor packages often differ depending on the production lot and individual products, even if the product is the same. In deburring devices, it has been difficult to remove burrs uniformly.
そこで、本発明は、上記問題点を鑑み、被加工物に生じ
るバリの大きさや量に応じて、最適なバリ取りを行ない
、バリを均一に除去することが可能なバリ取り装置を提
供することを目的とする。SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a deburring device capable of uniformly removing burrs by performing optimal deburring depending on the size and amount of burrs generated on a workpiece. With the goal.
（課題を解決するための手段）
上記目的を達成するために、本発明は、レーザ光を用い
て被加工物のバリ取りを行なうバリ取り装置において２
前記被加工物を前記レーザ光に対し相対的に移動させる
移動手段と、前記被加工物の状態を検出する検出手段と
、この検出手段からの信号を基に前記レーザ光及び前記
移動手段を制御する制御手段とを備えたことと特徴とす
るバリ取り装置を提供する。(Means for Solving the Problem) In order to achieve the above object, the present invention provides a deburring device that deburrs a workpiece using a laser beam.
A moving means for moving the workpiece relative to the laser beam, a detection means for detecting a state of the workpiece, and controlling the laser beam and the movement means based on a signal from the detection means. A deburring device is provided, characterized in that it is equipped with a control means for controlling the deburring device.
（作 用）
このように構成された本発明のバリ取り装置によれば、
被加工物に対して、バリの大きさや量を検出し、その検
出値を基にバリ取り条件を設定し、その設定した条件を
基にバリ取りを行なうようにレーザ光及び移動手段を制
御するので、生産ロット或いは個々の被加工物によって
異なるバリを均一に或いは完全に除去できる。(Function) According to the deburring device of the present invention configured as described above,
Detects the size and amount of burrs on the workpiece, sets deburring conditions based on the detected values, and controls the laser beam and moving means to remove burrs based on the set conditions. Therefore, burrs that vary depending on production lots or individual workpieces can be uniformly or completely removed.
（実施例） 以下、本発明の実施例を図面を用いて詳細に説明する。(Example) Embodiments of the present invention will be described in detail below with reference to the drawings.
第１図に示すように、本実施例のバリ取り装置は、レー
ザ光１０を８力するレーザ発振器１１と、このレーザ光
１０を所定位置まで導くレーザ光ガイド手段１２と、被
加工物１３を載置し、任意の方向へ移動可能な加工テー
ブル１４と、被加工物１３の状態を検出するＣＣＤカメ
ラ１５と、このＣＣＤカメラ１５からの信号をデジタル
処理して画像信号に変換する画像処理手段１６と、この
画像処理手段１６からの画像信号を基に第２図に示すよ
うな被加工物１３に付着しているバリ１７の大きさや量
を判定する判定手段１８と、この判定手段１８からの信
号に基づいて５レーザ光の強度及び幅、レーザ光の照射
時間及び照射速度等のバリ取り条件を自動的に設定し、
その設定条件をレーザ発振器１１や加工テーブル１４の
ＮＣ装置１つへ送信するシステム制御手段２０とから構
成される。As shown in FIG. 1, the deburring apparatus of this embodiment includes a laser oscillator 11 that emits a laser beam 10, a laser beam guide means 12 that guides the laser beam 10 to a predetermined position, and a workpiece 13. A processing table 14 that can be placed and moved in any direction, a CCD camera 15 that detects the state of the workpiece 13, and an image processing means that digitally processes signals from the CCD camera 15 and converts them into image signals. 16, a determining means 18 for determining the size and amount of burrs 17 attached to the workpiece 13 as shown in FIG. 2 based on the image signal from the image processing means 16; Automatically sets deburring conditions such as intensity and width of laser beam, irradiation time and irradiation speed of laser beam based on the signal of
It is comprised of a system control means 20 that transmits the setting conditions to the laser oscillator 11 and one NC device of the processing table 14.
このように構成されたものにおいては、上記システム制
御手段２０にて自動的に設定したバリ取り条件をレーザ
発振器１１と加工テーブル１４のＮＣ装置１９へ送信し
、その後、さらに加工開始信号を個々へ送信する。そし
て、バリ取り条件及び加工開始信号を受信したレーザ発
振器１１では、バリ取り条件で指定されたレーザ光の強
度及び幅でレーザ光１０を発振し、また、ＮＣ装置１９
でも、バリ取り条件で指定された照射位置まで加工テー
ブル１４を移動させる。さらに、ＮＣ装置１つは、加工
開始前に被加工物１３の状態を検出するために、ＣＣＤ
カメラ１５を所定の位置まで移動させる。In the device configured in this way, the deburring conditions automatically set by the system control means 20 are transmitted to the laser oscillator 11 and the NC device 19 of the processing table 14, and then a processing start signal is sent to each individual. Send. Then, the laser oscillator 11 that has received the deburring conditions and the processing start signal oscillates the laser beam 10 with the intensity and width of the laser beam specified by the deburring conditions, and also the NC device 19
However, the processing table 14 is moved to the irradiation position specified by the deburring conditions. Furthermore, one NC device includes a CCD to detect the state of the workpiece 13 before starting machining.
Move the camera 15 to a predetermined position.
次に、システム制御手段２０の制御概要について、第３
図を用いて説明する。Next, the control outline of the system control means 20 will be explained in the third section.
This will be explained using figures.
まず、画像処理手段１６からの画像信号を基に被加工物
１３に付着しているバリ１７の大きさや量を読取る＜Ａ
−１）、この読取ったバリの状態の中からバリの大きさ
を基に、レーザ光の幅を決定しくＡ−２）、さらに、レ
ーザ光の照射位置を決定する＜Ａ−３＞、また、読取っ
たバリの状態の中からバリの量を基に、レーザ光の出力
量を決定しくＡ、−４）、さらに、レーザ光の照射速度
を決定する（Ａ−５）、そして、決定したレーザ光の幅
及びレーザ光の出力量については、レーザ発振器１１へ
送信し、レーザ光の照射位置及びレーザ光の照射速度に
ついては、ＮＣ装置１９へ送信する（Ａ−６）、その後
、すべてのバリ取り条件が送信された後、加工開始信号
が発振され、バリ族り加工が実行される（Ａ−７）。First, the size and amount of burrs 17 attached to the workpiece 13 are read based on the image signal from the image processing means 16.
-1), determine the width of the laser beam based on the size of the burr from the read burr state A-2), further determine the irradiation position of the laser beam <A-3>, and , determine the output amount of the laser beam based on the amount of burrs from the read burr state A,-4), further determine the irradiation speed of the laser beam (A-5), and determine the laser beam irradiation speed (A-5). The width of the laser beam and the output amount of the laser beam are transmitted to the laser oscillator 11, and the irradiation position of the laser beam and the irradiation speed of the laser beam are transmitted to the NC device 19 (A-6). After the deburring conditions are transmitted, a processing start signal is oscillated, and the deburring process is executed (A-7).
なお、上記実施例では、被加工物を移動させるようにし
たが、レーザ光を移動させても同様な効果を奏する。In the above embodiment, the workpiece is moved, but the same effect can be achieved even if the laser beam is moved.
［発明の効果］
以上述べたように、本発明によれば、被加工物個々のバ
リの状態に対して、自動的に最適なバリ取り条件を設定
して、その条件に応じてバリ取りを実行するので、大き
さや量の異なるバリを均一に完全に除去することができ
る。これにより、被加工物の品質の安定が図れるととも
に、バリ取り作業を全自動化が実現できる。[Effects of the Invention] As described above, according to the present invention, optimal deburring conditions are automatically set for the burr condition of each workpiece, and deburring is performed according to the conditions. This allows burrs of different sizes and amounts to be completely and uniformly removed. As a result, the quality of the workpiece can be stabilized, and the deburring work can be fully automated.
第１図は、本発明の一実施例を示す概要構成図、第２図
は、第１図に示した画像処理手段１６によりモニタされ
るバリの状態を示す図、第３図は、第１図に示したシス
テム制御手段の制御動作を示すフローチャート、第４図
は、従来のバリ取り装置を示す概要構成図である。
１０・・・・・・レーザ光、１１・・・・・・レーザ発
振器。
１３・・・・・・被加工物、１４・・・・・・加工テー
ブル。FIG. 1 is a schematic configuration diagram showing one embodiment of the present invention, FIG. 2 is a diagram showing the state of burrs monitored by the image processing means 16 shown in FIG. 1, and FIG. FIG. 4 is a flow chart showing the control operation of the system control means shown in the figure, and FIG. 4 is a schematic configuration diagram showing a conventional deburring device. 10... Laser light, 11... Laser oscillator. 13... Workpiece, 14... Processing table.
Claims (1)
装置において、前記被加工物を前記レーザ光に対し相対
的に移動させる移動手段と、前記被加工物の状態を検出
する検出手段と、この検出手段からの信号を基に前記レ
ーザ光及び前記移動手段を制御する制御手段とを具備し
たことを特徴とするバリ取り装置。A deburring device that deburrs a workpiece using a laser beam, a moving means for moving the workpiece relative to the laser beam, a detection means for detecting a state of the workpiece, A deburring device comprising: a control means for controlling the laser beam and the moving means based on a signal from the detection means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2285824A JPH04162971A (en) | 1990-10-25 | 1990-10-25 | Deburring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2285824A JPH04162971A (en) | 1990-10-25 | 1990-10-25 | Deburring device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04162971A true JPH04162971A (en) | 1992-06-08 |
Family
ID=17696560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2285824A Pending JPH04162971A (en) | 1990-10-25 | 1990-10-25 | Deburring device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04162971A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010274327A (en) * | 2009-04-27 | 2010-12-09 | Nishikimi Chuzo Kk | Metallic mold for casting of thin cast iron product, production device for thin cast iron product, and method for producing thin spheroidal graphite cast iron product |
| CN109261929A (en) * | 2018-09-30 | 2019-01-25 | 南京泉峰汽车精密技术股份有限公司 | Bead cutter automatic cleaning lubricates detection method and system |
-
1990
- 1990-10-25 JP JP2285824A patent/JPH04162971A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010274327A (en) * | 2009-04-27 | 2010-12-09 | Nishikimi Chuzo Kk | Metallic mold for casting of thin cast iron product, production device for thin cast iron product, and method for producing thin spheroidal graphite cast iron product |
| CN109261929A (en) * | 2018-09-30 | 2019-01-25 | 南京泉峰汽车精密技术股份有限公司 | Bead cutter automatic cleaning lubricates detection method and system |
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