JPH03226391A - Detecting device for focal position of laser beam machine - Google Patents
Detecting device for focal position of laser beam machineInfo
- Publication number
- JPH03226391A JPH03226391A JP2021093A JP2109390A JPH03226391A JP H03226391 A JPH03226391 A JP H03226391A JP 2021093 A JP2021093 A JP 2021093A JP 2109390 A JP2109390 A JP 2109390A JP H03226391 A JPH03226391 A JP H03226391A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- workpiece
- light
- detecting
- focal position
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims description 15
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 239000007789 gas Substances 0.000 abstract description 21
- 238000003754 machining Methods 0.000 abstract description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 5
- 229910001873 dinitrogen Inorganic materials 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野J
この発明は、レーザ加工装置で被加工物を加工する際に
必要なレーザ光の焦点位置検出装置に関するものである
。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application J) This invention relates to a laser beam focal position detection device that is necessary when processing a workpiece with a laser processing device.
[従来の技術]
従来よりレーザ光を用いて被加工物を切断加工又は溶接
加工する装置はよく知られている。この種の装置におい
ては、レーザ光の焦点を被加工物上に結んだ上で被加工
物を加工する場合が多く、上記レーザ光の焦点位置を検
出する作業はレーザ加工前の作業として必要不可欠な作
業となっている。[Prior Art] Devices for cutting or welding workpieces using laser light are well known. In this type of equipment, the workpiece is often processed by focusing the laser beam on the workpiece, and the work of detecting the focal position of the laser beam is essential as a work before laser processing. It is a lot of work.
ところで、レーザ加工装置の焦点位置を検出する方法と
しては、例えば特開昭59−159290号公報あるい
は特開昭60−96392号公報に開示されている技術
が公知である。By the way, as a method for detecting the focal position of a laser processing device, the technique disclosed in, for example, Japanese Patent Application Laid-Open No. 59-159290 or Japanese Patent Application Laid-Open No. 60-96392 is publicly known.
第3図は上記特開昭60−96392号公報に開示され
た従来技術を説明するもので、図において、(30)は
レーザ発振器、(31)はレーザ発振器(30)から発
振されたレーザ光(32)を取り込み、方向変換を図る
反射鏡(33)、集光レンズ(34)、照射ノズル(3
5)を経て被加工物(36)へ照射する加工ヘッドであ
る。FIG. 3 explains the conventional technology disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 60-96392. In the figure, (30) is a laser oscillator, and (31) is a laser beam oscillated from the laser oscillator (30). (32), a reflecting mirror (33), a condensing lens (34), and an irradiation nozzle (3) to change the direction.
5) and is a processing head that irradiates the workpiece (36).
ここで、加工ヘッド(31)は、加工補助手段としてそ
の入口(37)よりガスジェット(38)を供給し、被
加工物(36)中に設定する焦点めがけて吹きつける。Here, the machining head (31) supplies a gas jet (38) from its inlet (37) as a machining auxiliary means, and blows the gas jet toward a focal point set in the workpiece (36).
(39)は被加工物(36)の照射位置より生じる火花
で、被加工物(36)付近に配置したフォトトランジス
タ等の光センサ(40)にで受光され、光センサ(40
)で得られた電気信号は、被加工物(36)を!12置
固定しているX、Y、Z軸駆動テーブル(41)を、矢
印Z方向へ駆動させる制御部(42)に入力される即ち
、加熱効率の最高時を検出し、光量の最高時を検出する
。(39) is a spark generated from the irradiation position of the workpiece (36), which is received by the optical sensor (40) such as a phototransistor placed near the workpiece (36).
) The electrical signal obtained by the workpiece (36)! The information is input to the control unit (42) that drives the X, Y, and Z axis drive table (41), which is fixed at 12 positions, in the direction of the arrow Z. In other words, the maximum heating efficiency is detected, and the maximum light intensity is To detect.
上記から明かな通り、レーザ発振器(30)より加工ヘ
ッド(31)を介してレーザ光(32)を被加工物(3
6)へ−旦照肘すると、発生する火花(39)の光信号
が電気信号に変換されて、被加工物(36)の高さ位置
を常に調節して、レーザ光(32)の焦点を、被加工物
(36)の例えば表面に自動調節することができる。As is clear from the above, the laser beam (32) is emitted from the laser oscillator (30) through the processing head (31) to the workpiece (3).
Go to 6) - When the elbow is pressed, the light signal of the generated spark (39) is converted into an electrical signal, which constantly adjusts the height position of the workpiece (36) and focuses the laser beam (32). , for example on the surface of the workpiece (36).
〔発明が解決しようとする課題J
従来の焦点位置検出装置は上記のように構成されており
動作する。即ち、従来装置は、被加工物(36)で発生
するレーザ光(32)とガスジェット(38)による火
花の光量を、火花の光量の最高時となる加熱効率の最高
時に検出するものであり、その光センサ(40)に受光
される光量が最高時のものではあるものの、光量が少な
いことから検出精度が劣るという解決すべき課題がある
。[Problem to be Solved by the Invention J] The conventional focus position detection device is configured and operates as described above. That is, the conventional device detects the amount of sparks generated by the laser beam (32) and gas jet (38) generated by the workpiece (36) at the time when the amount of spark light is at its highest and the heating efficiency is at its highest. Although the amount of light received by the optical sensor (40) is the highest, there is a problem to be solved that the detection accuracy is poor because the amount of light is small.
この発明は上記のような課題を解決するためになされた
もので、精度の高いレーザ加工装置の焦点位置検出装置
を得ることを目的とする。The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to obtain a highly accurate focal position detection device for a laser processing device.
[課題を解決するための手段〕
この発明に係るレーザ加工装置の焦点位置検出装置は、
レーザ加工装置の焦点位置検出時に上記被加工物ヘレー
ザ光を照射するレーザ光照射手段と、上記被加工物へ照
射されるレーザ光に混合して有色火花を発生する気体を
供給する気体供給手段と、上記レーザ光照射手段から照
射されるレーザ光と上記気体供給手段から供給される気
体との混合により発生する有色火花の光量を検出する光
量検出手段を備えたものである。[Means for Solving the Problems] A focal position detection device for a laser processing device according to the present invention includes:
a laser beam irradiation means for irradiating the workpiece with a laser beam when detecting a focal position of the laser processing device; and a gas supply means for supplying a gas that is mixed with the laser light irradiated to the workpiece to generate colored sparks. and a light amount detection means for detecting the amount of colored sparks generated by mixing the laser light irradiated from the laser light irradiation means and the gas supplied from the gas supply means.
[作用1
この発明においては、レーザ光照射手段から照射される
レーザ光と、このレーザ光と混合して有色火花を発生す
る気体との混合により発生する有色火花の光量を検出す
る。[Operation 1] In this invention, the amount of colored sparks generated by mixing the laser beam irradiated from the laser beam irradiation means and the gas that generates colored sparks by mixing with the laser beam is detected.
以下、この発明の一実施例を図について説明する。第1
図は、レーザ加工装置の概略構成を示す図であり、光量
検出手段(40)は、その先端に、例えばフォトトラン
ジスタ(lO)を有し、照射ノズル(35)付近の加工
ヘッド(31)に取付けられる。フォトトランジスタ(
lO)の電圧信号はアンプ(111を通してNC装置f
12)にデータとして送り込まれる。An embodiment of the present invention will be described below with reference to the drawings. 1st
The figure is a diagram showing a schematic configuration of a laser processing device, in which a light amount detection means (40) has, for example, a phototransistor (lO) at its tip, and a processing head (31) near an irradiation nozzle (35). Installed. Phototransistor (
The voltage signal of lO) is sent to the NC device f through the amplifier (111).
12) is sent as data.
(13)は、NC装置(Illの指令により図中の矢印
Z方向へ加工ヘッド(31)を移動させるモータ(14
)に指令信号を伝達するサーボアンプである。また、(
15)は加工ガスの種類を切り換える電磁弁で、NC装
置(12)により制御される。(13) is a motor (14) that moves the machining head (31) in the direction of arrow Z in the figure in response to a command from the NC device (Ill).
) is a servo amplifier that transmits command signals to the Also,(
15) is a solenoid valve that switches the type of processing gas, and is controlled by the NC device (12).
ところで、上記の実施例装置において、被加工物(36
)のレーザ加工に際し、その焦点を例えば被加工物(3
6)の表面等に調整する必要があることは前述の通りで
あるが、その焦点位置の検出精度を上げるために、レー
ザ加工時に用いる加工ガスとは異なる気体、例えば窒素
ガス等のようにレーザ光と混合して有色火花を発生する
気体をレーザ光に混合させる。電磁弁(15)は上記焦
点検出時に使用する気体と、レーザ加工時に使用する加
工ガスとの切り換えを行なうもので、NC装置(12)
により切り換え制御される。By the way, in the above embodiment apparatus, the workpiece (36
), the focal point is set to the workpiece (3), for example.
As mentioned above, it is necessary to adjust the surface of A gas that mixes with the light to generate colored sparks is mixed with the laser light. The solenoid valve (15) is used to switch between the gas used during focus detection and the processing gas used during laser processing, and is connected to the NC device (12).
Switching is controlled by
この発明の実施例装置は上記のように構成されており、
次にその動作について説明する。第11gにおいて、作
業者はあらかじめ照射ノズル(35)を被加工物(36
)に接触させる。次に作業者はNC装置(12)内に設
けたスイッチによって焦点調整機能をF入」にする。第
2図は上記スイッチによって働く焦点調整のフローチャ
ート図である。このフローチャート図に従い焦点調整に
ついて説明する。The embodiment device of this invention is configured as described above,
Next, its operation will be explained. In the 11th g, the operator places the irradiation nozzle (35) on the workpiece (36) in advance.
). Next, the operator turns the focus adjustment function to "F" using a switch provided in the NC device (12). FIG. 2 is a flowchart of the focus adjustment operated by the switch. Focus adjustment will be explained according to this flowchart.
まず被加工物(36)へ向けて供給されている気体が窒
素ガスかどうかを電磁弁(15)の種類で見分け(ステ
ップSl) 、窒素ガスでないならば窒素ガス用の電磁
弁(1511を選択する(ステップS2)。次にレーザ
光を被加工物(36)上に照射し、窒素ガスを供給する
(ステップS3)。そしてフォトトランジスタ(lO)
の出力電圧と、あらかじめNC装置(12)に設定した
基準値を比較して、フォトトランジスタ(lO)出力電
圧が基準値を超すまで、加工ヘッド(31)を例えば0
.5m/分程度の比較的速いスピードで上昇させる(ス
テップS4、S5 )。フォトトランジスタ(lO)出
力電圧が基準値を超えたら、加工ヘッド(31)が0.
01mn上昇するたびにNC装置(12)内のメモリに
加工ヘッド(31)のZ軸座標値とそのときのフォトト
ランジスタ(10)の電圧値をストアして(ステップS
6、S7)、これをフォトトランジスタ (lO)の電
圧値が基準値以下になるまでくりかえす(ステップS8
)。そしてフォトトランジスタ(lO)の電圧値が基準
値以下になったら加工ヘッド(31)の上昇をストップ
してレーザ光照射及び加工ガス供給を止める(ステップ
S9)。次にNC装! (12)はメモリの電圧値のう
ち最大値をサチしくステップ310 ) 、対応する加
工ヘッド(31)4゜
の2軸座標値になるように加工ヘッド(31)の移動指
令を出す(ステップSll )。最後に、Z軸移動終了
すると(ステップ512)自動焦点調整は終了する。上
記により被加工物(36)に対する焦点調整が完了した
ら1次にNC装置(12)からの指令により電磁弁(1
5)を電磁弁(151)から電磁弁(152)へ切り換
えて被加工物(36)のレーザ加工を行なう。First, determine whether the gas being supplied to the workpiece (36) is nitrogen gas by the type of solenoid valve (15) (step Sl), and if it is not nitrogen gas, select the solenoid valve (1511) for nitrogen gas. (Step S2).Next, the workpiece (36) is irradiated with laser light and nitrogen gas is supplied (Step S3).Then, the phototransistor (lO)
The output voltage of the phototransistor (lO) is compared with a reference value set in advance in the NC device (12), and the processing head (31) is turned to zero, for example, until the output voltage of the phototransistor (lO) exceeds the reference value.
.. It is raised at a relatively fast speed of about 5 m/min (steps S4 and S5). When the phototransistor (lO) output voltage exceeds the reference value, the processing head (31) is set to 0.
Every time the process goes up by 01mm, the Z-axis coordinate value of the processing head (31) and the voltage value of the phototransistor (10) at that time are stored in the memory in the NC device (12) (step S).
6, S7), this process is repeated until the voltage value of the phototransistor (lO) becomes below the reference value (step S8).
). When the voltage value of the phototransistor (lO) becomes less than the reference value, the processing head (31) stops rising, and the laser light irradiation and processing gas supply are stopped (step S9). Next is NC outfit! (12) searches for the maximum value of the voltage values in the memory (step 310), and issues a movement command for the processing head (31) so that the corresponding processing head (31) has a two-axis coordinate value of 4° (step 310). ). Finally, when the Z-axis movement is completed (step 512), automatic focus adjustment ends. When the focus adjustment for the workpiece (36) is completed as described above, the primary solenoid valve (1
5) is switched from the solenoid valve (151) to the solenoid valve (152) to perform laser processing on the workpiece (36).
以上のように、この発明によれば、レーザ加工装置の焦
点位置検出時に、レーザ光と、このレーザ光と混合して
有色火花を発生する気体との混合により発生する有色火
花の光量を検出するようにしたから、その光量が光量検
出手段により検出されやすく、その検出精度が極めて向
上する利点がある。As described above, according to the present invention, when detecting the focal point position of a laser processing device, the amount of light of colored sparks generated by mixing a laser beam and a gas that generates colored sparks by mixing with this laser beam is detected. This has the advantage that the amount of light is easily detected by the light amount detection means, and the detection accuracy is greatly improved.
第1図はこの発明の一実施例によるレーザ加工装置の焦
点検出装置を説明する部分側断面構成図、第2図はこの
発明の一実施例によるレーザ加工装置の焦点検出のフロ
ーヂャート図、第3図は従来装置を示す構成図である。
図において、(12)はNC装置、(15)は電磁弁。
(30)はレーザ発振器、(31)は加工ヘッド、(3
2)はレーザ光、(35)は照射ノズル、(36)は被
加工物、(39)は火花、(40)は光量検出手段であ
る。
なお、図中、同一符号は同一、又は相当部分を示す。FIG. 1 is a partial side cross-sectional configuration diagram illustrating a focus detection device of a laser processing device according to an embodiment of the present invention, FIG. 2 is a flowchart of focus detection of a laser processing device according to an embodiment of the invention, and FIG. The figure is a configuration diagram showing a conventional device. In the figure, (12) is an NC device, and (15) is a solenoid valve. (30) is a laser oscillator, (31) is a processing head, (3
2) is a laser beam, (35) is an irradiation nozzle, (36) is a workpiece, (39) is a spark, and (40) is a light amount detection means. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
照射部で発生する火花を検出して上記レーザ光の焦点位
置を検出する装置において、上記レーザ加工装置の焦点
位置検出時に上記被加工物へレーザ光を照射するレーザ
光照射手段と、上記被加工物へ照射されるレーザ光に混
合して有色火花を発生する気体を供給する気体供給手段
と、上記レーザ光照射手段から照射されるレーザ光と上
記気体供給手段から供給される気体との混合により発生
する有色火花の光量を検出する光量検出手段を備えたこ
とを特徴とするレーザ加工装置の焦点位置検出装置。In an apparatus that irradiates a workpiece with a laser beam and detects a spark generated at a laser beam irradiation part of the workpiece to detect a focal position of the laser beam, the laser beam irradiates the workpiece with a laser beam and detects a focal position of the laser beam. a laser beam irradiation means for irradiating the workpiece with laser light; a gas supply means for supplying a gas that is mixed with the laser light irradiated to the workpiece to generate colored sparks; 1. A focal position detection device for a laser processing apparatus, comprising: a light amount detection means for detecting the light amount of colored sparks generated by mixing the laser beam and the gas supplied from the gas supply means.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021093A JPH03226391A (en) | 1990-01-31 | 1990-01-31 | Detecting device for focal position of laser beam machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021093A JPH03226391A (en) | 1990-01-31 | 1990-01-31 | Detecting device for focal position of laser beam machine |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03226391A true JPH03226391A (en) | 1991-10-07 |
Family
ID=12045258
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021093A Pending JPH03226391A (en) | 1990-01-31 | 1990-01-31 | Detecting device for focal position of laser beam machine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03226391A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5601735A (en) * | 1992-04-13 | 1997-02-11 | Hitachi, Ltd. | Long-sized tubular grounding container unit for gas-insulated electrical device and laser welding device for manufacturing the same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6096392A (en) * | 1983-10-31 | 1985-05-29 | Nec Kansai Ltd | Laser working method |
-
1990
- 1990-01-31 JP JP2021093A patent/JPH03226391A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6096392A (en) * | 1983-10-31 | 1985-05-29 | Nec Kansai Ltd | Laser working method |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5601735A (en) * | 1992-04-13 | 1997-02-11 | Hitachi, Ltd. | Long-sized tubular grounding container unit for gas-insulated electrical device and laser welding device for manufacturing the same |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1348511A1 (en) | Laser machining method and apparatus therefor | |
JPH06254691A (en) | Laser beam machine and method for setting focus of laser beam machine | |
JPH10249566A (en) | Laser beam machining method and its device | |
JPH03138092A (en) | Laser beam machine | |
JPH03226391A (en) | Detecting device for focal position of laser beam machine | |
JP2007504004A (en) | Device for remotely processing workpieces using a laser beam | |
JPH02160191A (en) | Laser beam machine | |
JPH11254172A (en) | Laser beam machine | |
JPS60255295A (en) | Automatic laser beam machine | |
JP2680963B2 (en) | Fast-forward control method | |
JPH10249560A (en) | Laser beam machining method and equipment therefor | |
JPS63108984A (en) | Laser beam machining method | |
JP2686286B2 (en) | Three-dimensional laser controller | |
JPS6324535A (en) | Electron beam machining device | |
JP5756626B2 (en) | Laser processing machine | |
JPS59215291A (en) | Laser working device | |
JPH067980A (en) | Laser beam machine | |
KR102128504B1 (en) | Inertia Canceling Processing Device and Inertia Canceling Processing Method | |
JPH06218569A (en) | Laser beam machine | |
JPH10137963A (en) | Copying control method for torch axis of laser beam machine | |
JPH03124389A (en) | Laser beam machine | |
JPH03110091A (en) | Method for determining focal point position of laser beam | |
JPH0760469A (en) | Laser beam machining device | |
JPH01170590A (en) | Laser beam machine | |
JPS5935891A (en) | Laser light welding method |