JPH02232148A - Chip supervisory device for cutting machine - Google Patents

Chip supervisory device for cutting machine

Info

Publication number
JPH02232148A
JPH02232148A JP5211689A JP5211689A JPH02232148A JP H02232148 A JPH02232148 A JP H02232148A JP 5211689 A JP5211689 A JP 5211689A JP 5211689 A JP5211689 A JP 5211689A JP H02232148 A JPH02232148 A JP H02232148A
Authority
JP
Japan
Prior art keywords
cutting
camera
chips
workpiece
cutting machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5211689A
Other languages
Japanese (ja)
Other versions
JPH0763925B2 (en
Inventor
Takaharu Hidaka
日高 敬治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1052116A priority Critical patent/JPH0763925B2/en
Publication of JPH02232148A publication Critical patent/JPH02232148A/en
Publication of JPH0763925B2 publication Critical patent/JPH0763925B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

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  • Machine Tool Sensing Apparatuses (AREA)

Abstract

PURPOSE:To supervise an adhering state by an unmanned manner by judging adhesion of chips to a cutter through picture processing of a camera image signal and controlling the next cutting action in accordance with a decision result. CONSTITUTION:A workpiece 4 is cut by a tool 2 taken a picture by a camera 5, consisting of a solid camera element, and decided for whether or not a cutting chip adheres by a picture processing circuit 6. By a result of this decision, when the cutting chip is decided present, the next cutting action is stopped by a control circuit 7. Accordingly, at the time of the next cutting, its action can be automatically controlled without causing damage in the workpiece by the cutting chip.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は平削シ盤等の切削機械において、バイトK付
着する切粉を監視する切削機械の切粉監視装置に関する
ものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a chip monitoring device for a cutting machine such as a planing cutter, which monitors chips adhering to a cutting tool K.

〔従来の技術〕[Conventional technology]

第5図は従来の平削シ盤等の切削機械を示す正面図であ
シ、図において、1は切削機械、2は切削機械1K上下
移動可能に設けられた一対のバイト、3は切削機械1に
移動可能に設けられたベッド、4はベッド3に載置され
た被切削物である。
FIG. 5 is a front view showing a conventional cutting machine such as a planing machine. In the figure, 1 is a cutting machine, 2 is a pair of cutting tools that are vertically movable in the cutting machine 1K, and 3 is a cutting machine. 1 is a movably provided bed, and 4 is a workpiece placed on the bed 3.

次に動作について説明する。先ず、バイト2が被切削物
4に接触しない位置までペッド3を移動させた状態で、
バイト2を切削量K応じて下降させる。次にベッド3を
パイト2に向けて移動させると、被切削物4がバイト2
に接触し、そのままベッド3の移動を続けることにより
,被切削物40表面がバイト2によシ定められた深さで
切削される。所定長さの切削ストロークが終了すると、
バイト2が持上げられると共に、ベッド3が戻シストロ
ークに入シ、逆方向に移動して元の位置まで戻る。次に
再びバイト2が下降されて位置決めが成された後、再び
切削ストロークK入シ、切削が行われる。
Next, the operation will be explained. First, with the ped 3 moved to a position where the cutting tool 2 does not contact the workpiece 4,
The cutting tool 2 is lowered according to the cutting amount K. Next, when the bed 3 is moved toward the cutting tool 2, the workpiece 4 is moved toward the cutting tool 2.
By making contact with the cutting tool 2 and continuing to move the bed 3, the surface of the workpiece 40 is cut to a predetermined depth by the cutting tool 2. When a cutting stroke of a predetermined length is completed,
As the cutting tool 2 is lifted, the bed 3 enters the return stroke, moves in the opposite direction, and returns to its original position. Next, the cutting tool 2 is lowered again and positioned, and then the cutting stroke K is entered again and cutting is performed.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来の切削機械は以上のように構成されているので、切
削ストローク中に切粉がバイトに付着したシ、あるいは
絡みつくことがあシ、これをそのttKLて次の切削ス
トロークに入ると、上記切粉が被切削物の加工面を傷付
けることがあυ、このため、オペレータが常にバイトを
監視して切粉を除去することが必要となυ、加工中はオ
ペレータが切削機械から離れられないなどの問題点があ
クた。
Conventional cutting machines are configured as described above, so when the chips adhere to or become entangled with the cutting tool during the cutting stroke, when the chips are removed from the cutting stroke and the next cutting stroke is started, the above-mentioned cutting The powder may damage the machined surface of the workpiece, so it is necessary for the operator to constantly monitor the cutting tool and remove the chips, and the operator cannot leave the cutting machine during machining. The problem has been solved.

この発明は上記のような問題点を解消するためになされ
たもので、切粉の付着を自動的に監視できると共に、切
粉付着の場合は切削機械を停止できる切削機械の切粉監
視装置を得ることを目的とする。
This invention was made in order to solve the above-mentioned problems, and provides a chip monitoring device for cutting machines that can automatically monitor the adhesion of chips and can also stop the cutting machine in the case of adhesion of chips. The purpose is to obtain.

〔課題を解決するための手段〕[Means to solve the problem]

この発明に係る切削機械の切粉監視装置は、バイトに付
着する切粉を検出するカメラを有し、その映像信号に基
いて画像処理回路で切粉の付着を判定し、その判定結果
によシ切削ストロークに移行するか否かのデータを制御
回路へ出力し、制御回路は切削機械の次の切削動作を制
御するようにしたものである。
A chip monitoring device for a cutting machine according to the present invention has a camera that detects chips adhering to a cutting tool, and based on the video signal, an image processing circuit determines the adhesion of chips, and based on the determination result. Data indicating whether or not to proceed to a cutting stroke is output to a control circuit, and the control circuit controls the next cutting operation of the cutting machine.

〔作用〕 この発明における切削機械の切粉監視装置は、画像処理
回路によシ切粉の付着が判定されると、制御回路によυ
次の切削動作が停止される。
[Function] In the cutting machine chip monitoring device according to the present invention, when the image processing circuit determines that chips are attached, the control circuit
The next cutting operation is stopped.

〔発明の実施例〕[Embodiments of the invention]

以下、この発明の一実施例を図について説明する。第1
図においては第5図と同一部分には同一符号を付して説
明を省略する。5はパイト2に付着する切粉を検出する
ための固体撮像素子から成るカメラ、6はカメラ5から
得られる映像信号を処理する画像処理回路、7は画像処
理回路6からの切粉付着判定データを受け取シ、これに
応じて切削機械1を制御する制御回路である。
An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure, the same parts as in FIG. 5 are given the same reference numerals, and their explanation will be omitted. 5 is a camera composed of a solid-state image sensor for detecting chips adhering to the cutting tool 2; 6 is an image processing circuit that processes the video signal obtained from the camera 5; and 7 is chip adhesion determination data from the image processing circuit 6. This is a control circuit that receives the information and controls the cutting machine 1 accordingly.

次に動作について説明する。第2図において、切削スト
ロークはバイト2が被切削物4を切削するためにベッド
3が切削方向へ移動している期間を示す。戻シストロー
クは切削ストロークの終了後、ベッド3が逆方向へ移動
する期間を示す。ノ《イト上昇は戻シストロークへ入る
直前に、バイト2を持上げて被切削物4をかわすための
期間である。バイト下降は切削ストロークへ入る直前に
、バイト2を切削量だけ下降させる期間である。切粉検
出は、バイト2が切削位置へ設定された時点からバイト
2が被切削物4に接触するまでの時間から、ベッド3の
停止時間(戻シストロークから切削ストロークに方向転
換する時間)を差引いた期間に行う必要がある。画像処
理回路6は制御回路γからバイト2が切削位置にあると
いうデータを受信すると、カメラ3からの映像信号を0
.5秒以内に処理して、制御回路7へ前回の切削ストロ
ーク中にバイト2に切粉が付着したか否かの判定結果を
示すデータを送信する。制御回路7は判定結果が切粉付
着の場合は、切削機械10次の切削動作を停止させると
共に、アラームを発生する。
Next, the operation will be explained. In FIG. 2, the cutting stroke indicates a period during which the bed 3 is moving in the cutting direction in order for the cutting tool 2 to cut the object 4 to be cut. The return stroke indicates the period during which the bed 3 moves in the opposite direction after the end of the cutting stroke. The knife lift is a period for lifting the cutting tool 2 and dodging the workpiece 4 immediately before entering the return stroke. The lowering of the cutting tool is a period in which the cutting tool 2 is lowered by the cutting amount immediately before entering the cutting stroke. Chip detection is performed by measuring the stop time of the bed 3 (the time to change direction from the return stroke to the cutting stroke) from the time from when the bite 2 is set to the cutting position until the bite 2 contacts the workpiece 4. This must be done during the subtracted period. When the image processing circuit 6 receives the data that the cutting tool 2 is in the cutting position from the control circuit γ, the image processing circuit 6 changes the video signal from the camera 3 to 0.
.. Processing is performed within 5 seconds, and data indicating a determination result as to whether or not chips were attached to the cutting tool 2 during the previous cutting stroke is transmitted to the control circuit 7. If the determination result is that chips are attached, the control circuit 7 stops the cutting operation of the cutting machine 10 and generates an alarm.

次に、画像処理回路6における画像処理方法について説
明する。先ず、第3図に示すように、切粉が付着しない
正常な基準画像とカメラ5から得られる切粉8が付着し
た異常画像との差による差分画像を得る。この差分画像
は図示のように切粉8のみが現われている。
Next, an image processing method in the image processing circuit 6 will be explained. First, as shown in FIG. 3, a difference image is obtained based on the difference between a normal reference image with no chips attached and an abnormal image obtained from the camera 5 with chips 8 attached. In this difference image, only the chips 8 appear as shown.

次に、第4図に示すように、上記差分画像の全体におけ
る濃度分布ヒストグラムを作る。第4図の例は、256
階調の場合を示し、T8の濃度を境としてゼロに集中す
る山と、切粉8の濃度T,に集中する山とが現われてい
る。バイト2に切粉8が付着していない場合は、カメラ
5からの画像は正常な画像となるので、差分画像の濃度
分布ヒストグラムはゼロのみに集中することになる。
Next, as shown in FIG. 4, a density distribution histogram for the entire difference image is created. The example in Figure 4 is 256
The case of gradation is shown, and there appears a peak that concentrates at zero with the density of T8 as the boundary, and a peak that concentrates at the density T of chip 8. If no chips 8 are attached to the cutting tool 2, the image from the camera 5 will be a normal image, so the density distribution histogram of the difference image will be concentrated only at zero.

次に、上記差分画偉を構成する各画素データを上記Ts
o値をしきい値として2値化した後、上記しきい値Ts
を越える画素数をカウントする。このカウント値が所定
の設定値を越えていれば、切粉付着の判定を行う。
Next, each pixel data constituting the above-mentioned differential image is converted into the above-mentioned Ts
After binarizing using the o value as a threshold value, the above threshold value Ts
Count the number of pixels that exceed . If this count value exceeds a predetermined set value, it is determined whether chips are attached.

なお、バイト2に対する1日の背光が変化するため、カ
メラ5による検出K誤差が生じるので、1ストローク前
の正常な画像を基準画像としてカメラ5によシ得られる
画像との差分画像を得るようにすれば、上記の誤差を軽
減することができる。
In addition, since the back light for the bite 2 changes during the day, a detection error by the camera 5 occurs, so a normal image taken one stroke before is used as a reference image to obtain a difference image from the image obtained by the camera 5. By doing so, the above error can be reduced.

〔発明の効果〕〔Effect of the invention〕

以上のように、この発明によれば、切粉の付着を、バイ
トを撮影するカメラからの映像信号を画像処理すること
によシ判定し、その判定結果に応じて次の切削動作を制
御するように構成したので、切粉の付着監視を無人化す
ることができると共に切粉による被切削物の損傷が無く
なる効果がある。
As described above, according to the present invention, the adhesion of chips is determined by image processing the video signal from the camera that photographs the cutting tool, and the next cutting operation is controlled according to the determination result. With this configuration, it is possible to unattended monitoring of the adhesion of chips, and there is an effect that damage to the cut object due to chips is eliminated.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の一実施例Kよる切削機械の切粉監視
装置を示す正面図、第2図は切粉監視動作のタイミング
チャート、第3図は同装置の画像処理を説明するための
画像の正面図、第4図は同装置の画像処理を説明するた
めの濃度分布ヒストグラム図、第5図は従来の切削機械
を示す正面図である。 1は切削機械、2はバイト、4は被切削物、5はカメラ
、6は画像処理回路、7は制御回路。 なお、図中、同一符号は同一または相当部分を示す。
FIG. 1 is a front view showing a chip monitoring device for a cutting machine according to an embodiment K of the present invention, FIG. 2 is a timing chart of chip monitoring operation, and FIG. 3 is a diagram for explaining image processing of the device. FIG. 4 is a front view of the image, FIG. 4 is a density distribution histogram diagram for explaining image processing of the apparatus, and FIG. 5 is a front view of a conventional cutting machine. 1 is a cutting machine, 2 is a cutting tool, 4 is a workpiece to be cut, 5 is a camera, 6 is an image processing circuit, and 7 is a control circuit. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims (1)

【特許請求の範囲】[Claims] 被切削物を切削するバイトを切削動作の終了後に撮影す
るカメラと、上記カメラから得られる映像信号を処理す
ることにより、上記バイトへの切粉の付着を判定する画
像処理回路と、上記画像処理回路の判定結果に応じて上
記バイトによる次の切削動作を制御する制御回路とを備
えた切削機械の切粉監視装置。
a camera that photographs a cutting tool that cuts a workpiece after the cutting operation is completed; an image processing circuit that processes a video signal obtained from the camera to determine whether chips have adhered to the tool; and the image processing circuit that processes the video signal obtained from the camera. A chip monitoring device for a cutting machine, comprising: a control circuit that controls the next cutting operation by the cutting tool according to a determination result of the circuit.
JP1052116A 1989-03-06 1989-03-06 Chip adhesion monitoring device for cutting machine Expired - Lifetime JPH0763925B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1052116A JPH0763925B2 (en) 1989-03-06 1989-03-06 Chip adhesion monitoring device for cutting machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1052116A JPH0763925B2 (en) 1989-03-06 1989-03-06 Chip adhesion monitoring device for cutting machine

Publications (2)

Publication Number Publication Date
JPH02232148A true JPH02232148A (en) 1990-09-14
JPH0763925B2 JPH0763925B2 (en) 1995-07-12

Family

ID=12905903

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1052116A Expired - Lifetime JPH0763925B2 (en) 1989-03-06 1989-03-06 Chip adhesion monitoring device for cutting machine

Country Status (1)

Country Link
JP (1) JPH0763925B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022163426A1 (en) * 2021-02-01 2022-08-04 Dmg森精機株式会社 Image processing device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6336353B2 (en) * 2014-08-19 2018-06-06 株式会社オーエム製作所 Machine Tools
JP7207948B2 (en) * 2018-10-30 2023-01-18 株式会社ミツトヨ Appearance inspection method and program

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61111878A (en) * 1984-11-01 1986-05-29 フオルクスアイグナー ベトリープ ヴエルクツオイクマシーネンコンビナート“ジーベンテン オクトーベル”ベルリン Monitor device for form of cutting on metal cutting machining

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61111878A (en) * 1984-11-01 1986-05-29 フオルクスアイグナー ベトリープ ヴエルクツオイクマシーネンコンビナート“ジーベンテン オクトーベル”ベルリン Monitor device for form of cutting on metal cutting machining

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022163426A1 (en) * 2021-02-01 2022-08-04 Dmg森精機株式会社 Image processing device

Also Published As

Publication number Publication date
JPH0763925B2 (en) 1995-07-12

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