JPH02299787A - Laser beam machine - Google Patents

Laser beam machine

Info

Publication number
JPH02299787A
JPH02299787A JP1118716A JP11871689A JPH02299787A JP H02299787 A JPH02299787 A JP H02299787A JP 1118716 A JP1118716 A JP 1118716A JP 11871689 A JP11871689 A JP 11871689A JP H02299787 A JPH02299787 A JP H02299787A
Authority
JP
Japan
Prior art keywords
deviation
signal
laser processing
dimension
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1118716A
Other languages
Japanese (ja)
Inventor
Hiroshi Ishigaki
石垣 廣
Takao Hosokawa
孝夫 細川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Sanyo Electric Co Ltd
Original Assignee
Toshiba Corp
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Sanyo Electric Co Ltd filed Critical Toshiba Corp
Priority to JP1118716A priority Critical patent/JPH02299787A/en
Publication of JPH02299787A publication Critical patent/JPH02299787A/en
Pending legal-status Critical Current

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  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To automatically and accurately carry out follow-up at high speed by calculating the deviation based on a reference signal from a reference dimension setting means and a detection signal from a machining dimension detection means by a deviation calculation means and controlling a driving means based on a deviation signal from deviation calculation means. CONSTITUTION:Width dimensions of an iron plate 2 slit-cut are detected by a vision sensor 5 and this detected value is compared with a preset reference value. The deviation is calculated and it is discriminated whether or not the deviation is within a tolerance and when it is expected to deviate from the allowance, a motor 4 to move a laser beam machining head 3 is controlled based on the deviation and the laser beam machining head 3 is corrected and moved as the quantity of correction by the deviation amount. By this method, the quality of a product can be improved.

Description

【発明の詳細な説明】 [発明の目的] (産業上の利用分野) 本発明は、レーザ光を用い、鉄板等を所定の形状に加工
するレーザ加工装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a laser processing apparatus for processing a steel plate or the like into a predetermined shape using a laser beam.

(従来の技術) 鉄板を切断する技術の1つにスリット切断と言われる切
断技術がある。このスリット切断とは、薄板状に圧延さ
れた鉄板を所定幅に切断するために圧延1巻回されたコ
イル状のフープ材をアンコイラ等に装架し、フープ材を
繰り出し、一定幅に設定された切断用の回転刃物を回転
させることにより繰り出されたフープ材を切断するとい
うものである。
(Prior Art) One of the techniques for cutting iron plates is a cutting technique called slit cutting. This slit cutting involves cutting a thin rolled iron plate into a predetermined width by mounting a coiled hoop material rolled once on an uncoiler, feeding out the hoop material, and cutting the hoop material into a predetermined width. The hoop material is cut by rotating a rotary cutter.

しかしながら、上記の切断方法では、刃物工具による剪
断加工であるため、刃物工具の摩耗、破損等により、フ
ープ材の切断面に「ぼり」と呼ばれるかえりを発生させ
る。この「ぼり」は品質上の問題となり、製品の高品質
化が望まれている現在この「ぼり」の除去は切断加工技
術における課題の一つになっていた。
However, in the above-mentioned cutting method, since shearing is performed using a cutter tool, burrs called "burrs" occur on the cut surface of the hoop material due to wear and damage of the cutter tool. These "bori" pose a quality problem, and the removal of these "bori" has become one of the challenges in cutting technology, as higher quality products are desired.

この課題を解決するための1つの方法として刃物工具の
代わりにレーザビームを用いるという方法が考えられる
。すなわち、エネルギー密度の高いレーザビームを用い
て上記フープ材を熱エネルギーにより非接触切断すると
いうものである。このレーザビームによる切断によれば
非接触切断であるため「ぼり」の発生がなく、かつ高速
で切断することができる。
One possible method for solving this problem is to use a laser beam instead of a cutting tool. That is, the hoop material is cut by thermal energy in a non-contact manner using a laser beam with high energy density. Cutting with this laser beam is non-contact cutting, so there is no occurrence of "burrs" and cutting can be performed at high speed.

(発明が解決しようとする課題) 上記レーザビームによるスリット切断においては、一定
幅にスリット切断されたフープ材の幅寸法精度がスリッ
ト切断における製品品質に多大な影響を及ぼす。
(Problems to be Solved by the Invention) In the above-mentioned slit cutting using a laser beam, the width dimensional accuracy of the hoop material cut into slits having a constant width has a great influence on the product quality in the slit cutting.

しかし、この幅寸法の調整は、レーザ発振器から発振さ
れたレーザビームを集光させ、フープ材に照射するレー
ザ加工ヘッドを切断幅寸法に合わせることにより行って
いたので、幅寸法が変動すると切断ラインを停止し、レ
ーザ加工ヘッドを人手により移動させなげればならなか
った。
However, this width adjustment was done by focusing a laser beam emitted from a laser oscillator and adjusting the laser processing head that irradiates the hoop material to the cutting width, so if the width changes, the cutting line The machine had to be stopped and the laser processing head had to be moved manually.

従って、ライン稼動率の低下を招き、生産性向上を阻害
していた。
Therefore, this resulted in a decrease in line operation rate and hindered productivity improvement.

よって、本発明はレーザ加工における加工寸法の変動に
対し、自動的に高速、適確に追従することが可能なレー
ザ加工装置を提供することをその目的とする。
Therefore, an object of the present invention is to provide a laser processing apparatus that can automatically follow changes in processing dimensions during laser processing at high speed and accurately.

[発明の構成〕 (課題を解決するための手段) 上記目的を達成するために、本発明は、レーザ加工ヘッ
ドを移動させる駆動手段と、被加工材の加工寸法を設定
する基準寸法設定手段と、加工後の被加工材の加工寸法
を検出する加工寸法検出手段と、前記基準寸法設定手段
からの基や信号と前記加工寸法検出手段からの検出信号
とを話に、その偏差を算出する偏差算出手段と、この偏
差算出手段からの偏差信号を基に、前記駆動手段を制御
する駆動制御手段とを備えたレーザ加工装置を提供する
[Structure of the Invention] (Means for Solving the Problems) In order to achieve the above object, the present invention comprises a drive means for moving a laser processing head, a reference dimension setting means for setting the processing dimensions of a workpiece. , a machining dimension detection means for detecting the machining dimension of the workpiece after machining, and a deviation for calculating the deviation based on the reference signal from the reference dimension setting means and the detection signal from the machining dimension detection means. A laser processing apparatus is provided that includes a calculation means and a drive control means for controlling the drive means based on a deviation signal from the deviation calculation means.

(作用) このように構成されたレーザ加工装置においては、加工
後の被加工材の寸法を検出し、この検出した寸法と任意
に設定される基準寸法とを比較し、その偏差を算出し、
算出された偏差を基にレーザ加工ヘッドを駆動する駆動
手段を制御し、レーザ加工ヘッドを偏差量移動させる。
(Function) The laser processing device configured in this manner detects the dimensions of the workpiece after processing, compares the detected dimensions with an arbitrarily set reference dimension, and calculates the deviation.
A driving means for driving the laser processing head is controlled based on the calculated deviation, and the laser processing head is moved by the deviation amount.

(実施例) 以下、本発明の一実施例を図面を用いて説明する。(Example) An embodiment of the present invention will be described below with reference to the drawings.

なお、本実施例として、従来の技術に対応するようレー
ザ加工の一種であるレーザビームによるスリット切断に
ついて説明する。
In this embodiment, slit cutting using a laser beam, which is a type of laser processing, will be explained so as to correspond to the conventional technology.

第1図に示すように、本実施例は、レーザ発振器(図示
せず)から発振されたレーザ光りを集光する集光レンズ
1を収納し、集光したレーザビームBにより被加工材と
しての鉄板2を切断するレーザ加工ヘッド3と、このレ
ーザ加工ヘッド3を送りねじFを介して移動するモータ
4と、レーザ加工ヘッド3からのレーザビームBにより
スリット切断された鉄板2の幅寸法を検出するビジョン
センサ5と、こ、のビジョンセンサ5からの映像信号を
幅寸法に相当する信号に変換する信号変換回路6と、加
工される幅寸法を設定する基■幅寸法設定回路7と、製
品として許容できる切断偏差範囲を設定する許容偏差範
囲設定器8と、信号変換回路6からの出力信号とハ準幅
寸法設定回路7からの設定信号とを比較し、偏差を算出
し、その偏差に相当する偏差信号を出力する偏差算出回
路つと、この偏差算出回路9からの出力された偏差信号
と許容偏差範囲設定器8からの設定範囲信号とを比較し
、偏差信号が設定範囲信号に所定量近づいた場合、その
偏差信号をレーザ加工ヘッド3の補正量とする判別回路
10と、この判別回路10からの出力信号を基に、レー
ザ加工ヘッド3を移動させるモータ4を制御するモータ
制御回路11とから構成される装 なお、信号変換回路6.基準幅寸法設定回路7.許容偏
差範囲設定器8.偏差算出回路9、判別回路10はビジ
ョンコントローラ12内に収納されている。
As shown in FIG. 1, this embodiment houses a condensing lens 1 that condenses laser light emitted from a laser oscillator (not shown), and uses the condensed laser beam B to collect the workpiece. A laser processing head 3 that cuts a steel plate 2, a motor 4 that moves this laser processing head 3 via a feed screw F, and a width dimension of the steel plate 2 cut into slits by a laser beam B from the laser processing head 3 is detected. a signal conversion circuit 6 that converts the video signal from the vision sensor 5 into a signal corresponding to the width dimension, a base width dimension setting circuit 7 that sets the width dimension to be processed, and the product. The output signal from the signal conversion circuit 6 is compared with the setting signal from the semi-width dimension setting circuit 7, and the deviation is calculated. A deviation calculation circuit 9 outputs a corresponding deviation signal, and the deviation signal output from the deviation calculation circuit 9 is compared with the setting range signal from the allowable deviation range setter 8, and the deviation signal is added to the setting range signal by a predetermined amount. a discrimination circuit 10 that uses the deviation signal as a correction amount for the laser processing head 3 if the deviation signal approaches the laser processing head 3; and a motor control circuit 11 that controls the motor 4 that moves the laser processing head 3 based on the output signal from the discrimination circuit 10. Furthermore, the signal conversion circuit 6. Reference width dimension setting circuit 7. Allowable deviation range setter 8. The deviation calculation circuit 9 and the discrimination circuit 10 are housed in the vision controller 12.

このように構成された本実施例によれば、スリット切断
された鉄板2の幅寸法は、ビジョンセンサ5により検出
され、この検出値と予め設定されたJul値とを比較し
、偏差を算出し、その偏差が許容範囲内にあるかどうか
判別し、許容範囲を逸脱しそうな場合にはその偏差を基
に、レーザ加工へラド3を移動するモータ4をff1l
l 1し、レーザ加工ヘッド3をその偏差分だけ補正量
として補正移動させる。
According to this embodiment configured in this way, the width dimension of the slit-cut iron plate 2 is detected by the vision sensor 5, and the detected value is compared with a preset Jul value to calculate the deviation. , determines whether the deviation is within the allowable range, and if it is likely to deviate from the allowable range, based on the deviation, the motor 4 that moves the rad 3 to laser processing is set to ff1l.
1, and the laser processing head 3 is moved for correction by the deviation as a correction amount.

なお、本実施例においては、許容偏差範囲設定器8を用
いて、切断偏差範囲を設定し加工幅寸法に余裕をもたせ
たが、加工幅寸法により高精度に制御する場合において
は、許容偏差範囲設定器8を用いず、信号変換回路6か
らの出力信号と基準幅寸法設定回路7からの設定信号と
の偏差をレーザ加工ヘッド3の補i1i 量として、レ
ーザ加工ヘッド3を移動させるモータ4を制御するモー
タ制御回路11へ出力してもよい。また、加工幅寸法に
よっては、複数(3つ以上)にスリット切断される場合
があるが、この場合においてもスリブ ・、ト1ノ断数
に対応する(3つにスリット切断する場合はスリット切
断は2箇所)数だけレーザ加工ヘッドを並設し、各レー
ザ加工ヘッドにより切断される幅寸法を各々設定し、そ
れに対応する検出値(加工後の幅寸法)とを各々比較し
、偏差を算出し、その偏差に応じて各レーザ加工ヘッド
を移動させるモータを制御することにより、本発明は適
用できることは言うまでもない。さらに、被加工材につ
いても、鉄板のみならず、非鉄金属、非金属の材質を有
するものであっても本発明は適用できる。
In this example, the cutting deviation range was set using the allowable deviation range setter 8 to provide a margin for the machining width dimension. However, in the case of highly accurate control based on the machining width dimension, The motor 4 for moving the laser processing head 3 is operated without using the setting device 8, using the deviation between the output signal from the signal conversion circuit 6 and the setting signal from the reference width dimension setting circuit 7 as a compensation amount for the laser processing head 3. It may also be output to the motor control circuit 11 for control. Also, depending on the processing width dimension, slits may be cut into multiple (three or more) pieces, but even in this case, the number of slits corresponds to the number of slits cut into 1 piece. (2 locations)), set the width dimension cut by each laser processing head, compare it with the corresponding detected value (width dimension after processing), and calculate the deviation. However, it goes without saying that the present invention can be applied by controlling the motors that move each laser processing head according to the deviation. Furthermore, the present invention is applicable to the workpiece not only made of iron plates but also non-ferrous metals and non-metallic materials.

[発明の効果〕 以上述べたように、本発明によれば、加工後の加工寸法
と多め設定された基準寸法とを比較し、偏差を算出し、
必要に応じてその偏差を打ち消すようにレーザ加工ヘッ
ドを移動させることができるので、レーザ加工における
加工寸法の変動に対し、自動的に高速かつ適確に追従す
ることができ、製品の品質向上を図ることができる。
[Effects of the Invention] As described above, according to the present invention, the processed dimensions after processing are compared with the reference dimensions set larger, and the deviation is calculated.
Since the laser processing head can be moved to cancel out the deviation as necessary, it is possible to automatically follow changes in processing dimensions during laser processing at high speed and accurately, improving product quality. can be achieved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図は、本発明の一実施例を示すlI!E
要構成画構成図図は第1図に示した判別回路における判
別方法を示すグラフである。 2・・・鉄板、  3・・・レーザ加工ヘッド。 4・・・モータ、  5・・・ビジョンセンサ。 6・・・信号変換回路。 7・・・基準幅寸法設定回路1 9・・・偏差算出回路、  10・・・判別回路。 11・・・モータ制御回路 第1図
FIGS. 1 and 2 show an embodiment of the present invention! E
The essential configuration diagram is a graph showing a discrimination method in the discrimination circuit shown in FIG. 2... Iron plate, 3... Laser processing head. 4...Motor, 5...Vision sensor. 6...Signal conversion circuit. 7... Reference width dimension setting circuit 1 9... Deviation calculation circuit, 10... Discrimination circuit. 11...Motor control circuit diagram 1

Claims (1)

【特許請求の範囲】 レーザ発振器から発振されたレーザ光を レーザ加工ヘッドにより集光し、被加工材に照射するこ
とにより所定の形状に加工するレーザ加工装置において
、前記レーザ加工ヘッドを移動させる駆動手段と、前記
被加工材の加工寸法を設定する基準寸法設定手段と、前
記被加工材の加工後の加工寸法を検出する加工寸法検出
手段と、前記基準寸法設定手段からの基準信号と、前記
加工寸法検出手段からの検出信号を基に、その偏差を算
出する偏差算出手段と、この偏差算出手段からの偏差信
号を基に前記駆動手段を制御する駆動制御手段とを具備
したことを特徴とするレーザ加工装置。
[Scope of Claims] In a laser processing device that processes a workpiece into a predetermined shape by focusing a laser beam emitted from a laser oscillator by a laser processing head and irradiating it onto a workpiece, a drive for moving the laser processing head. means, a reference dimension setting means for setting a machining dimension of the workpiece, a machining dimension detection means for detecting a machining dimension of the workpiece after machining, a reference signal from the reference dimension setting means, and a reference signal from the reference dimension setting means; It is characterized by comprising a deviation calculation means for calculating the deviation based on a detection signal from the processing dimension detection means, and a drive control means for controlling the drive means based on the deviation signal from the deviation calculation means. Laser processing equipment.
JP1118716A 1989-05-15 1989-05-15 Laser beam machine Pending JPH02299787A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1118716A JPH02299787A (en) 1989-05-15 1989-05-15 Laser beam machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1118716A JPH02299787A (en) 1989-05-15 1989-05-15 Laser beam machine

Publications (1)

Publication Number Publication Date
JPH02299787A true JPH02299787A (en) 1990-12-12

Family

ID=14743327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1118716A Pending JPH02299787A (en) 1989-05-15 1989-05-15 Laser beam machine

Country Status (1)

Country Link
JP (1) JPH02299787A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5589090A (en) * 1994-01-31 1996-12-31 Song; Byung-Jun Laser cutting apparatus with means for measuring cutting groove width
EP0978704A2 (en) * 1998-08-03 2000-02-09 Data Technology, Inc. In-process kerf measurement system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5589090A (en) * 1994-01-31 1996-12-31 Song; Byung-Jun Laser cutting apparatus with means for measuring cutting groove width
US6031200A (en) * 1997-08-04 2000-02-29 Data Technology, Inc. In-process kerf measurement system
EP0978704A2 (en) * 1998-08-03 2000-02-09 Data Technology, Inc. In-process kerf measurement system
EP0978704A3 (en) * 1998-08-03 2000-12-27 Data Technology, Inc. In-process kerf measurement system

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