JPH03146285A - Laser processing controller - Google Patents

Laser processing controller

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Publication number
JPH03146285A
JPH03146285A JP1284870A JP28487089A JPH03146285A JP H03146285 A JPH03146285 A JP H03146285A JP 1284870 A JP1284870 A JP 1284870A JP 28487089 A JP28487089 A JP 28487089A JP H03146285 A JPH03146285 A JP H03146285A
Authority
JP
Japan
Prior art keywords
laser
processing
cutting
laser processing
conditions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1284870A
Other languages
Japanese (ja)
Inventor
Toru Nakada
亨 中田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP1284870A priority Critical patent/JPH03146285A/en
Publication of JPH03146285A publication Critical patent/JPH03146285A/en
Pending legal-status Critical Current

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  • Laser Beam Processing (AREA)
  • Lasers (AREA)

Abstract

PURPOSE:To correct an operation with a change in processing conditions and to execute exact laser processing by detecting the light from a laser processing point, judging a processing condition, correcting the processing conditions in accordance with the result of the judgment and controlling the conditions to optimum processing conditions. CONSTITUTION:A laser controller 5 starts piercing of a work 4 by irradiating the work 4 with the laser beam from a laser oscillator 1 from a processing head 2 according to a set program. CCD cameras 7, 8 photograph the light from the laser processing point, apply the same to an image processor 9 and sends the processed data to a processing diagnosis device 10. The data on the cutting conditions processed by the image processor and the data on the laser beam at the time of good cutting area diagnosed and the correction data of the laser controller 5 and a numerical controller 6 is formed and two controllers 5, 6 are subjected to the correction control in such a manner that good cutting is executed and, therefore, the generation of a cutting defect is obviated.

Description

【発明の詳細な説明】 [発明の目的コ (産業上の利用分野) 本発明はレーザ光を用いて被加工物を切断及び溶接等の
レーザ加工を制御するレーザ加工制御装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention (Industrial Application Field) The present invention relates to a laser processing control device that controls laser processing such as cutting and welding of a workpiece using laser light.

(従来の技術) 従来のレーザ加工装置は、レーザ光の制御をする制御装
置及び被加工物の移動を制御する数値制御装置等から構
成されていて、予め設定された制御プログラムに従って
前記制御装置によりレーザの、シャッタの開閉の制御、
レーザ出力の制御、加工ガスの供給及び停止を行い、ま
た、数値制御装置が被加工物が固定されたテーブルを所
定の速度で所定の方向に移動させ、これにより、被加工
物がレーザ加工されるようになっている。
(Prior Art) A conventional laser processing device is composed of a control device that controls a laser beam, a numerical control device that controls movement of a workpiece, etc., and is controlled by the control device according to a preset control program. Laser shutter opening/closing control,
The laser output is controlled, the processing gas is supplied and stopped, and the numerical control device moves the table on which the workpiece is fixed at a predetermined speed in a predetermined direction, so that the workpiece is laser-processed. It has become so.

(発明が解決しようとする課題) しかしながら、予め設定された制御プログラムに従って
各制御が行われているから、予め予期していない加工条
件の変化例えばレーザ加工の方向性の変化、被加工物の
表面に発生した錆の影響、被加工物表面の光沢の相違等
が生じた場合には、加工不良が発生してしまい、被加工
物が不良品になってしまう欠点があった。
(Problem to be Solved by the Invention) However, since each control is performed according to a preset control program, unexpected changes in processing conditions, such as changes in the directionality of laser processing, and If there is an effect of rust that occurs on the surface of the workpiece, a difference in the gloss of the surface of the workpiece, etc., processing defects will occur, resulting in the workpiece being defective.

一般的にレーザ切断加工では、切断開始時にピアシング
という被加工物への孔開は作業が必要になるが、被加工
物の板厚が厚くなるほど、また、被加工物の表面の反射
率が高くなる程時間が掛るものであり所用時間を正確に
予測することは困難である。
In general, laser cutting requires piercing to create a hole in the workpiece at the start of cutting, but the thicker the workpiece, the higher the reflectance of the workpiece's surface. It is true that it takes time, and it is difficult to accurately predict the required time.

そこで、従来は、孔開けに要する時間を数値制御装置に
プログラムする場合に、孔開けが確実になされるように
これを相当の長い時間を設定するのが一般的であるが、
このために孔開けの回数が多くなる加工例えば被加工物
から小物の部品を数多く製作するような場合には、孔開
けの必要時間が相対的に長くなり、総じて加工時間が多
くかかる欠点があった。
Therefore, conventionally, when programming the time required to drill a hole into a numerical control device, it is common to set it to a considerably long time to ensure that the hole is drilled.
For this reason, in processes that require a large number of holes to be drilled, for example, when manufacturing many small parts from a workpiece, the time required to drill the holes is relatively long, which has the disadvantage of requiring a lot of processing time overall. Ta.

従って、本発明の目的は、レーザ加工時に発生する光を
検出し、この光からレーザ加工状態を判断し、この判断
結果を基に予め設定された加工条件を補正することによ
り、総じて短時間でしかも正確なレーザ加工を実現でき
るレーザ加工制御装置を提供するにある。
Therefore, an object of the present invention is to detect the light generated during laser processing, determine the laser processing state from this light, and correct the preset processing conditions based on the result of this judgment. Moreover, it is an object of the present invention to provide a laser processing control device that can realize accurate laser processing.

[発明の構成コ (課題を解決するための手段) 本発明は、予め設定された加工条件を基にレーザ光によ
り被加工物の加工を開始するものにおいて、レーザ加工
中に生ずるレーザ加工点からの光を検出する検出手段と
、この検出手段で検出された光を基にその時点のレーザ
加工状況を判断し、その判断結果に基いて前記加工条件
を補正し、レーザ加工中常時最適加工条件によりレーザ
加工制御を行なう制御手段とを具備したことを特徴とす
るものである。
[Structure of the Invention (Means for Solving the Problems) The present invention is an apparatus that starts processing a workpiece with a laser beam based on preset processing conditions, and the present invention is directed to starting processing of a workpiece with a laser beam based on preset processing conditions. A detection means for detecting the light of The present invention is characterized by comprising a control means for controlling laser processing.

(作用) 上記した手段によれば、レーザ加工中に生ずるレーザ加
工点からの光を検出手段で検出してレーザ加工状況を判
断し、この判断結果に基いて予め設定されたレーザ加工
条件を補正しているから、レーザ加工中常時高品質なレ
ーザ加工を行うことができる。
(Function) According to the above means, the detection means detects the light from the laser processing point that occurs during laser processing to judge the laser processing situation, and based on the judgment result, the preset laser processing conditions are corrected. Because of this, high-quality laser processing can be performed at all times during laser processing.

(実施例) 以下本発明の一実施例について図面を参照して説′明す
る。レーザ発振器lからのレーザ光はレーザ加工ヘッド
2から加工テーブル3上に載置された被加工物4(以下
ワークという′)に照射される。レーザ発振器1はレー
ザ光の制御をするレーザ制御装置5により予め設定され
た制御プログラムに従ってレーザのシャッタの開閉の制
御、レーザ出力の制御、加工ガスの供給及び停止を行う
ようになっている。また、ワーク4が固定された加工テ
ーブル3は数値制御装置6により予め設定された制御プ
ログラムに従って該加工テーブル3を所定の速度で所定
の方向に移動させるようになっている。加工テーブル3
の正面及び右側方には検出手段としてのCCDカメラ7
.8が設けられ、これによって得られた画像信号が画像
処理装置9に与えられる。この画像処理装置9で処理さ
された信号は、加工診断装置10に与えられ、この加工
診断装置10で各加工状況のデータと比較されて、レー
ザ加工の状況が識別される。
(Embodiment) An embodiment of the present invention will be described below with reference to the drawings. A laser beam from a laser oscillator 1 is irradiated from a laser processing head 2 to a workpiece 4 (hereinafter referred to as a workpiece) placed on a processing table 3. The laser oscillator 1 is configured to control the opening and closing of a laser shutter, control the laser output, and supply and stop processing gas according to a control program set in advance by a laser control device 5 that controls laser light. Further, the processing table 3 to which the workpiece 4 is fixed is moved in a predetermined direction at a predetermined speed according to a control program set in advance by a numerical control device 6. Processing table 3
There is a CCD camera 7 as a detection means on the front and right side of the
.. 8 is provided, and the image signal obtained thereby is provided to an image processing device 9. The signal processed by this image processing device 9 is given to a processing diagnosis device 10, where it is compared with data of each processing situation to identify the laser processing situation.

次に上記構成の作用について第4図に示すフローチャー
トを参照しながら説明する。加工テーブル3にワーク4
がセットされて、図示しない加工開始スイッチが操作さ
れると、数値$q御装置6がテーブル3を予め設定され
たプログラムに従って移動させて、ワーク4の切断開始
位置に加工ヘッド2が対向する状態にする。すると、レ
ーザ制御装置5は予め設定されたプログラムに従ってそ
の位置でレーザ発振器1で発振されたレーザ光を加工へ
、ラド2からワーク4に照射して該ワーク4に対してピ
アシングを開始する[ステップ(a)]ピアシングの途
中には照射されたレーザ光はレーザ加工点にて反射され
て第2図に示すようにワーク4の上方に向かうが、ピア
シングが完了した時及び正常な切断がなされている時に
は、レーザ光はワーク4を貫通して第3図に示すように
下方に向かうことになる。CCDカメラ7.8はレーザ
加工点からの光を撮影して画像処理装置9に与え、この
画像処理装置9が撮影された画像を処理して処理された
データを加工診断装置10に送る[ステップ(b)]。
Next, the operation of the above configuration will be explained with reference to the flowchart shown in FIG. Workpiece 4 on processing table 3
is set and a machining start switch (not shown) is operated, the numerical $q control device 6 moves the table 3 according to a preset program, and the machining head 2 faces the cutting start position of the workpiece 4. Make it. Then, the laser control device 5 starts piercing the workpiece 4 by irradiating the laser beam emitted by the laser oscillator 1 at that position from the Radar 2 to the workpiece 4 according to a preset program [Step (a)] During piercing, the irradiated laser beam is reflected at the laser processing point and heads upwards on the workpiece 4 as shown in Figure 2, but when piercing is completed and the cutting is done normally. When the laser beam is present, the laser beam passes through the workpiece 4 and heads downward as shown in FIG. The CCD camera 7.8 photographs the light from the laser processing point and supplies it to the image processing device 9, which processes the photographed image and sends the processed data to the processing diagnosis device 10 [Step (b)].

レーザ加工点からの光が7−ク4から上方に向かってい
る時には、ステップ(c)でピアシングが完了していな
い(No)と判断され、レーザ加工点からの光がワーク
4を貫通して下方に向かうようになると、ステッ′ブ(
C)でピアシングが完了した(YES)と判断され、ス
テツブ(d)に移行し、「良好な切断時のレーザ光のデ
ータ」をデータベースから加工診断装置10に取入れる
When the light from the laser processing point is directed upward from the workpiece 4, it is determined in step (c) that piercing has not been completed (No), and the light from the laser processing point penetrates the workpiece 4. When it starts to move downward, step (
In step C), it is determined that the piercing has been completed (YES), and the process moves to step (d), where "data on laser light during good cutting" is imported from the database into the processing diagnosis device 10.

このデーターベースには、予めレーザ加工が良好な場合
に発生するレーザ光の画像データとしてレーザ切断光の
拡がり情況、飛散状況、レーザ切断方向に対するレーザ
切断光の追従飛散情況、追従法がり状況等が登録されて
いる。
This database includes image data of the laser beam generated when laser processing is good, such as the spread situation of the laser cutting light, the scattering situation, the following scattering situation of the laser cutting light in the laser cutting direction, the following situation, etc. Registered.

更にステップ(e)に移行して数値制御装置6で加工テ
ーブル3を移動させ且つレーザ制御装置5でレーザ光を
切断に適した状態に制御して、「切断実行」を行う。切
断実行中CODカメラ7゜8で撮影されて画像処理装置
9で処理された切断状況のデータと「良好な切断時のレ
ーザ光のデータ」とが加工診断装置10で常時診断され
、切断状況が良好か否かがステップ(d)で取入れた正
常な切断時のデータとの比較によりステップ(f)で判
断される。このステップ(f)で(YES)と判断され
ると、ステップ(g)に移行して切断中か否かが判断さ
れ、切断中(YES)であればステップ(e)に移行し
て切断が続行され、切断が完了(No)したならば、次
のプロセスに移行する(ステップh)。
Further, in step (e), the numerical control device 6 moves the processing table 3, and the laser control device 5 controls the laser beam to a state suitable for cutting, thereby performing "cutting". During cutting, cutting status data photographed by the COD camera 7°8 and processed by the image processing device 9 and "data of laser light during good cutting" are constantly diagnosed by the processing diagnostic device 10, and the cutting status is checked. Whether or not the cut is good is determined in step (f) by comparison with the normal cutting data taken in step (d). If it is determined (YES) in this step (f), the process moves to step (g), where it is judged whether or not cutting is in progress, and if cutting is in progress (YES), the process moves to step (e), where cutting is performed. If the process continues and the cutting is completed (No), the process moves to the next process (step h).

例えば切断が不良でステップ(f)で(NO)と判断さ
れると、ステップ(i)に移行して、予め登録されてい
る補正制御手法に基いて「レーザ制御装置の補正データ
を作成」シ、ステップ(j)即ち「レーザ制御装置の作
動を補正」に移行して上記の補正データに基いて例えば
レーザ出力補正制御、レーザ周波数補正制御、レーザパ
ルス力補正制御指令等を出力してレーザ制御装置5の各
種の制御条件を補正制御し、次に、ステップ(k)に移
行して予め登録されている補正制御手法に基いて「数値
制御装置の補正データを作成」し、ステップ(fI)に
移行して上記の補正データに基いて「数値制御装置によ
る加工テーブルの移動を補正」して数値制御装置5の移
動速度等の条件を補正し、上記のようにレーザ制御装置
6によりレーザ発振装置1を補正制御するとともに、数
値制御装置6により加工テーブル3の移動を補正制御後
、ステップ(e)に移行して更に切断を続行する。
For example, if the cutting is defective and it is determined (NO) in step (f), the process moves to step (i) and the "Create correction data for the laser control device" system is executed based on the pre-registered correction control method. , proceed to step (j), that is, "correct the operation of the laser control device", and output, for example, laser output correction control, laser frequency correction control, laser pulse force correction control commands, etc. based on the above correction data to control the laser. Various control conditions of the device 5 are corrected and controlled, and then the process moves to step (k) to "create correction data for the numerical control device" based on the pre-registered correction control method, and step (fI) Then, based on the above correction data, "correct the movement of the processing table by the numerical control device" to correct conditions such as the moving speed of the numerical control device 5, and as described above, the laser control device 6 starts laser oscillation. After the apparatus 1 is corrected and the movement of the processing table 3 is corrected and controlled by the numerical control device 6, the process moves to step (e) to further continue cutting.

上記した実施例では、レーザ加工点からの光をCCDカ
メラ7.8で常に監視してピアシング加工が完了したら
直ちに切断加工に移行できるから、ワーク4の厚さの誤
差とか表面状態を考慮してピアシング時間を長めに設定
するという必要が無くなり、ピアシング加工の個数が多
いものに対しても必要最小限の時間で切断の行程に移行
できるから、ピアシングの時間を長めに設定した従来の
場合に比べて、ピアシングの数が多い場合でも加工に要
する時間は必要最小限にできる。
In the above-mentioned embodiment, the light from the laser processing point is constantly monitored by the CCD camera 7.8, and the cutting process can be started immediately after the piercing process is completed. There is no longer a need to set a long piercing time, and even for items with a large number of piercings, it is possible to move on to the cutting process in the minimum amount of time required, compared to the conventional case where the piercing time was set longer. Therefore, even if there are a large number of piercings, the time required for processing can be minimized.

また、切断中も正常状態でない事が判断されると、レー
ザ制御装置5及び数値制御装置6が正常な切断がなされ
るように補正制御されるから、切断不良が生ずる虞も無
い。
Further, if it is determined that the cutting state is not normal during cutting, the laser control device 5 and the numerical control device 6 are corrected and controlled so that the cutting is performed normally, so there is no risk of cutting defects.

また、上記した実施例では、CCDカメラ7゜8で二方
向からレーザ加工点からの光を画像として得ているから
、画像を立体的に判断する事ができ、判断の結果が一層
正確にできるが、勿論一方向のみから画像を検出するよ
うにしても良い。
In addition, in the above embodiment, since the CCD camera 7°8 is used to obtain images of the light from the laser processing point from two directions, the images can be judged three-dimensionally, making the judgment results more accurate. However, it is of course possible to detect the image from only one direction.

尚、上記の説明ではレーザ光で切断を行う場合を一例と
して説明しているが、レーザ溶接或いはレーザ熱処理等
にも同様にして適用できる。
In addition, although the above description is based on an example in which cutting is performed with a laser beam, the present invention can be similarly applied to laser welding, laser heat treatment, or the like.

また、画像処理装置9の代わりにレーザ加工点からの光
を検出する検出手段としてスペクトラル分析装置を用い
て光の色を検出し、色のデータをもとに加工の状況の識
別及び判断を行うようにしても良い。
In addition, instead of the image processing device 9, a spectral analyzer is used as a detection means for detecting light from a laser processing point to detect the color of the light, and the processing status is identified and judged based on the color data. You can do it like this.

また、画像処理装置9の代わりにレーザ加工点からの光
を検出する検出手段として温度分布分析装置を用いて光
の温度分布を検出し、温度分布のデータをもとに加工の
状況の識別及び判断を行うようにしても良い。
Also, instead of the image processing device 9, a temperature distribution analyzer is used as a detection means for detecting light from the laser processing point to detect the temperature distribution of the light, and the processing status can be identified and processed based on the temperature distribution data. You may also choose to make a judgment.

[発明の効果] 本発明は以上の説明から明らかなように、予め設定され
た加工条件を基にレーザ光により被加工物の加工を開始
するものにおいて、レーザ加工中に生ずるレーザ加工点
からの光を検出する検出手段と、この検出手段で検出さ
れた光を基にその時点のレーザ加工状況を判断し、その
判断結果に基いて前記加工条件を補正し、レーザ加工中
常時最適加工条件によりレーザ加工制御を行なう制御手
段とを具備したことを特徴とするものであり、加工条件
の変化に適切に対応して動作の補正をすることができ、
総じて短時間でしかも正確なレーザ加工を行うことがで
きる。
[Effects of the Invention] As is clear from the above description, the present invention starts machining of a workpiece with a laser beam based on preset machining conditions, and the present invention reduces the amount of damage from the laser machining point that occurs during laser machining. A detection means for detecting light, and the laser processing situation at the time is judged based on the light detected by this detection means, and the processing conditions are corrected based on the judgment result, so that the optimum processing conditions are always maintained during laser processing. The present invention is characterized in that it is equipped with a control means for controlling laser processing, and is capable of correcting the operation in response to changes in processing conditions appropriately.
Overall, accurate laser processing can be performed in a short time.

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本発明の一実施例を示すものであり、第1図は概
略的構成図、第2図及び第3図はレーザ加工点からの光
の状況を示す図、第4図はフローチャートである。 図面中、1はレーザ発振器、3は加工テーブル、5はレ
ーザ制御装置、6は数値制御装置、7,8はCCDカメ
ラ(検出手段)、9は画像処理装置、10は加工診断装
置である。
The drawings show one embodiment of the present invention, and FIG. 1 is a schematic configuration diagram, FIGS. 2 and 3 are diagrams showing the state of light from a laser processing point, and FIG. 4 is a flow chart. . In the drawing, 1 is a laser oscillator, 3 is a processing table, 5 is a laser control device, 6 is a numerical control device, 7 and 8 are CCD cameras (detection means), 9 is an image processing device, and 10 is a processing diagnosis device.

Claims (1)

【特許請求の範囲】[Claims] 1、予め設定された加工条件を基にレーザ光により被加
工物の加工を開始するものにおいて、レーザ加工中に生
ずるレーザ加工点からの光を検出する検出手段と、この
検出手段で検出された光を基にその時点でのレーザ加工
状況を判断し、この判断結果に基いて前記加工条件を補
正し、レーザ加工中常時最適加工条件によりレーザ加工
制御する制御手段とを具備したことを特徴とするレーザ
加工制御装置。
1. In a device that starts processing a workpiece with a laser beam based on preset processing conditions, a detection means for detecting light from a laser processing point generated during laser processing, and a detection means for detecting light from a laser processing point generated during laser processing, and The present invention is characterized by comprising a control means for determining the current state of laser processing based on the light, correcting the processing conditions based on the judgment result, and controlling the laser processing using the optimum processing conditions at all times during laser processing. Laser processing control device.
JP1284870A 1989-11-02 1989-11-02 Laser processing controller Pending JPH03146285A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1284870A JPH03146285A (en) 1989-11-02 1989-11-02 Laser processing controller

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1284870A JPH03146285A (en) 1989-11-02 1989-11-02 Laser processing controller

Publications (1)

Publication Number Publication Date
JPH03146285A true JPH03146285A (en) 1991-06-21

Family

ID=17684101

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1284870A Pending JPH03146285A (en) 1989-11-02 1989-11-02 Laser processing controller

Country Status (1)

Country Link
JP (1) JPH03146285A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997025177A1 (en) * 1996-01-05 1997-07-17 Lazare Kaplan International, Inc. Laser marking system for gemstones and method of authenticating marking
JP2014005372A (en) * 2012-06-25 2014-01-16 Nitto Denko Corp Adhesive film
JP2016087648A (en) * 2014-11-05 2016-05-23 東芝機械株式会社 Laser processing device and laser processing method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997025177A1 (en) * 1996-01-05 1997-07-17 Lazare Kaplan International, Inc. Laser marking system for gemstones and method of authenticating marking
US5932119A (en) * 1996-01-05 1999-08-03 Lazare Kaplan International, Inc. Laser marking system
US7655882B2 (en) 1996-01-05 2010-02-02 Lazare Kaplan International, Inc. Microinscribed gemstone
JP2014005372A (en) * 2012-06-25 2014-01-16 Nitto Denko Corp Adhesive film
US9302344B2 (en) 2012-06-25 2016-04-05 Nitto Denko Corporation Pressure-sensitive adhesive film
US10293435B2 (en) 2012-06-25 2019-05-21 Nitto Denko Corporation Pressure-sensitive adhesive film
JP2016087648A (en) * 2014-11-05 2016-05-23 東芝機械株式会社 Laser processing device and laser processing method

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