JPH0952187A - Laser beam machine system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a laser beam machine system capable of correcting high efficiency machining condition and executing precise detection of piercing through for any state of system and any material/thickness of object to be machined. SOLUTION: In a laser beam machine system, a controller 104 is provided with a distance correspondence piercing detection information correcting part 6 to correct piercing detection information corresponding to the state of machine system, a material correspondence piercing detection information correcting part 7 to correct piercing detection information corresponding to a material of object to be machined and a thickness correspondence piercing detection information correcting part 8 to correct piercing detection information corresponding to a thickness of object to be machined. Further, the controller is provided with a piercing condition correcting part 3 to correct machining condition when executing detection of piercing through based on the corrected piercing through detection information and discriminating a possibility of generating piercing through and a corrected piercing condition storing part 4 to register the corrected machining condition.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing machine system for performing laser processing such as cutting and welding on a workpiece using laser light.

[0002]

2. Description of the Related Art A two-dimensional laser processing machine is used for processing a flat plate in a non-contact manner at high speed and with high precision. In a two-dimensional laser processing machine, a processing head is controlled by X, Y, and Z axes, and a workpiece (hereinafter appropriately referred to as a work) is processed by using laser light guided from a laser oscillator and output from a tip of the processing head. In general, it was not possible to detect piercing. It was often found only after light emission occurred on the back surface of the work during piercing.

Here, the configuration of a conventional general two-dimensional laser beam machine will be described with reference to FIGS. A machining head 101 is attached to the tip of the Z axis 100. 1
Reference numeral 08 is a Z-axis guide for guiding the movement of the machining head 101 in the arrow Z direction by the motor M3, 109 is a Y-axis guide for guiding the movement of the machining head 101 in the arrow Y direction by the motor M2, and 110 is a machining table 102 by the motor M1.
2 is an X-axis guide for guiding the movement of the arrow in the X direction. The motors M1 to M3 drive the drive signal M from the control device 104.
Driven by the machining program, the spot of the laser light L is controlled to follow the machining line K while keeping the distance of the machining head 101 to the workpiece W constant. Further, a distance sensor (not shown) attached to the tip of the processing head 101 in order to keep the distance of the processing head 101 to the work W constant is a work W and the processing head 1.
The distance to 01 is measured, the measurement signal is fed back to the control device 104, and the spot of the laser light L is finally controlled. Further, the control unit 104 is connected to a hand operation box 107 used at the time of detecting a focus position and the like. 105
Is a laser oscillator for outputting laser light, 103 is the above X,
It is a processing machine main body including a guide mechanism in the three Y-axis directions.

Further, as a laser processing machine, a control means for controlling the detection means for detecting the light generated from the work by the irradiation of the laser beam and the laser oscillator and for inputting the detection light amount signal detected by the detection means. It is known that the processing condition of the work can be monitored by the change of the detection light amount signal detected by the detection means. For example, JP-A-6-91384,
JP-A-6-142960 and the like are known.

[0005]

In the conventional laser processing machine system as described above, the value (information) serving as a judgment standard is fixed when the pierce penetration which is the end of the piercing processing is detected. There was a risk of erroneous detection of pierce penetration if the actual reference value differs depending on the state, the material and plate thickness of the work piece.

Further, it is difficult to set the optimum piercing condition, and the worker manually corrects (changes) the piercing condition by trial and error, so that the procedure (point) and the resetting by each worker are performed. Different piercing conditions,
The efficiency of the work to correct the piercing conditions was poor.

The present invention has been made in order to solve the above-mentioned problems, and the level of pierce penetration detection is corrected according to the system state, the material and plate thickness of the workpiece, and any system state With respect to the material and plate thickness of the work piece, there is no variation between individual workers,
(EN) A laser processing machine system capable of performing accurate pierce penetration detection.

Another object of the present invention is to obtain a laser beam machine system capable of efficiently correcting piercing conditions.

[0009]

A laser beam machine system according to the present invention is a laser beam machine which irradiates a laser beam output from a laser oscillator to a workpiece by a machining head and performs processing. In a laser processing machine system including a detection unit that detects reflected light emitted from the workpiece and a control unit that controls the laser oscillator and that inputs a detection signal from the detection unit, the control unit is a processing unit. System state corresponding correction means for correcting the pierce penetration detection information according to the machine system state, and material correspondence correction means for correcting the pierce penetration detection information according to the material of the workpiece and the plate thickness of the workpiece Pierce penetration detection information to correct the pierce penetration detection information and the pierce penetration detection information based on the corrected piercing penetration detection information. Pierce penetration possibility judging means for judging whether it is appropriate, piercing condition correcting means for correcting the piercing condition when it is judged not suitable, and procedure storing means for storing the procedure corrected by the piercing condition correcting means When,
And a piercing condition registration means for registering the modified piercing condition.

The system state correspondence correcting means calculates the distance from the actual position of the processing head to the detecting means in response to the change in the optical path length from the processing head to the detecting means due to the movement of the processing head. According to the attenuation of the reflected light, the intensity of the detection signal input from the detection means to the control unit is corrected, and the intensity of the detection signal is corrected to be constant.

Further, when the attenuation of the reflected light changes depending on the material of the workpiece, the material-corresponding correcting means detects the input from the detecting means to the control section according to the laser output applied to the workpiece. The strength of the signal is corrected, and the strength of the detection signal is kept constant.

Further, when the attenuation of the reflected light changes depending on the plate thickness of the workpiece, the plate-thickness correction means is input from the detecting means to the control section according to the laser output applied to the workpiece. The intensity of the detection signal is corrected so that the intensity of the detection signal is kept constant.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION

First Embodiment of the Invention Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view of a two-dimensional laser beam machine system that monitors piercing through during piercing. 1A is a detection processing unit that constitutes a pierce penetration detection unit that detects pierce penetration, 1B is a light receiving element that constitutes a pierce penetration detection unit, and 100 is a processing head 10.
Z-axis unit that can move 1 in the Z-axis direction, 10
2 is a processing table, 103 is a processing machine main body, 104 is a control device for the processing machine main body 103, and 105 is a laser oscillator for generating a laser beam used for processing. 2 is the control device 1
04 is a pierce detection information correction unit built in the NC control unit, and a distance for correcting the pierce penetration detection information according to the state of the processing machine system, that is, the change in the optical path length from the processing head 101 to the light receiving element 1B. Corresponding pierce penetration detection information correction unit 6, material compatible pierce penetration detection information correction unit 7 that corrects pierce penetration detection information depending on the material of the workpiece, plate thickness compatible piercing that corrects pierce penetration detection information by the plate thickness of the workpiece It has a penetration detection information correction unit 8. 3 is NC
A piercing condition correction unit built in the control unit, and when processing is performed using the pierce penetration detection information corrected by the pierce detection information correction unit 2 but it takes too long to penetrate the pierce. Has a piercing condition correction procedure storage unit 9 capable of performing correction so as to appropriately perform piercing and storing the procedure of the correction. Reference numeral 4 denotes a modified piercing condition storage unit built in the NC control unit, which takes time to pierce the pierce even though processing is performed using the pierce penetration detection information modified by the piercing detection information modification unit 2. Optimal piercing condition storage unit 10 which corrects and stores the piercing condition when it takes too much time.
It consists of.

FIG. 2 is a schematic view of a piercing penetration detecting device of a two-dimensional laser processing machine system that monitors piercing penetration during piercing. In FIG. 2, reference numeral 1 denotes a pierce penetration detector that monitors the reflected light generated on the surface of the workpiece and monitors the occurrence of pierce penetration. Reference numeral 104 denotes a detection information correction unit 2 that corrects pierce penetration detection information; and a piercing condition correction unit (not shown) that further corrects piercing conditions when piercing penetration occurs, but stores a procedure required for the correction. An NC having a modified working condition storage unit (not shown) for storing the modified piercing condition as a new piercing condition.
It is a control unit. Reference numeral 101 is a processing head, 103 is a processing machine main body, 105 is a laser oscillator for generating a laser beam used for processing, 106 is an operation unit for sending an instruction to an NC control unit, 1
Reference numeral 07 is a hand operation box for making a slight correction of the processing head 101. The detection information correction unit 2 includes a pierce penetration detection information storage unit 11, a pierce penetration detection information reading unit 12, a system state storage unit 13, a distance-based pierce penetration detection information correction unit 14, and a processing material storage unit 16, Pierce penetration detection information correction unit 17 and processed plate thickness setting unit 18 by processing material,
It is composed of a pierce penetration detection information correction unit 19 depending on the plate thickness.

FIG. 3 is a flowchart of a two-dimensional laser beam machine system that monitors piercing through during piercing. The operation of monitoring the pierce penetration will be described below with reference to FIG. The pierce penetration detection information Pi is read in the pierce penetration detection information read work step (step S1). Pierce penetration detection information end completion determination work step (step S2) for determining whether correction of piercing penetration detection information has been completed
If the correction of the pierce penetration detection information is not completed, the system state of the processing machine is checked in step S3, and the pierce penetration detection information correction step (step S4) according to the system state is performed according to the system state. Correct the detection information. Subsequently, in step S5, the material of the workpiece (work) being processed is checked, and in the step (step 6) of correcting the pierce penetration detection information depending on the material of the work, the pierce penetration detection information is modified according to the work material. Then, in step S7, a change in the machining output is examined from the feature that the machining output varies depending on the plate thickness during machining, and in the step of correcting the pierce penetration detection information by the plate thickness of the work (step S8) Correct the penetration detection information. Step S2
Then, when the correction of the information is completed, the process proceeds to step S9.

Embodiment 2 of the Invention Next, a second embodiment of the present invention will be described with reference to FIGS. FIG.
Is the state of the processing machine system, that is, the pierce penetration detection information is corrected based on the change in the optical path length from the tip of the processing head 101 to the reflected light detection unit (light receiving element) 1B (corresponding to steps S3 and S4 in FIG. 3). It is a figure showing the details of the distance corresponding pierce penetration detection condition modification part. In the figure, 1A, 1
B, 100 to 103, and 105 are the same as those in FIG. 1 described above, and a description thereof will be omitted. 104 is a processing machine main body 103
The distance-compatible pierce penetration detection information correction unit 6 in the control device 104 reads out the pierce penetration detection information stored in the pierce penetration detection information storage unit 11 in the control device 104. Detection information reading unit 1
2. The system state stored in the system state storage unit 13 in the control device 104 is monitored, the change amount of the optical path length from the processing head tip to the reflected light detection unit is calculated, and read based on the calculated result. The pierce penetration detection information correction unit 14 according to the distance for correcting the pierce penetration detection information.

FIG. 5 is a diagram showing a flowchart of the distance-corresponding pierce penetration detection information correction unit 6 shown in FIG. Hereinafter, the operation for correcting the pierce penetration detection condition for distance will be described with reference to FIG. The pierce penetration detection information Pi stored in the control parameter storage unit is read by the pierce penetration detection information reading unit 12 (step S1), and the current position of the machining head is stored in the system state storage unit 13 as the machining head The current position is taken out (step S16), the increase in optical path length from the reference position is calculated from the current value (step S17), and the correction coefficient is calculated from the increase in optical path length calculated in step S17.

The correction coefficient is obtained by a simple arithmetic operation. α = ΔL / constant The constant of the molecule is determined from the processing machine system configuration, but in this embodiment, it is 250. If further correction is required, this constant can be changed.

Embodiment 3 of the Invention Next, a third embodiment of the present invention will be described with reference to FIGS. Figure 6
Shows details of the material-corresponding pierce penetration detection condition correction unit that corrects the burning detection information (corresponding to steps S5 and S6 in FIG. 3) corresponding to the material of the workpiece used in the two-dimensional laser beam machine system. It is a figure. In the figure, 1A, 1
B, 100 to 103, and 105 are the same as those in FIG. 1 described above, and a description thereof will be omitted. 104 is a processing machine main body 103
Control device. The material-compatible pierce penetration detection information correction unit 7 in the control device 104 reads out the pierce penetration detection information stored in the pierce penetration detection information storage unit 11 in the control device 104.
2. The pierce penetration detection information correction unit 17 by the material that corrects the pierce penetration detection information read based on the material information stored in the processing material storage unit 16 in the control device 104.
It is composed of

FIG. 7 is a diagram showing a flow chart of the material corresponding pierce penetration detection information correction unit 7 shown in FIG. The pierce penetration detection condition correction operation corresponding to the work material will be described below with reference to FIG. 7. The pierce penetration detection information Pi stored in the control parameter storage unit is read by the pierce penetration detection information reading unit 12 (step S1), and the workpiece material currently being machined is retrieved from the machining condition parameter storage unit (step S20). It is judged whether the reflectance of the work material is high or low (step S21), and step S21.
A correction coefficient is determined from the level of the reflectance calculated in step S22 (step S22).

Fourth Embodiment of the Invention Next, a fourth embodiment of the present invention will be described with reference to FIGS. FIG.
Is a detail of the plate thickness corresponding pierce penetration detection condition correction unit that corrects the burning detection information corresponding to the plate thickness of the workpiece used in the two-dimensional laser beam machine system (corresponding to steps S7 and S8 in FIG. 3). It is the figure which showed. In the figure, 1A, 1
B, 100 to 103, and 105 are the same as those in FIG. 1 described above, and description thereof will be omitted. 104 is a processing machine main body 10
The pierce penetration detection information correction unit 8 corresponding to the plate thickness corresponding to the control device No. 3 in the control device 104 reads out the pierce penetration detection information stored in the pierce penetration detection information storage unit 11 in the control device 104. Pierce penetration detection information reading unit 1
2. A pierce penetration detection information correction unit 19 based on the plate thickness that corrects the pierce penetration detection information read based on the plate thickness information set by the processed plate thickness setting unit 18 in the control device 104.
It is composed of

FIG. 9 is a diagram showing a flow chart of the plate thickness corresponding pierce penetration detection information correction unit 8 shown in FIG. The pierce penetration detection condition correction operation corresponding to the plate thickness of the work will be described below with reference to FIG. The pierce penetration detection information Pi stored in the control parameter storage unit is read by the pierce penetration detection information reading unit 12 (step S1), and the plate thickness t of the workpiece currently being machined is taken out from the machining condition parameter storage unit. (Step S24), a correction coefficient is determined from the output (step S25).

Fifth Embodiment of the Invention Next, a fifth embodiment of the present invention will be described with reference to FIGS. FIG. 10 shows that the control unit automatically corrects the piercing conditions in the control unit so that the piercing process can be performed quickly and stably during the piercing process, and the correction procedure required for the correction is used as procedure data.
It is the figure which showed the piercing condition correction procedure memory | storage part which can be memorize | stored and using this procedure, when performing a correction with respect to a new to-be-processed object, and performing correction easily. In the figure, 1
A, 1B, 100 to 103, and 105 are the same as those in FIG. 1 described above, and a description thereof will be omitted. Reference numeral 104 denotes a control device for the processing machine body 103. Piercing condition correction procedure storage unit 9
Is a piercing condition correction procedure registration unit 22 in the machining condition parameter storage unit that stores the correction procedure, and a piercing condition that corrects the piercing condition using the procedure stored in the piercing condition correction procedure registration unit 22. It is composed of a correction unit 20 and a piercing condition correction procedure storage processing unit 21 which adds a correction procedure to the procedure when a modification is made on the procedure.

FIG. 11 is a flowchart of the piercing condition correction procedure storage unit 9 shown in FIG. The piercing condition correction procedure storing operation will be described below with reference to FIG. When the piercing detection is started (step S27) and the piercing conditions are not appropriate (step S28), the piercing condition correcting procedure for each material / plate thickness already registered in the piercing condition correcting procedure registration unit 22 is referred to. (Step S29), the piercing condition is modified (step S30), and the procedure required for the modification in step S30 is newly added to the piercing condition modification procedure storage processing unit 21 as a modification procedure (step S31A).
The piercing condition modification procedure registration unit 22 registers the modification procedure added by the piercing condition modification procedure storage processing unit 21 in the machining condition parameter storage unit for each material / plate thickness.

Sixth Embodiment of the Invention Next, a sixth embodiment of the present invention will be described with reference to FIG. Figure 12
During the piercing process, the control unit automatically corrects the piercing conditions in the control unit so that the piercing process can be performed quickly and stably, and the piercing conditions at the time when the piercing process is completed are registered in the control unit, and a new workpiece is processed. It is the figure which showed the correction piercing condition storage part which can be processed to the thing from the beginning on the said conditions. In the figure, 1A, 1B, 100 to 103 and 105
Are the same as those in FIG. 1 described above, and description thereof will be omitted.
Reference numeral 104 denotes a control device for the processing machine body 103. The modified piercing condition storage unit 10 includes a modified piercing condition registration unit 25 in the processing condition parameter storage unit in which the correction procedure is stored.
And a modified piercing condition storage unit 24 that stores the modified piercing condition by referring to the piercing condition stored in the modified piercing condition registration unit 25 and modifying the piercing condition. ing.

A piercing condition correction procedure storing operation by the corrected piercing condition storing unit 10 will be described with reference to FIG. 11 described in the fifth embodiment. When the piercing detection is started (step S27) and the piercing conditions are not appropriate (step S28), the corrected piercing conditions for each material / plate thickness already registered in the corrected piercing condition registration unit 25 are referred to (step S29). ), Correct the piercing conditions (step S3
0), step S30 in the modified piercing condition storage processing unit 24.
The piercing condition modified in step S31B is added as an optimum piercing condition (step S31B). Modified piercing condition storage processing unit 24
The optimum piercing conditions added in step 3 are registered in the processing condition parameter storage unit by the modified piercing condition registration unit 25 for each material / plate thickness.

By the way, the above description refers to the present invention as the control device 1
Although it has been described as an example in which it is built in 04 and used in a two-dimensional laser processing machine, it can be installed outside the control device to detect pierce penetration and correct piercing conditions.

[0028]

Since the present invention is constructed as described above, it has the following effects.

By detecting the occurrence of pierce penetration, correcting the machining conditions, and registering the machining conditions, it is possible to detect the occurrence of pierce penetration appropriately for individual workpieces, and at the same time, process the workpieces. When changing an object, the processing conditions can be efficiently corrected, and good processing can be efficiently performed on individual workpieces.

Further, in response to the change in the optical path length from the processing head to the detecting means, the attenuation of the reflected light is corrected and the occurrence of the pierce penetration is detected, so that the processing head moves and the processing head moves to any position. Even if there is, there is an effect that it is possible to appropriately detect and prevent the occurrence of piercing.

Further, the attenuation of the reflected light is corrected according to the material of the work piece, and the occurrence of the pierce penetration is detected to detect the appropriate pierce penetration for various work materials of different materials. There is an effect that it is possible to detect and prevent.

Further, by correcting the attenuation of the reflected light and detecting the occurrence of piercing through according to the material of the workpiece, the piercing through the various workpieces having different plate thicknesses can be performed appropriately. It is possible to detect and prevent the occurrence.

[Brief description of drawings]

FIG. 1 is a perspective view of a laser processing machine system according to a first embodiment of this invention.

FIG. 2 is a schematic diagram of a pierce penetration detecting device for a laser beam machine according to the first embodiment of the present invention.

FIG. 3 is a flowchart of pierce penetration detection operation of the laser beam machine according to the first embodiment of the present invention.

FIG. 4 is a diagram showing a pierce penetration detection condition correction unit according to a state of a laser beam machine according to a second embodiment of the present invention.

FIG. 5 is a diagram showing a flowchart of a pierce penetration detection condition correction unit according to the state of the laser beam machine according to the second embodiment of the present invention.

FIG. 6 is a diagram showing a pierce penetration detection condition correction unit according to the material of a laser beam machine according to a third embodiment of the present invention.

FIG. 7 is a diagram showing a flowchart of a pierce penetration detection condition correction unit according to the material of a laser beam machine according to a third embodiment of the present invention.

FIG. 8 is a diagram showing a pierce penetration detection condition correction unit according to the plate thickness of a laser beam machine according to a fourth embodiment of the present invention.

FIG. 9 is a view showing a flowchart of a pierce penetration detection condition correction unit according to the plate thickness of a laser beam machine according to a fourth embodiment of the present invention.

FIG. 10 is a diagram showing a piercing condition correction procedure storage unit of a laser beam machine according to a fifth embodiment of the present invention.

FIG. 11 is a diagram showing a piercing condition storage unit of a laser beam machine according to a fifth embodiment of the present invention.

FIG. 12 is a flowchart of a piercing condition correction procedure storage unit of the laser beam machine according to the sixth embodiment of the present invention.

FIG. 13 is a configuration diagram of a conventional general two-dimensional laser processing machine.

FIG. 14 is a configuration diagram of each axis of a conventional general two-dimensional laser beam machine.

[Explanation of symbols]

1A, 1B Pierce penetration detection section, 2 Pierce penetration detection information modification section, 3 Pierce condition modification section, 4 Pierce condition storage section, 6 Distance compatible pierce penetration detection information modification section, 7 Material compatible pierce penetration detection information modification section, 8 Plates Thickness compatible pierce penetration detection information correction unit, 9 Pierce condition correction procedure storage unit, 1
0 optimum piercing condition storage unit, 11 piercing penetration detection information storage unit, 101 processing head, 103 processing table,
104 control unit, 105 oscillator.

Claims (4)

[Claims] 1. A processing machine for irradiating a workpiece with a laser beam output from a laser oscillator by a processing head for processing, and detection for detecting reflected light emitted from the workpiece irradiated with the laser beam. Means, and a laser processing machine system comprising a control unit for controlling the laser oscillator and inputting a detection signal from the detection unit,
The control unit is a system state correspondence correction unit that corrects pierce penetration detection information according to the state of the processing machine system, a material correspondence correction unit that corrects pierce penetration detection information according to the material of the workpiece, and A plate thickness corresponding correction means for correcting the pierce penetration detection information according to the plate thickness of the work piece, and the pierce penetration detection based on the corrected pierce penetration detection information, and whether or not the amount of the reflected light is appropriate Pierce penetration possibility judging means for judging whether it is appropriate, piercing condition correcting means for correcting the piercing condition when it is judged not suitable, procedure storing means for storing the procedure corrected by this piercing condition correcting means, and A laser beam machine system comprising: a piercing condition registration means for registering piercing conditions. 2. The system state correspondence correction means calculates the distance from the actual position of the processing head to the detection means in response to a change in the optical path length from the processing head to the detection means due to movement of the processing head. The intensity of the detection signal input from the detection means to the control unit is corrected according to the attenuation of the reflected light, and the intensity of the detection signal is corrected to be constant. The laser processing machine system described in 1. 3. The material-corresponding correction means, when the attenuation of reflected light changes depending on the material of the work piece, is detected by the detection means according to the laser output applied to the work piece. 3. The laser processing machine system according to claim 1, wherein the intensity of the signal is corrected and the intensity of the detection signal is maintained constant. 4. When the attenuation of reflected light changes depending on the plate thickness of the work piece, the plate thickness correspondence correction means inputs from the detection means to the control section according to the laser output applied to the work piece. 4. The laser processing machine system according to claim 1, wherein the intensity of the detection signal is corrected so as to keep the intensity of the detection signal constant.