JPH04162378A - Solid camera device - Google Patents

Abstract

PURPOSE:To easily connect a solid camera element to a peripheral circuit module so as to contrive improvement of assembly workability and miniaturization by arranging the first substrate provided with the solid camera element and the second substrate provided with the peripheral circuit element so that reverse surfaces of the substrates are faced to each other, and interposing a conducting terminal to connect electrodes. CONSTITUTION:Mounting work on the first substrate 2 provided with a solid camera element 1 and mounting work on the second substrate 9 provided with a peripheral circuit element 8 are individually performed, and the fellow reverse surfaces of the first/second substrates 2, 9 are electrically connected to assemble a solid camera device only by interposing finally conducting terminals 7, 13 between electrodes 6, 12 in the reverse surfaces of the first/second substrates 2, 9. Further by arranging various parts between the substrates 2, 9, an area of the substrates can be decreased. In this way, the device can be miniaturized by improving assembly workability of the device while facilitating connecting the solid camera element to the peripheral circuit module.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a solid-state imaging device having a solid-state imaging device and its peripheral circuit elements.

[Prior Art] In recent years, solid-state imaging devices have come to be widely used as imaging devices for devices such as endoscopes and VTRs.

For example, when this solid-state imaging device is used in an endoscope, the solid-state imaging device is provided within the distal end of the endoscope insertion section. Therefore, considering the reduction in diameter and size of the distal end of the endoscope insertion section, the solid-state imaging device is also required to be small. Conventionally, as such a compact solid-state imaging device, one disclosed in Japanese Unexamined Patent Publication No. 63-43353 is known. This solid-state imaging device is configured as shown in FIG. That is, the solid-state image sensor 50
and a peripheral circuit element 53 including a drive circuit are each mounted on the same substrate 5.
Die bonding is performed on the upper and lower surfaces of 2 to form a polymer structure. Further, by sealing the solid-state imaging element 50 and the peripheral circuit element 53 with a transparent resin 51, these pixel elements 50 and 53 are integrated.

Further, the electrical connection between the solid-state image sensor 50 and the peripheral circuit element 53 is performed by wire-bonding the solid-state image sensor 50 and the electrode 55 connected to the peripheral circuit element 53 using a wire 56. Circuit element 5
On the third side, an external lead 54 is connected to the electrode 55.

[Problems to be Solved by the Invention] By the way, the surface side of the board 52 on which the peripheral circuit element 53 is mounted is often a peripheral circuit module in which the peripheral circuit element 53 and external components are integrated. . In such a case, in the conventional configuration described above in which the solid-state image sensor 50 and the peripheral circuit element 53 are integrated on the same substrate 52, even the task of mounting the solid-state image sensor 50 and the peripheral circuit element 53 on the same substrate 52 is difficult. Although it is complicated, if external parts are also mounted in addition, the work becomes extremely complicated, and there is a possibility that assembly of the solid-state imaging device 57, etc., becomes difficult.

In addition, in the above conventional configuration, the external parts, etc.
They are mounted on the same plane of the board 52 on which the peripheral circuit elements 53 are mounted, and as the number of external components increases, the area of the board 52 increases accordingly.

Therefore, this may become a major obstacle to miniaturization of the solid-state imaging device 57.

The present invention has been made in view of the above circumstances, and its purpose is to easily connect a solid-state image sensor and a peripheral circuit module, and to provide a compact solid-state image sensor that is easy to assemble. It is about providing.

[Means for Solving the Problems] In order to achieve the above problems, the present invention was configured as follows. That is, in a solid-state imaging device in which a peripheral circuit element is attached to a solid-state image sensor, a first substrate on which the solid-state image sensor is provided and a second substrate on which the peripheral circuit element is provided are placed so that their back surfaces are mutually connected. The electrodes are arranged facing each other and are connected to each other by interposing a conductive terminal such as an anisotropic conductive adhesive or a bump between the corresponding electrodes provided on the raccoon side of each of the substrates. Further, a flexible printed wiring board is interposed between the back surfaces of the first board and the second board, and the electrodes of each of the boards are connected to the wiring of this wiring board.

[Function] With the above configuration, the mounting operation on the first substrate on which the solid-state image sensor is provided, and the mounting operation on the second substrate on which the peripheral circuit element is provided.
This is done separately from the mounting work on the first substrate, and in the end, the first substrate and the second substrate are assembled by simply interposing a conductive terminal between the electrodes on the back surface of the first substrate and the back surface of the second substrate. A solid-state imaging device can be assembled by electrically connecting the back surfaces of the second substrates.

[Example] FIG. 1 shows a first embodiment of the invention.

The solid-state imaging device 14 includes a substantially flat solid-state imaging device substrate (first substrate) −5=2 on which the solid-state imaging device 1 is mounted, and a flat peripheral circuit on which peripheral circuit elements 8 including a drive circuit are mounted. It has an element substrate (second substrate) 9. Then, the peripheral circuit element 8 and external peripheral circuit components 10 are mounted on the peripheral circuit element board 9, and the peripheral circuit module 1 is mounted.
9.

Solid-state imaging device substrate 2 made of an insulating material such as ceramic
is provided with a stepped portion 20 having a depth just enough to accommodate the solid-state image sensor 1.

The solid-state image sensor 1 is mounted on the lower surface portion of the stepped portion 20. The solid-state image sensing device 1 is die-bonded to the substrate 2, and is formed of gold or the like to electrodes 6 provided on the back surface of the substrate 2 and, for example, to a wiring pattern of the substrate 2 that is in an energized state. Wire bonding is performed using a thin metal wire 4. Therefore, the solid-state imaging probe 1 and the electrodes 6 are electrically connected.

Further, bumps 7 as conductive terminals are formed at the tips of the electrodes 6, and the solid-state image sensor 1 is connected to the peripheral circuit module 19 by the bumps 7.
It can be electrically connected to.

Further, a flat color filter 3 or a protective glass or the like is arranged on the solid-state image sensor 1 so that it can receive light from the outside. The side of the solid-state imaging device substrate 2 on which the solid-state imaging device 1 is mounted is sealed with a sealing resin 5.

On the other hand, the peripheral circuit module 19 includes a peripheral circuit element 8 and a peripheral circuit external component 10 on the surface of the peripheral circuit element substrate 9.
, and a lead pin 11 for external output.

The peripheral circuit element 8 is bonded to the substrate 9, and is connected to electrodes 12 provided on the back surface of the substrate 9.
For example, wire bonding is performed using a thin metal wire 4 made of gold or the like to, for example, a wiring pattern of the substrate 9 which is in an energized state. Therefore, the peripheral circuit element 8 and the electrodes 12 are electrically connected. Further, external peripheral circuit components 10 and external output lead pins 11 are also electrically connected to the electrodes 12 .

Bumps 13 are provided at the tips of the electrodes 12.
. . are formed, and the peripheral circuit module 19 can be electrically connected to the solid-state image sensor 1 through the bumps 13 .

Therefore, both the substrates 2.9 are arranged with their back surfaces facing each other, and the bumps 7 provided on these electrodes 6. .13 are connected by crimping or fusing, for example, the solid-state imaging device 1 and the peripheral circuit module 19 are electrically connected and function as the solid-state imaging device 14.

Therefore, the solid-state imaging device 14 having the above configuration can be mounted on the solid-state imaging device substrate 2 on which the solid-state imaging device 1 is provided, and on the peripheral circuit device substrate 9 on which the peripheral circuit device 8 is provided. Since these steps can be performed separately, each of the above-mentioned mounting operations can be easily performed.

Moreover, in the lightest way, the bumps 7 and 13 as conductive terminals are simply interposed between the electrodes 6 and 12 on the back surface of the solid-state image sensor substrate 2 and the back surface of the peripheral circuit element substrate 9. Since the solid-state imaging device 14 can be assembled by bonding the substrate 2 and the peripheral circuit element substrate 9, it is easy to connect the solid-state imaging cable 1 and the peripheral circuit module 19, and the assembly is easy. be.

Furthermore, between the back surface of the solid-state image sensor substrate 2 and the back surface of the peripheral circuit element substrate 9, a flexible printed wiring board 18 for external output, which will be described later, is interposed at a portion other than the electrodes 6° 12. It is possible to provide additional functions such as a printed resistor or the like. therefore,
As in the past, in order to arrange these various components on the same plane as the peripheral circuit elements 8, a peripheral circuit element substrate 9 is used.
By arranging the various components between the back surface of the solid-state image pickup device substrate 2 and the back surface of the peripheral circuit element substrate 9 as described above, a three-dimensional arrangement configuration that is not a two-dimensional structure can be achieved without increasing the area. Since this can be achieved, the area of the substrate can be reduced. Therefore, it is possible to contribute to downsizing of the solid-state imaging device compared to the conventional one.

FIG. 2 shows a second embodiment of the invention.

The solid-state imaging device 16 of this embodiment differs from the first embodiment in that only the means for joining the solid-state imaging device 1 and the peripheral circuit module 19, that is, the configuration on the back surfaces of the solid-state imaging device substrate 2 and the peripheral circuit device substrate 9, are different from those of the first embodiment. The other configurations are the same as those of the first embodiment.

That is, the solid-state imaging device 16 of this embodiment has electrodes 6 and 1 on the back surfaces of the solid-state imaging device substrate 2 and the peripheral circuit element substrate 9.
In this embodiment, the bumps 7 and 13 are not formed at the ends of the electrodes 6 and 12, and the anisotropic conductive adhesive 15 is used as a conductive terminal to connect the electrodes 6 and 12.

Therefore, in this configuration, first, both the substrates 2,
9 are arranged with their back surfaces facing each other, and between the corresponding electrodes 6 and 12 provided on the back surfaces of each substrate 2 and 9,
By connecting using an anisotropic conductive adhesive 15,
The solid-state imaging device 1 and the peripheral circuit module 19 are electrically connected to exhibit the function of the solid-state imaging device 16.Thus, the solid-state imaging device 16 having the above configuration is different from the first embodiment. Similar effects can be obtained, and since no bumps are formed, the length of the solid-state imaging device 14 in the joining direction can be made shorter than that of the solid-state imaging device 14 of the first embodiment.
6 can be further downsized. For example, when the solid-state imaging device 16 is installed in an endoscope, this leads to a reduction in the size of the rigid region at the end of the endoscope.

FIG. 3 shows a third embodiment of the invention.

The solid-state imaging device fif17 of this embodiment has a solid-state imaging device substrate 2 and a peripheral circuit instead of the external output lead pins 11 provided on the peripheral circuit element substrate 9 of the solid-state imaging device 16 in the second embodiment. A flexible printed wiring board 18 for external connection and blades is interposed between the back surfaces of the element substrate 9, and the wiring of this wiring board 18 and each of the above-mentioned boards 2 are interposed.
．． 9 electrodes 6°12 are connected,
The other configurations are the same as in the second embodiment, such as bonding the back surfaces of the solid-state image sensor substrate 2 and the peripheral circuit element substrate 9 with an anisotropic conductive adhesive 15.

Therefore, according to the solid-state imaging device 17 having the above configuration, since the external output lead pin 11 provided on the peripheral circuit element substrate 9 is not required, the area of the peripheral circuit element substrate 9 can be reduced accordingly. , the peripheral circuit i-joule 19 can also be designed with leeway.

Furthermore, since the flexible printed wiring board 18 is interposed between the back surfaces of the solid-state image sensor substrate 2 and the peripheral circuit element substrate 9, it occupies less space than the external output lead pins 11. It's over. Therefore, the solid-state imaging device can be further downsized. [Effects of the Invention] As explained above, according to the present invention, the following effects are achieved. That is, since the mounting work on the first board on which the solid-state image sensor is provided and the mounting work on the second board on which the peripheral circuit elements are provided can be performed separately, each of the above-mentioned mounting tasks can be easily performed. be able to.

Furthermore, in the end, the first substrate and the second substrate are bonded by simply interposing a conductive terminal between the electrodes on the back surface of the first substrate and the back surface of the second substrate, and solid-state imaging is performed. Since the device can be assembled, it is easy to connect the solid-state image sensor and the peripheral circuit module, and its assemblability is good.

Furthermore, between the back surface of the first board and the back surface of the second board, it is possible to arrange a flexible printed wiring board for external output, and it is also possible to provide additional functions such as a printed resistor. It is. Therefore, unlike in the past, there is no need to take the trouble to enlarge the area of the peripheral circuit element substrate in order to arrange these various components on the same plane as the peripheral circuit elements, for example. By arranging the various components between the second substrate and the back surface of the second substrate, a three-dimensional arrangement rather than a two-dimensional arrangement can be realized, so that the area of the substrate can be reduced. Therefore, it is possible to contribute to downsizing of the solid-state imaging device compared to the conventional one.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a solid-state imaging device showing a first embodiment of the invention, FIG. 2 is a sectional view of a solid-state imaging device showing a second embodiment of the invention, and FIG. 3 is a sectional view of a solid-state imaging device showing a second embodiment of the invention. FIG. 3 is a cross-sectional view of a solid-state imaging device showing a third embodiment. FIG. 4 is a sectional view showing a conventional example of a solid-state imaging device. 1... Solid-state image sensor, 2... Solid-state image sensor substrate,
6.12...electrode, 7,13...bump, 8...
Peripheral circuit element, 9... Substrate for peripheral circuit element, 10...
・Peripheral circuit external parts, 15...Anisotropic conductive adhesive,
18...Flexible printed wiring board for external output,
One...peripheral circuit module. Applicant's agent Patent attorney Jun Tsuboi (Q 1r> Ln Ln Kon←

Claims (3)

[Claims] (1) A solid-state imaging device in which a peripheral circuit element is attached to a solid-state image sensor, comprising a first substrate on which the solid-state image sensor is provided, and a second substrate on which the peripheral circuit element is provided, and both of the substrates are arranged with their back surfaces facing each other, and conductive terminals are interposed between corresponding electrodes provided on the back surfaces of each of the substrates to connect the electrodes. (2) The solid-state imaging device according to claim 1, wherein the conductive terminal uses an anisotropic conductive adhesive. (3) A flexible printed wiring board is interposed between the back surfaces of the first board and the second board, and the electrodes of each board are connected to the wiring of this wiring board. A solid-state imaging device according to claim 1 or 2.