JP2831689B2 - Solid-state imaging device - Google Patents

Description

Description: Object of the Invention (Industrial application field) The present invention relates to a solid-state imaging device such as an electronic endoscope or a micro camera, and particularly to a solid-state imaging device with an improved mounting method. Related to the device.

(Prior Art) Conventionally, in a solid-state imaging device using a CCD or the like, the solid-state imaging device 1 is arranged on a ceramic chip carrier 6 as shown in FIG. In general, an optical glass 8 is provided on the chip carrier 6 to protect the surface of the solid-state imaging device 1. Further, for connection to the outside, a method of directly soldering a lead wire or the like to the chip carrier, connecting to a connector, or soldering a flexible printed circuit board has been adopted.

However, in the above method, a pad portion for wire bonding and a portion for fixing glass are indispensable, and these determine the size of the chip carrier. In addition, connection to the outside by soldering requires a solder margin, and a connector also requires a space therefor.

For this reason, when compared in the imaging plane direction, the chip carrier must be considerably larger than the solid-state imaging device, and the entire solid-state imaging device becomes large.

As a method for solving these problems, a method has been proposed in which a solid-state imaging device is mounted face down on a light transmission type substrate.

However, as shown in FIG. 4, in the conventional solid-state imaging device, when the electrode pads 2 are arranged almost evenly on two sides, when wiring is taken out from one side, the wiring from the other side is placed on a light transmitting substrate. You have no choice but to route around the imaging area.
Therefore, as the number increases, the size of the substrate greatly exceeds the size of the solid-state imaging device, and the advantage of this method cannot be fully utilized.

For this reason, in a product in which the size of the solid-state imaging device itself such as an electronic endoscope or a microminiature camera is a problem, the performance itself is limited.

(Problems to be Solved by the Invention) As described above, since the size of the solid-state imaging device is conventionally determined by the size of the chip carrier and the substrate and the method of taking out the wiring, it has been difficult to reduce the size of the entire device.

The present invention has been made in view of the above circumstances, and its purpose is to mount a solid-state imaging device with a size equivalent to a solid-state imaging device compared with the imaging surface direction, and to use an electronic endoscope or an ultra-compact It is to provide a solid-state imaging device suitable for a camera or the like.

[Configuration of the invention]

(Means for Solving the Problems) In order to achieve the above object, the present invention provides a solid-state imaging device having an electrode pad on one side by using a light-transmitting substrate of the same size as a solid-state imaging device provided with an electrode pattern. The wiring is taken out from a side of the light-transmitting substrate on which the electrode pad is turned by a flexible printed board.

(Operation) According to the present invention, since the electrode pads are gathered on one side from which the wiring is taken out, it is not necessary to wire the electrode pattern on the light-transmitting substrate over the size of the solid-state imaging device on the substrate.
The light-transmitting substrate and the solid-state imaging device can be made substantially equal in size, and the solid-state imaging device can be downsized.

(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.

 FIG. 1 is a perspective view showing a first embodiment of the present invention.

The solid-state imaging device 1 in which the electrode pads 2 are all on one side is electrically connected to the electrode patterns on the glass substrate 3 using bumps. The electrode pattern extends around the side surface of the substrate and is connected to the flexible printed circuit board 4 here.

With such a configuration, the glass substrate and the solid-state imaging device have substantially the same outer shape in the imaging surface direction, and when used in an electronic endoscope or a micro camera, a reduction in diameter can be achieved.

 FIG. 2 is a perspective view showing a second embodiment of the present invention.

The electrode pad 2 of the solid-state imaging device 1 is formed on one side except for two, and the two electrodes are wired on the one side by the electrode pattern on the glass substrate 3. Since the wiring is provided between the image pickup device 1 and the end surface thereof so as to avoid the image pickup area 5, the image is not affected and the glass substrate 3 is connected to the solid-state image pickup device 1.
It is the same size as.

Note that the present invention is not limited to the above-described embodiments.

For example, the number of pads left without depending on one side of the solid-state imaging device is not limited to two, and when collecting them on one side by wiring, the glass substrate is not significantly larger than the solid-state imaging device, and furthermore, it affects the imaging area. 1 if not enough
Or three or more.

Further, in the embodiment, the electrode pattern is drawn out to the side surface of the light-transmitting substrate and connected to the flexible printed board, but may be connected to the same surface on which the solid-state imaging device is mounted.

In addition, various modifications can be made without departing from the scope of the present invention.

〔The invention's effect〕

As described in detail above, according to the present invention, the glass substrate can be made the same size as the solid-state imaging device, so that a small-sized solid-state imaging device can be realized particularly in the outer shape in the imaging direction.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a first embodiment of the present invention, FIG. 2 is a perspective view showing a second embodiment of the present invention, FIG. The figure is a perspective view showing a conventional example. DESCRIPTION OF SYMBOLS 1 ... Solid-state imaging device, 2 ... Electrode pad, 3 ... Glass substrate, 4 ... Flexible printed board, 5 ... Imaging area, 6 ... Chip carrier, 7 ... Bonding wire, 8 ... Optical glass.

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 27/14

Claims (1)

(57) [Claims] A light-transmitting substrate, a solid-state imaging device formed on the light-transmitting substrate, and having a light-receiving surface facing the light-transmitting substrate; and a solid-state imaging device on the same surface as the light-receiving surface. A plurality of electrode pads formed on a surface of the light transmitting substrate, a wiring formed on a surface of the light transmitting substrate facing the solid-state imaging device, and a plurality of bumps electrically connecting the plurality of electrode pads and the wiring. Wherein the plurality of electrode pads and the plurality of bumps are gathered and formed on one side of the imaging device, and at least two electrode pads and bumps are formed on the other side of the solid-state imaging device; The solid-state imaging device is connected to an external substrate only at a side of the light transmitting substrate corresponding to the one side of the element.