JPH02270375A - Solid-state image sensing device - Google Patents

Abstract

PURPOSE:To enable the mounting of an image sensing device whose size is equivalent to that of a solid-state image sensing element as being compared in the direction of an image sensing plane so as to obtain the sensing device adapted for an electronic endoscope or a sub-miniature camera by a method wherein half or more of two or more electrode pads of the solid-state image sensing element are formed on the side of the image sensing element nearest to a flexible board connected to the sensing element. CONSTITUTION:A solid-state image sensing device is provided with a solid state image sensing element 1, a thick light transmissive board 3 on which the element 1 is mounted, and a flexible board 4 which connects the element 1 with the outside, where the flexible board 4 is electrically connected to one of four sides of the solid-state image sensing element 1 and half or more of electrode pads of the solid-state image sensing element 1 are formed on the side of the element 1 nearest to the flexible board 4. For instance, the solid-state image sensing element 1 whose electrode pads are all collectively formed on its single side is electrically connected to an electrode pattern formed on the glass board 3 through bumps. The electrode pattern extends up to the side face of the board 3, where it is connected to the flexible printed board 4.

Description

[Detailed description of the invention] [Object of the invention] (Field of application in M industry) The present invention relates to solid-state imaging devices such as electronic endoscopes and ultra-compact cameras, and particularly relates to solid-state imaging devices with improved mounting methods. It relates to an imaging device.

(Prior Art) Conventionally, a solid-state image sensor using COD or the like has a solid-state image sensor l disposed on a ceramic chip carrier 6, as shown in FIG. Ta. Furthermore, it has been common practice to provide an optical glass 8 on the chip carrier 6 to protect the surface of the solid-state image sensor 1.

Furthermore, external connections are made by directly attaching lead wires to the chip carrier. Connect the connector.

Methods such as soldering a flexible printed circuit board are used.

However, in the above method, a padded portion for wire bonding and a portion for fixing glass are essential, and these determine the size of the chip carrier. It was. External connections by soldering require a solder margin.

Connectors also require space.

Therefore, when compared in the direction of the imaging surface, the chip carrier has to be considerably larger than the solid-state imaging device.
The entire solid-state imaging device becomes larger.

As a way to solve these problems, solid-state photography I# on a light-transmissive substrate! A method of mounting elements face-down has been proposed.

However, in the conventional solid-state image sensor, the cage shown in FIG.
', Since the pole pads and V-dopers 2 are arranged almost equally on two sides, when wiring is taken out from one side, the only way is to route the wiring from the other side on a light-transmissive substrate, avoiding the imaging area.

Therefore, when the number of devices increases, the size of the substrate greatly exceeds that of the solid-state image sensor, and the advantages of this method cannot be fully utilized.

For this reason, the solid-state imaging device itself has the problem of limiting its performance in products where the size of the solid-state imaging device itself is a problem, such as electronic endoscopes and ultra-compact cameras.

(Problem to be solved by the invention) As described above, conventionally, the size of a solid-state imaging device is determined by the size of the chip carrier and substrate and the method of extracting the wiring, so it is difficult to measure the compactness ratio of the entire device. Met.

The present invention has been made in consideration of the above circumstances.

The objective is to implement a solid-state imaging device with a size equivalent to that of a solid-state imaging device in the direction of the imaging surface, and to provide a solid-state imaging device suitable for electronic endoscopes, ultra-compact cameras, etc. It is in.

[Structure of the invention]

(n. Means for Solving the Problem) In order to achieve the above object, the present invention provides a solid-state camera I#! in which the α-pole pad is shifted to one side. The device is mounted on a light-transmissive substrate of the same size as the solid-state imaging device provided with an electrode pattern, and wiring is carried out using a flexible printed circuit board from one side of the light-transmissive substrate where the electric wire is aligned. It is to take out.

(Function) According to the present invention, since the electrode pads are gathered on one side from which the wiring is taken out, there is no need to wire the electrode pattern on the light-transmitting substrate beyond the size of the solid-state image sensor, and the light-transmitting The solid-state imaging device and the solid-state imaging device can be made approximately the same size, and the solid-state imaging device can be made smaller. (Example) An example of a single-family home will be described below with reference to drawings.

FIG. 1 is a perspective view showing a first embodiment of the present invention.

A solid-state image sensing device 1 with all poles V and 2 aligned on one side is electrically connected to an electrode pattern on a glass substrate 3 using bumps. The electrode pattern wraps around the side surface of the board and is connected to the flexible printed circuit board 4 here.

With such a configuration, the glass substrate and the solid-state image pickup device can have approximately the same external size in the direction of the image pickup surface, and when used in an electronic endoscope or an ultra-compact camera, a small diameter can be achieved.

FIG. 2 is a perspective view showing the second J arrangement of the present invention.

All but two of the electrode pads 2 of the solid-state imaging device 1 are placed on one side, and these two electrodes are wired on one side by an electrode pattern on the glass substrate 3. 2 At that time, the one-pole pattern is the imaging area 5 of the solid-state image sensor 1.
Image 1 Image 4
In addition, the glass substrate 3 can be used for solid-state imaging 1 without causing any shadows.
It has the same size as the quadrature element l.

Note that the present invention is not limited to the embodiments described above.

For example, the number of pads left without moving on one side of the solid-state Ff & image element is not limited to two, but they can be placed on one side #C by wiring.
When draining, one or three or more may be used as long as the glass substrate is not significantly larger than one solid-state sensor and does not affect the imaging area.

In addition, in the embodiment, the electrode pattern is drawn out to the side of the light-transmissive substrate and connected to the flexible printed circuit board, but solid-state photography 1#! They may be connected on the same surface on which the elements are mounted.

In addition, various modifications can be made without departing from the spirit of the present invention.

〔Effect of the invention〕

As described in detail above, according to the present invention, the glass substrate can be made to have the same size as the solid-state sensor@device, so a compact solid-state sensor 1* device can be realized, especially in terms of the external shape in the direction of the image sensor.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a first embodiment of the present invention, FIG. 2 is a perspective view showing a second embodiment of the present invention, FIG. 3 is a sectional view showing a schematic configuration of a conventional device, and FIG. The figure is a perspective view showing a conventional example. 1... Fixed book photography device, 2... Denya pad, 3...
Glass substrate, 4...Flexible printed circuit board, 5.
...Photographs area, 6...chip carrier, 7...bonding wire, 8...optical glass. Agent Patent Attorney Nori Kon Wl Same as right
Hikaru Matsuyama 2nd Figure 1 @ Figure 2 Figure 3 Figure 4

Claims (3)

[Claims] (1) A solid-state image sensor, a thick light-transmitting substrate on which the solid-state image sensor is mounted, and a flexible substrate for connecting the solid-state image sensor to the outside;
In a solid-state imaging device in which the flexible substrate is electrically connected only in the direction of one of the sides, a plurality of electrodes of the solid-state imaging device are arranged on one side closest to the substrate to which the flexible substrate is connected. A solid-state imaging device characterized in that more than half of the pads are formed. (2) The solid-state imaging device according to claim 1, wherein the solid-state imaging device and the light-transmitting substrate have the same size. (3) Of the electrode pads of the solid-state image sensor, those formed on a side other than the one side to which the flexible substrate is connected are conductive patterns formed on the light-transmitting substrate in a portion that is not on the imaging area of the solid-state image sensor. 2. The solid-state imaging device according to claim 1, wherein wiring is provided on one side to which the flexible substrate is connected.