JPH0415262U - - Google Patents
Info
- Publication number
- JPH0415262U JPH0415262U JP5504790U JP5504790U JPH0415262U JP H0415262 U JPH0415262 U JP H0415262U JP 5504790 U JP5504790 U JP 5504790U JP 5504790 U JP5504790 U JP 5504790U JP H0415262 U JPH0415262 U JP H0415262U
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- thickness
- ceramic substrate
- integrated circuit
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Description
第1図はこの考案の実施例の要部を示す縦断面
図、第2図はこの考案を得る途中の段階で考えら
れたHICの要部を示す縦断面図、第3図は第2
図の印刷抵抗体3の平面図、第4図は従来のHI
Cの要部を示す縦断面図である。
図、第2図はこの考案を得る途中の段階で考えら
れたHICの要部を示す縦断面図、第3図は第2
図の印刷抵抗体3の平面図、第4図は従来のHI
Cの要部を示す縦断面図である。
Claims (1)
- 【実用新案登録請求の範囲】 スルホールセラミツク基板の一方の面に回路部
品が実装され、他方の面に印刷抵抗体が形成され
た混成集積回路において、 絶縁体層が上記スルホールセラミツク基板の他
方の面に上記印刷抵抗体及びその近傍を除いて形
成され、 その絶縁体層の厚味は上記印刷抵抗体の厚味よ
り大きく設定され、 その絶縁体層の表面がパツケージへ接着固定す
る場合の接合面とされることを特徴とする、 混成集積回路。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5504790U JPH0415262U (ja) | 1990-05-25 | 1990-05-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5504790U JPH0415262U (ja) | 1990-05-25 | 1990-05-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0415262U true JPH0415262U (ja) | 1992-02-06 |
Family
ID=31577652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5504790U Pending JPH0415262U (ja) | 1990-05-25 | 1990-05-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0415262U (ja) |
-
1990
- 1990-05-25 JP JP5504790U patent/JPH0415262U/ja active Pending