JPH041459U - - Google Patents

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Publication number
JPH041459U
JPH041459U JP4143490U JP4143490U JPH041459U JP H041459 U JPH041459 U JP H041459U JP 4143490 U JP4143490 U JP 4143490U JP 4143490 U JP4143490 U JP 4143490U JP H041459 U JPH041459 U JP H041459U
Authority
JP
Japan
Prior art keywords
acceleration sensor
semiconductor acceleration
elastic body
members
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4143490U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4143490U priority Critical patent/JPH041459U/ja
Publication of JPH041459U publication Critical patent/JPH041459U/ja
Pending legal-status Critical Current

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  • Pressure Sensors (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案による半導体加速度センサの
パツケージの一実施例を示す断面図、第2図は従
来の半導体加速度センサのパツケージを示す断面
図である。 図において、1は半導体加速度センサ、4は基
板、5は第1部材、7は第2部材、9は弾性体で
ある。なお、各図中同一符号は同一または相当部
分を示す。
FIG. 1 is a sectional view showing an embodiment of a semiconductor acceleration sensor package according to this invention, and FIG. 2 is a sectional view showing a conventional semiconductor acceleration sensor package. In the figure, 1 is a semiconductor acceleration sensor, 4 is a substrate, 5 is a first member, 7 is a second member, and 9 is an elastic body. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体加速度センサを装着した基板を保持する
第1部材と上記第1部材に保持された半導体加速
度センサを包囲する第2部材とからなる半導体加
速度センサのパツケージにおいて、上記第1部材
の外周と上記第2部材との間に弾性体を配置し、
該弾性体を介し上記両部材を接続したことを特徴
とする半導体加速度センサのパツケージ。
A semiconductor acceleration sensor package including a first member holding a substrate on which a semiconductor acceleration sensor is mounted and a second member surrounding the semiconductor acceleration sensor held by the first member, wherein the outer periphery of the first member and the second member An elastic body is placed between the two members,
A package for a semiconductor acceleration sensor, characterized in that both of the above members are connected through the elastic body.
JP4143490U 1990-04-18 1990-04-18 Pending JPH041459U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4143490U JPH041459U (en) 1990-04-18 1990-04-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4143490U JPH041459U (en) 1990-04-18 1990-04-18

Publications (1)

Publication Number Publication Date
JPH041459U true JPH041459U (en) 1992-01-08

Family

ID=31552098

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4143490U Pending JPH041459U (en) 1990-04-18 1990-04-18

Country Status (1)

Country Link
JP (1) JPH041459U (en)

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