JPH03101536U - - Google Patents
Info
- Publication number
- JPH03101536U JPH03101536U JP1003490U JP1003490U JPH03101536U JP H03101536 U JPH03101536 U JP H03101536U JP 1003490 U JP1003490 U JP 1003490U JP 1003490 U JP1003490 U JP 1003490U JP H03101536 U JPH03101536 U JP H03101536U
- Authority
- JP
- Japan
- Prior art keywords
- thick
- ceramic substrate
- film
- film ceramic
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000001465 metallisation Methods 0.000 claims 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図はこの考案の一実施例による表面実装型
混成集積回路装置を示す断面図、第２図は従来の
混成集積回路装置の斜視図、第３図は、第２図の
Ａ−Ａ′線による断面図である。
図において、１……厚膜セラミツク基板、２…
…プラスチツクキヤツプ、６〜８……回路部品で
ある。なお、各図中の同一符号は同一または相当
部分を示す。
FIG. 1 is a sectional view showing a surface-mounted hybrid integrated circuit device according to an embodiment of the invention, FIG. 2 is a perspective view of a conventional hybrid integrated circuit device, and FIG. 3 is a line A-A' in FIG. FIG. In the figure, 1...thick film ceramic substrate, 2...
...Plastic cap, 6-8...Circuit parts. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
ラミツク基板面に直接キヤツプを取り付けること
により前記厚膜セラミツク基板表面を封止したこ
とを特徴とする表面実装型混成集積回路装置。 1. A surface-mounted hybrid integrated circuit device, characterized in that the surface of the thick-film ceramic substrate is sealed by directly attaching a cap to the surface of the thick-film ceramic substrate on which a circuit is formed by thick-film metallization.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1003490U JPH03101536U (en) | 1990-02-02 | 1990-02-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1003490U JPH03101536U (en) | 1990-02-02 | 1990-02-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03101536U true JPH03101536U (en) | 1991-10-23 |
Family
ID=31513634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1003490U Pending JPH03101536U (en) | 1990-02-02 | 1990-02-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03101536U (en) |
-
1990
- 1990-02-02 JP JP1003490U patent/JPH03101536U/ja active Pending