JPH03120071U - - Google Patents
Info
- Publication number
- JPH03120071U JPH03120071U JP2832090U JP2832090U JPH03120071U JP H03120071 U JPH03120071 U JP H03120071U JP 2832090 U JP2832090 U JP 2832090U JP 2832090 U JP2832090 U JP 2832090U JP H03120071 U JPH03120071 U JP H03120071U
- Authority
- JP
- Japan
- Prior art keywords
- variable
- resin
- passive element
- integrated circuit
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000005219 brazing Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図は本考案の混成集積回路装置の平面図、
第２図は第１図のＡ−Ａ′線断面図、第３図は従
来の混成集積回路装置の断面図である。
１……ケース、２……可変受動素子、３……外
装樹脂、４……厚膜印刷基板、５……リード端子
、６……その他搭載部品、７……埋め込み樹脂ま
たはろう材。
FIG. 1 is a plan view of the hybrid integrated circuit device of the present invention;
2 is a cross-sectional view taken along the line A-A' in FIG. 1, and FIG. 3 is a cross-sectional view of a conventional hybrid integrated circuit device. 1... Case, 2... Variable passive element, 3... Exterior resin, 4... Thick film printed circuit board, 5... Lead terminal, 6... Other mounted parts, 7... Embedded resin or brazing material.
Claims (1)
イル等の可変受動素子を有し、該可変受動素子、
可変調整部以外の部分を第１の樹脂で外装し、該
可変受動素子の可変部分を第２の樹脂またはろう
材等で埋め込んだことを特徴とする混成集積回路
装置。 (2) 第１の樹脂の上面よりも凹んだ個所に可変
受動素子の可変調整部を有し、該凹んだ個所が第
２の樹脂またはろう材等で埋め込まれていること
を特徴とする実用新案登録請求の範囲第(1)項記
載の混成集積回路装置。[Claims for Utility Model Registration] (1) Having a variable passive element such as a variable capacitor, a variable resistor, or a variable coil, the variable passive element,
1. A hybrid integrated circuit device characterized in that a portion other than the variable adjustment portion is covered with a first resin, and a variable portion of the variable passive element is embedded with a second resin, a brazing material, or the like. (2) Practical use characterized in that the variable adjustment part of the variable passive element is provided in a part recessed from the upper surface of the first resin, and the recessed part is embedded with a second resin, a brazing material, etc. A hybrid integrated circuit device according to claim (1) of patent registration.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2832090U JPH03120071U (en) | 1990-03-19 | 1990-03-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2832090U JPH03120071U (en) | 1990-03-19 | 1990-03-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03120071U true JPH03120071U (en) | 1991-12-10 |
Family
ID=31531128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2832090U Pending JPH03120071U (en) | 1990-03-19 | 1990-03-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03120071U (en) |
-
1990
- 1990-03-19 JP JP2832090U patent/JPH03120071U/ja active Pending