JPH0377473U - - Google Patents
Info
- Publication number
- JPH0377473U JPH0377473U JP13766989U JP13766989U JPH0377473U JP H0377473 U JPH0377473 U JP H0377473U JP 13766989 U JP13766989 U JP 13766989U JP 13766989 U JP13766989 U JP 13766989U JP H0377473 U JPH0377473 U JP H0377473U
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- integrated circuit
- utility
- circuit device
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 2
- 238000009966 trimming Methods 0.000 claims description 2
- 230000001012 protector Effects 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Description
第１図ａ，ｂは従来装置の平面図と断面図、ｃ
はこの等価回路図である。第２図ａ，ｂ，ｃは本
考案の実施例を示す、平面図、断面図、回路図、
第３図、第４図は本考案の他の実施例図である。
図中１……セラミツク基板、２，２−１，２−
２……電極、３，３−１，３−２……抵抗体、４
……保護膜、５……電子部品、ａ，ａ′……トリ
ミングを示す。
Figures 1a and b are a plan view and a sectional view of the conventional device, and c
is this equivalent circuit diagram. Figures 2a, b, and c show a plan view, a sectional view, a circuit diagram, and a cross-sectional view of an embodiment of the present invention.
FIGS. 3 and 4 show other embodiments of the present invention. In the figure 1...ceramic substrate, 2, 2-1, 2-
2... Electrode, 3, 3-1, 3-2... Resistor, 4
. . . Protective film, 5 . . . Electronic components, a, a′ . . . Trimming.
Claims (1)
、厚膜保護体等を印刷又は焼結して成る厚膜形成
基板上に各種電子部品を搭載した厚膜集積回路装
置に於いて、前記厚膜抵抗体を２個以上直列接続
形成して成る事を特徴とする厚膜集積回路装置。 (2) 厚膜抵抗体の１個以上にトリミングを施し
た事を特徴とする実用新案登録請求の範囲第(1)
項記載の厚膜集積回路装置。[Scope of Claim for Utility Model Registration] (1) Thick film substrates with various electronic components mounted on a thick film substrate formed by printing or sintering thick film electrodes, thick film resistors, thick film protectors, etc. on a ceramic substrate. A thick film integrated circuit device comprising two or more of the thick film resistors connected in series. (2) Claim No. (1) for utility model registration, which is characterized by trimming one or more of the thick film resistors.
The thick film integrated circuit device described in Section 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13766989U JPH0377473U (en) | 1989-11-28 | 1989-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13766989U JPH0377473U (en) | 1989-11-28 | 1989-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0377473U true JPH0377473U (en) | 1991-08-05 |
Family
ID=31684814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13766989U Pending JPH0377473U (en) | 1989-11-28 | 1989-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0377473U (en) |
-
1989
- 1989-11-28 JP JP13766989U patent/JPH0377473U/ja active Pending