JPS61117274U - - Google Patents

Info

Publication number
JPS61117274U
JPS61117274U JP19385U JP19385U JPS61117274U JP S61117274 U JPS61117274 U JP S61117274U JP 19385 U JP19385 U JP 19385U JP 19385 U JP19385 U JP 19385U JP S61117274 U JPS61117274 U JP S61117274U
Authority
JP
Japan
Prior art keywords
thin
film
thin film
hybrid
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19385U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19385U priority Critical patent/JPS61117274U/ja
Publication of JPS61117274U publication Critical patent/JPS61117274U/ja
Pending legal-status Critical Current

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  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Adjustable Resistors (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例による薄膜ハイブリツ
ドICの断面構造図、第2図は従来の薄膜ハイブ
リツドICの一例の断面構造図、第3図は薄膜電
極3と薄膜抵抗ブロツク4のパターン図、第4図
は本考案の他の実施例による薄膜ハイブリツドI
Cの構造断面図である。 1…薄膜抵抗基板、2…チツプ部品、3…薄膜
電極、4…薄膜抵抗ブロツク、6…FPC基板、
7…FPCの電極、8…端子、9…ICチツプ。
FIG. 1 is a sectional structural diagram of a thin film hybrid IC according to an embodiment of the present invention, FIG. 2 is a sectional structural diagram of an example of a conventional thin film hybrid IC, and FIG. 3 is a pattern diagram of a thin film electrode 3 and a thin film resistor block 4. FIG. 4 shows a thin film hybrid I according to another embodiment of the present invention.
It is a structural sectional view of C. DESCRIPTION OF SYMBOLS 1... Thin film resistance board, 2... Chip component, 3... Thin film electrode, 4... Thin film resistance block, 6... FPC board,
7...FPC electrode, 8...terminal, 9...IC chip.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 薄膜抵抗ブロツクを形成した薄膜抵抗基板と回
路部品をFPC基板の片面ないしは両面に搭載し
てなる薄膜ハイブリツドIC。
A thin-film hybrid IC is a thin-film hybrid IC in which a thin-film resistor board with a thin-film resistor block formed thereon and circuit components are mounted on one or both sides of an FPC board.
JP19385U 1985-01-08 1985-01-08 Pending JPS61117274U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19385U JPS61117274U (en) 1985-01-08 1985-01-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19385U JPS61117274U (en) 1985-01-08 1985-01-08

Publications (1)

Publication Number Publication Date
JPS61117274U true JPS61117274U (en) 1986-07-24

Family

ID=30471833

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19385U Pending JPS61117274U (en) 1985-01-08 1985-01-08

Country Status (1)

Country Link
JP (1) JPS61117274U (en)

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