JPH0289874U - - Google Patents
Info
- Publication number
- JPH0289874U JPH0289874U JP17091188U JP17091188U JPH0289874U JP H0289874 U JPH0289874 U JP H0289874U JP 17091188 U JP17091188 U JP 17091188U JP 17091188 U JP17091188 U JP 17091188U JP H0289874 U JPH0289874 U JP H0289874U
- Authority
- JP
- Japan
- Prior art keywords
- multilayer substrate
- ceramic multilayer
- resistive element
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
Description
第１図は本考案の一実施例の斜視図、第２図は
従来のハイブリツドＩＣを説明するための断面図
、第３図は従来のハイブリツドＩＣの他の例を説
明するための断面図、第４図は第１図実施例の側
面図である。
図において、３１はセラミツク多層基板、３１
ｃは側面、３２〜３６は内蔵素子を構成するため
の内部電極、４４，４５はＩＣ、５１〜５５は抵
抗体を示す。
FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a sectional view for explaining a conventional hybrid IC, and FIG. 3 is a sectional view for explaining another example of a conventional hybrid IC. FIG. 4 is a side view of the embodiment of FIG. 1. In the figure, 31 is a ceramic multilayer substrate;
c is a side surface, 32 to 36 are internal electrodes for forming built-in elements, 44 and 45 are ICs, and 51 to 55 are resistors.
Claims (1)
構成されており、かつ内部に回路素子が構成され
たセラミツク多層基板と、 前記セラミツク多層基板の側面に形成された抵
抗体とを備えることを特徴とする、抵抗素子を含
む複合セラミツク多層基板。[Claims for Utility Model Registration] A ceramic multilayer substrate configured to have an IC mounted on at least one main surface and a circuit element configured inside, and a resistor formed on a side surface of the ceramic multilayer substrate. 1. A composite ceramic multilayer substrate including a resistive element, characterized in that it comprises a resistive element and a resistive element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17091188U JPH0720942Y2 (en) | 1988-12-28 | 1988-12-28 | Composite ceramic multilayer substrate including resistive element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17091188U JPH0720942Y2 (en) | 1988-12-28 | 1988-12-28 | Composite ceramic multilayer substrate including resistive element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0289874U true JPH0289874U (en) | 1990-07-17 |
| JPH0720942Y2 JPH0720942Y2 (en) | 1995-05-15 |
Family
ID=31462269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17091188U Expired - Lifetime JPH0720942Y2 (en) | 1988-12-28 | 1988-12-28 | Composite ceramic multilayer substrate including resistive element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0720942Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011100649A (en) * | 2009-11-06 | 2011-05-19 | Murata Mfg Co Ltd | Substrate with built-in electronic component and electronic module |
-
1988
- 1988-12-28 JP JP17091188U patent/JPH0720942Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011100649A (en) * | 2009-11-06 | 2011-05-19 | Murata Mfg Co Ltd | Substrate with built-in electronic component and electronic module |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0720942Y2 (en) | 1995-05-15 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |