JPH0289874U - - Google Patents

Info

Publication number
JPH0289874U
JPH0289874U JP17091188U JP17091188U JPH0289874U JP H0289874 U JPH0289874 U JP H0289874U JP 17091188 U JP17091188 U JP 17091188U JP 17091188 U JP17091188 U JP 17091188U JP H0289874 U JPH0289874 U JP H0289874U
Authority
JP
Japan
Prior art keywords
multilayer substrate
ceramic multilayer
resistive element
utility
model registration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17091188U
Other languages
Japanese (ja)
Other versions
JPH0720942Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17091188U priority Critical patent/JPH0720942Y2/en
Publication of JPH0289874U publication Critical patent/JPH0289874U/ja
Application granted granted Critical
Publication of JPH0720942Y2 publication Critical patent/JPH0720942Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Details Of Resistors (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例の斜視図、第2図は
従来のハイブリツドICを説明するための断面図
、第3図は従来のハイブリツドICの他の例を説
明するための断面図、第4図は第1図実施例の側
面図である。 図において、31はセラミツク多層基板、31
cは側面、32〜36は内蔵素子を構成するため
の内部電極、44,45はIC、51〜55は抵
抗体を示す。
FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a sectional view for explaining a conventional hybrid IC, and FIG. 3 is a sectional view for explaining another example of a conventional hybrid IC. FIG. 4 is a side view of the embodiment of FIG. 1. In the figure, 31 is a ceramic multilayer substrate;
c is a side surface, 32 to 36 are internal electrodes for forming built-in elements, 44 and 45 are ICs, and 51 to 55 are resistors.

Claims (1)

【実用新案登録請求の範囲】 少なくとも一方主面にICが搭載されるように
構成されており、かつ内部に回路素子が構成され
たセラミツク多層基板と、 前記セラミツク多層基板の側面に形成された抵
抗体とを備えることを特徴とする、抵抗素子を含
む複合セラミツク多層基板。
[Claims for Utility Model Registration] A ceramic multilayer substrate configured to have an IC mounted on at least one main surface and a circuit element configured inside, and a resistor formed on a side surface of the ceramic multilayer substrate. 1. A composite ceramic multilayer substrate including a resistive element, characterized in that it comprises a resistive element and a resistive element.
JP17091188U 1988-12-28 1988-12-28 Composite ceramic multilayer substrate including resistive element Expired - Lifetime JPH0720942Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17091188U JPH0720942Y2 (en) 1988-12-28 1988-12-28 Composite ceramic multilayer substrate including resistive element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17091188U JPH0720942Y2 (en) 1988-12-28 1988-12-28 Composite ceramic multilayer substrate including resistive element

Publications (2)

Publication Number Publication Date
JPH0289874U true JPH0289874U (en) 1990-07-17
JPH0720942Y2 JPH0720942Y2 (en) 1995-05-15

Family

ID=31462269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17091188U Expired - Lifetime JPH0720942Y2 (en) 1988-12-28 1988-12-28 Composite ceramic multilayer substrate including resistive element

Country Status (1)

Country Link
JP (1) JPH0720942Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011100649A (en) * 2009-11-06 2011-05-19 Murata Mfg Co Ltd Substrate with built-in electronic component and electronic module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011100649A (en) * 2009-11-06 2011-05-19 Murata Mfg Co Ltd Substrate with built-in electronic component and electronic module

Also Published As

Publication number Publication date
JPH0720942Y2 (en) 1995-05-15

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term