JPH0288201U - - Google Patents
Info
- Publication number
- JPH0288201U JPH0288201U JP16719488U JP16719488U JPH0288201U JP H0288201 U JPH0288201 U JP H0288201U JP 16719488 U JP16719488 U JP 16719488U JP 16719488 U JP16719488 U JP 16719488U JP H0288201 U JPH0288201 U JP H0288201U
- Authority
- JP
- Japan
- Prior art keywords
- striped pattern
- view
- electronic component
- perspective
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Details Of Resistors (AREA)
Description
第1図は本考案の実施例の電子部品の分解斜視
図、第2図は第1図の組立後の斜視図、第3図は
その切断方向を示す斜視図、第4図はその断面図
である。第5図乃至第13図は本考案の他の実施
例の電子部品の断面図または平面図または斜視図
である。第14図、第15図は従来の捺印をした
電子部品の正面図である。
1……保護層、2……セラミツクシート、3…
…内部電極、4……セラミツクシート、5,5a
,5b,11……縞状の模様、10……外部電極
、17……縞状の模様、19,20……チツプ型
抵抗。
Fig. 1 is an exploded perspective view of an electronic component according to an embodiment of the present invention, Fig. 2 is a perspective view of Fig. 1 after assembly, Fig. 3 is a perspective view showing its cutting direction, and Fig. 4 is its sectional view. It is. 5 to 13 are sectional views, plan views, or perspective views of electronic components according to other embodiments of the present invention. FIGS. 14 and 15 are front views of electronic components with conventional markings. 1... Protective layer, 2... Ceramic sheet, 3...
...Internal electrode, 4...Ceramic sheet, 5, 5a
, 5b, 11... Striped pattern, 10... External electrode, 17... Striped pattern, 19, 20... Chip type resistor.
Claims (1)
品上の情報を表示する縞状の模様を形成したこと
を特徴とする電子部品。 An electronic component characterized by forming a striped pattern on the inside or outside of the device to display information on device manufacturing or product.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16719488U JPH0288201U (en) | 1988-12-23 | 1988-12-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16719488U JPH0288201U (en) | 1988-12-23 | 1988-12-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0288201U true JPH0288201U (en) | 1990-07-12 |
Family
ID=31455268
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16719488U Pending JPH0288201U (en) | 1988-12-23 | 1988-12-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0288201U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013038332A (en) * | 2011-08-10 | 2013-02-21 | Tdk Corp | Laminated capacitor |
JP2019129183A (en) * | 2018-01-22 | 2019-08-01 | Tdk株式会社 | Multi-layered electronic component, determination method of multi-layered electronic component, and manufacturing method of multi-layered electronic component |
-
1988
- 1988-12-23 JP JP16719488U patent/JPH0288201U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013038332A (en) * | 2011-08-10 | 2013-02-21 | Tdk Corp | Laminated capacitor |
JP2019129183A (en) * | 2018-01-22 | 2019-08-01 | Tdk株式会社 | Multi-layered electronic component, determination method of multi-layered electronic component, and manufacturing method of multi-layered electronic component |