JPH0413078B2 - - Google Patents

Info

Publication number
JPH0413078B2
JPH0413078B2 JP56135562A JP13556281A JPH0413078B2 JP H0413078 B2 JPH0413078 B2 JP H0413078B2 JP 56135562 A JP56135562 A JP 56135562A JP 13556281 A JP13556281 A JP 13556281A JP H0413078 B2 JPH0413078 B2 JP H0413078B2
Authority
JP
Japan
Prior art keywords
solder
copper
soldering
printed circuit
tin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56135562A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5838693A (ja
Inventor
Kenichi Kita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pioneer Corp
Original Assignee
Pioneer Electronic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pioneer Electronic Corp filed Critical Pioneer Electronic Corp
Priority to JP13556281A priority Critical patent/JPS5838693A/ja
Publication of JPS5838693A publication Critical patent/JPS5838693A/ja
Publication of JPH0413078B2 publication Critical patent/JPH0413078B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP13556281A 1981-08-31 1981-08-31 プリント基板の半田付方法 Granted JPS5838693A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13556281A JPS5838693A (ja) 1981-08-31 1981-08-31 プリント基板の半田付方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13556281A JPS5838693A (ja) 1981-08-31 1981-08-31 プリント基板の半田付方法

Publications (2)

Publication Number Publication Date
JPS5838693A JPS5838693A (ja) 1983-03-07
JPH0413078B2 true JPH0413078B2 (zh) 1992-03-06

Family

ID=15154708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13556281A Granted JPS5838693A (ja) 1981-08-31 1981-08-31 プリント基板の半田付方法

Country Status (1)

Country Link
JP (1) JPS5838693A (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4622205A (en) * 1985-04-12 1986-11-11 Ibm Corporation Electromigration lifetime increase of lead base alloys
AU2012363597B2 (en) * 2012-05-10 2016-07-21 Senju Metal Industry Co., Ltd Audio solder alloy

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5332533U (zh) * 1976-08-26 1978-03-22
JPS5436751A (en) * 1977-08-29 1979-03-17 Toshiba Corp Display device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5332533U (zh) * 1976-08-26 1978-03-22
JPS5436751A (en) * 1977-08-29 1979-03-17 Toshiba Corp Display device

Also Published As

Publication number Publication date
JPS5838693A (ja) 1983-03-07

Similar Documents

Publication Publication Date Title
US3210182A (en) Selective removal of excess solder
KR100671394B1 (ko) Pb프리 땜납 합금을 이용한 리플로우 납땜 방법 및 혼재실장 방법 및 혼재 실장 구조체
JP3643008B2 (ja) はんだ付け方法
JPH0413078B2 (zh)
US6702175B1 (en) Method of soldering using lead-free solder and bonded article prepared through soldering by the method
JP2004154864A (ja) 鉛フリーはんだ合金
JP4338854B2 (ja) スズ−ビスマス系無鉛はんだ
JPH11221694A (ja) 鉛フリーはんだを用いた実装構造体およびそれを用いた実装方法
JP3963501B2 (ja) 電子部品の実装方法
JPH0521260A (ja) チツプ部品およびその製造方法と実装構造
US3607252A (en) Solder alloy composition
JPH11333589A (ja) 無鉛はんだ用添加合金
TWI812401B (zh) 焊料合金及焊料接頭
KR100560708B1 (ko) 납땜방법
JPH06177514A (ja) プリント配線板の製造方法
JP2003179345A (ja) Pbフリー半田付け物品
JP2580889B2 (ja) 高温はんだ
JPS601937B2 (ja) 耐酸化性鉛錫半田用母合金
JPS63224291A (ja) 半田付け方法
JPH01230213A (ja) 電子部品
JPS60130464A (ja) はんだ付け方法
JPH05129771A (ja) プリント配線基板用予備はんだ
US20040155097A1 (en) Soldering method and method for manufacturing component mounting board
JP2002178140A (ja) 鉛フリーはんだ用のリフロー方法
Yagi et al. Solder Composition(for Printed Circuit Production)