JPH0413078B2 - - Google Patents
Info
- Publication number
- JPH0413078B2 JPH0413078B2 JP56135562A JP13556281A JPH0413078B2 JP H0413078 B2 JPH0413078 B2 JP H0413078B2 JP 56135562 A JP56135562 A JP 56135562A JP 13556281 A JP13556281 A JP 13556281A JP H0413078 B2 JPH0413078 B2 JP H0413078B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- copper
- soldering
- printed circuit
- tin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
- 238000005476 soldering Methods 0.000 claims description 10
- 229910000765 intermetallic Inorganic materials 0.000 claims description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims 1
- 239000002244 precipitate Substances 0.000 claims 1
- 239000011133 lead Substances 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13556281A JPS5838693A (ja) | 1981-08-31 | 1981-08-31 | プリント基板の半田付方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13556281A JPS5838693A (ja) | 1981-08-31 | 1981-08-31 | プリント基板の半田付方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5838693A JPS5838693A (ja) | 1983-03-07 |
JPH0413078B2 true JPH0413078B2 (zh) | 1992-03-06 |
Family
ID=15154708
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13556281A Granted JPS5838693A (ja) | 1981-08-31 | 1981-08-31 | プリント基板の半田付方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5838693A (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4622205A (en) * | 1985-04-12 | 1986-11-11 | Ibm Corporation | Electromigration lifetime increase of lead base alloys |
AU2012363597B2 (en) * | 2012-05-10 | 2016-07-21 | Senju Metal Industry Co., Ltd | Audio solder alloy |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5332533U (zh) * | 1976-08-26 | 1978-03-22 | ||
JPS5436751A (en) * | 1977-08-29 | 1979-03-17 | Toshiba Corp | Display device |
-
1981
- 1981-08-31 JP JP13556281A patent/JPS5838693A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5332533U (zh) * | 1976-08-26 | 1978-03-22 | ||
JPS5436751A (en) * | 1977-08-29 | 1979-03-17 | Toshiba Corp | Display device |
Also Published As
Publication number | Publication date |
---|---|
JPS5838693A (ja) | 1983-03-07 |
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