JPH0413078B2 - - Google Patents
Info
- Publication number
- JPH0413078B2 JPH0413078B2 JP56135562A JP13556281A JPH0413078B2 JP H0413078 B2 JPH0413078 B2 JP H0413078B2 JP 56135562 A JP56135562 A JP 56135562A JP 13556281 A JP13556281 A JP 13556281A JP H0413078 B2 JPH0413078 B2 JP H0413078B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- copper
- soldering
- printed circuit
- tin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
- 238000005476 soldering Methods 0.000 claims description 10
- 229910000765 intermetallic Inorganic materials 0.000 claims description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims 1
- 239000002244 precipitate Substances 0.000 claims 1
- 239000011133 lead Substances 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Description
【発明の詳細な説明】
本発明は、錫および鉛に銅を添加した半田を使
用したプリント基板の半田付方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for soldering printed circuit boards using solder containing tin and lead with copper added.
従来、錫および鉛を主成分とする半田付け、特
に浸漬半田付けや噴流半田付においては、銅は不
純物であり、一部被半田付け部品の銅くわれを減
少させる目的で、あるいは半田の機械的強度を増
加させる目的で、銅を飽和点を超えない範囲内で
添加する例はあるが、飽和点以上の銅を添加して
使用する例はなかつた。 Conventionally, copper is an impurity in soldering that mainly uses tin and lead, especially immersion soldering and jet soldering. There are examples of adding copper within a range that does not exceed the saturation point for the purpose of increasing the mechanical strength, but there have been no examples of adding copper at a level above the saturation point.
本発明の目的は、飽和点以上の量の銅を添加し
た半田を使用して、半田付部分の抵抗値を低下さ
せ、例えばオーディオ機器においては半田付部分
に起因する音質を向上できるようにしたプリント
基板の半田付方法を提供することである。 An object of the present invention is to reduce the resistance value of the soldered part by using solder to which copper is added in an amount above the saturation point, and to improve the sound quality caused by the soldered part in audio equipment, for example. An object of the present invention is to provide a method for soldering a printed circuit board.
以下、本発明を実施例によつて説明する。一般
に、半田付温度に制限がなければ、銅を半田にい
くらでも溶融させることができるが、プリント基
板の半田付けではその基板の耐熱性から、せいぜ
い260℃が限度となり、この温度では銅は約0.6％
で飽和する。それ以上に銅を溶解させようとする
と、錫と銅、鉛と銅、錫と鉛と銅といつた金属間
化合物１として図に示すように析出するようにな
る。図中、２は半田槽、３は溶融半田である。 Hereinafter, the present invention will be explained with reference to Examples. Generally, if there is no limit to the soldering temperature, copper can be melted into the solder as much as desired, but when soldering printed circuit boards, the limit is at most 260°C due to the heat resistance of the board, and at this temperature copper melts at approximately 0.6°C. %
becomes saturated. If an attempt is made to dissolve more copper than that, intermetallic compounds 1 such as tin and copper, lead and copper, and tin, lead and copper will be precipitated as shown in the figure. In the figure, 2 is a solder bath and 3 is molten solder.
そこで、一例として成分が錫63％、銅0.7％、
鉛残部の半田を、約400℃で均一に溶解してから
冷却して半田インゴツトを製造する。そして、使
用時に、この半田インゴツトを半田槽に投入して
約250〜260℃で加熱・溶解させる。 Therefore, as an example, the ingredients are 63% tin, 0.7% copper,
The remaining lead solder is uniformly melted at approximately 400°C and then cooled to produce a solder ingot. Then, at the time of use, this solder ingot is put into a solder bath and heated and melted at about 250 to 260°C.
このようにすると、固体（半田インゴツト）→
溶融（半田槽内で金属間化合物が析出した浮遊し
ている）→半田付→冷却→固化の各工程毎に上記
した金属間化合物の発生状態のバラツキが少なく
なり、すなわち半田付部分に銅の金属間化合物が
均一に存在することとなり、オーディオ機器にそ
の半田を利用する場合、従来の半田を利用した場
合に比べてその半田付部分に起因する音質が良好
となる。 In this way, solid (solder ingot) →
In each step of melting (intermetallic compounds are precipitated and floating in the solder bath) → soldering → cooling → solidification, the variation in the state of generation of the above-mentioned intermetallic compounds is reduced, that is, copper is deposited in the soldered part. The intermetallic compound is uniformly present, and when the solder is used in audio equipment, the sound quality due to the soldered part is better than when conventional solder is used.
なお、上記のように半田インゴツトを製造した
後、その半田インゴツトを一且約300℃にまで加
熱して銅を完全に溶解し、その後被半田付部分の
耐熱温度にまで冷却して、そこで半田付けを行な
うようにすることもできる。この場合は、金属間
化合物の発生状態がより均一となり、上記音質が
より良好となる。 After manufacturing the solder ingot as described above, the solder ingot is heated to about 300°C to completely melt the copper, and then cooled to the heat-resistant temperature of the part to be soldered, and then soldered. It is also possible to perform attachment. In this case, the state of generation of intermetallic compounds becomes more uniform, and the above-mentioned sound quality becomes better.
以上のように、本発明によれば、半田付部分に
銅の金属間化合物が均一に存在するので、従来の
半田を使用する場合に比較し、半田付部分の抵抗
値を低下させ、例えばオーディオ機器においては
半田付部分に起因する音質を向上させることがで
きる。 As described above, according to the present invention, since the copper intermetallic compound is uniformly present in the soldered part, the resistance value of the soldered part is lowered compared to the case where conventional solder is used. In equipment, it is possible to improve the sound quality caused by soldered parts.
図は半田内の金属間化合物の析出状態を示す図
である。
１……金属間化合物、２……半田槽、３……溶
融半田。
The figure shows the state of precipitation of intermetallic compounds in solder. 1... Intermetallic compound, 2... Solder tank, 3... Molten solder.
Claims (1)
上となる銅を溶融させて製造した錫と鉛を主成分
とする半田を使用し、上記作業時点における溶融
半田中に銅の金属間化合物の粒子が析出して浮遊
している溶融状態に保ちながらプリント基板の半
田付けを行なうことを特徴とするプリント基板の
半田付方法。1. Solder whose main components are tin and lead produced by melting copper whose melting temperature is at or above the saturation point at the time of work is used, and particles of copper intermetallic compounds are present in the molten solder at the time of work. A method for soldering a printed circuit board, characterized by soldering the printed circuit board while maintaining a molten state in which precipitates are floating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13556281A JPS5838693A (en) | 1981-08-31 | 1981-08-31 | Soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13556281A JPS5838693A (en) | 1981-08-31 | 1981-08-31 | Soldering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5838693A JPS5838693A (en) | 1983-03-07 |
| JPH0413078B2 true JPH0413078B2 (en) | 1992-03-06 |
Family
ID=15154708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13556281A Granted JPS5838693A (en) | 1981-08-31 | 1981-08-31 | Soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5838693A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4622205A (en) * | 1985-04-12 | 1986-11-11 | Ibm Corporation | Electromigration lifetime increase of lead base alloys |
| WO2013108421A1 (en) * | 2012-05-10 | 2013-07-25 | 千住金属工業株式会社 | Solder alloy for acoustic device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5332533U (en) * | 1976-08-26 | 1978-03-22 | ||
| JPS5436751A (en) * | 1977-08-29 | 1979-03-17 | Toshiba Corp | Display device |
-
1981
- 1981-08-31 JP JP13556281A patent/JPS5838693A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5332533U (en) * | 1976-08-26 | 1978-03-22 | ||
| JPS5436751A (en) * | 1977-08-29 | 1979-03-17 | Toshiba Corp | Display device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5838693A (en) | 1983-03-07 |
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