JPH11333589A - Added alloy for nonlead solder - Google Patents
Added alloy for nonlead solderInfo
- Publication number
- JPH11333589A JPH11333589A JP15860198A JP15860198A JPH11333589A JP H11333589 A JPH11333589 A JP H11333589A JP 15860198 A JP15860198 A JP 15860198A JP 15860198 A JP15860198 A JP 15860198A JP H11333589 A JPH11333589 A JP H11333589A
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- Japan
- Prior art keywords
- solder
- alloy
- lead
- added
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、無鉛はんだ用の合
金に係り、はんだ母材に対して添加物として投入され、
母材に溶解して有効に機能する合金に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an alloy for lead-free solder, and is added as an additive to a solder base material.
It relates to an alloy that functions effectively when dissolved in a base material.
【0002】[0002]
【発明が解決しようとする課題】はんだ合金の従来から
の組成において鉛ははんだ合金の特性を決定するものと
して非常に有効に機能するが、近年鉛の毒性が問題にな
っており、鉛を組成物から忌避した無鉛はんだの開発が
盛んである。そして、これら無鉛はんだのほとんどは錫
を主成分としている。即ち、錫は毒性が低く、金、銀、
銅、ニッケルあるいは亜鉛など数多くの金属との融合性
が高く、また高い反応性でよく拡散して金属表面に濡れ
るために、電子部品の組立用はんだ合金の主成分として
不可欠である。しかし、錫を主成分にした無鉛はんだ合
金では、錫の高い反応性を原因として、添加した金属
や、接合時における母材表面から溶出した銅や銀などの
金属と結合して金属間化合物を生成してしまうことにな
る。ところがこれらの化合物は一般にはんだ合金の融点
よりも高い融点を有しているために、はんだ合金の流動
性を阻害して、はんだ付け作業時にはんだ接合部の欠陥
であるブリッジや、ツララ現象を発生させる要因とな
る。また、化合物は凝固時に針状結晶となってはんだ中
に析出し、表面の滑らかさが失われて、光沢のないザラ
ザラとした概観の悪いはんだ付けになり、商品価値を低
くするばかりか、最近の密度の高い、線が密集している
回路であればマイクロブリッジや針状線を構成してしま
い、ショートの原因になることもある。In the conventional composition of a solder alloy, lead functions very effectively to determine the properties of the solder alloy, but in recent years the toxicity of lead has become a problem, The development of lead-free solder that has been repelled from objects is actively pursued. Most of these lead-free solders contain tin as a main component. That is, tin has low toxicity, gold, silver,
It is indispensable as a main component of a solder alloy for assembling electronic components, because it has high fusion with many metals such as copper, nickel, and zinc, and is highly reactive and well diffuses and wets the metal surface. However, in lead-free solder alloys containing tin as the main component, due to the high reactivity of tin, intermetallic compounds are formed by bonding with added metals and metals such as copper and silver eluted from the base material surface during joining. Will be generated. However, these compounds generally have a melting point higher than the melting point of the solder alloy, which hinders the fluidity of the solder alloy and causes bridges, which are defects in the solder joints, and glazing during soldering. It is a factor to make it. In addition, the compound becomes needle-like crystals during solidification and precipitates in the solder, losing the smoothness of the surface, resulting in a low-gloss, rough-looking solder that not only reduces the commercial value, In a circuit having a high density and dense lines, a microbridge or a needle-like line may be formed, which may cause a short circuit.
【0003】そこで、発明者はこれらの課題を解決する
組成として、錫を主成分としてニッケルを微量だけ
(0.002〜1重量%)添加するはんだ合金を開示し
た(特願平10−100141号)。ニッケルは、比較
的少量を加えることによって、錫と多の金属との合金、
例えばプリント基板のリード線や端子に用いられている
銅との合金が凝固するときに不可避的に発生する針状結
晶を抑制する作用があることを確認し、これに着目した
ものである。ニッケルは、融点が1453℃と非常に高
いところにあるが、上記添加量程度であれば錫に溶解し
て均一に分散する。さらに、ニッケルを含む場合には、
これを含まない場合とは全く異なり、凝固中の体積収縮
から起こる引け巣の様子がSn−Pb系共晶はんだの特
徴に似て、ひとつの大きい窪みになり、かつ表面が滑ら
かになることが目視によって観察された。従って、錫に
ニッケルを比較的少量添加することによって、はんだ合
金中の化合物の発生を抑制し、さらにはんだ凝固時の針
状結晶の生成をも抑制することができる。しかも、接合
部の機械的強度を低下させることなく、経年安定性に優
れ、高い信頼性と作業性を確保することが可能となる。Accordingly, the inventors have disclosed a solder alloy containing tin as a main component and a small amount of nickel (0.002 to 1% by weight) as a composition for solving these problems (Japanese Patent Application No. 10-100141). ). Nickel, by adding a relatively small amount, is an alloy of tin and many metals,
For example, it has been confirmed that the alloy with copper used for lead wires and terminals of a printed circuit board has an effect of suppressing needle crystals that are inevitably generated when solidified, and attention has been paid to this fact. Nickel has a very high melting point of 1453 ° C., but if it is in the above amount, it is dissolved in tin and uniformly dispersed. Furthermore, when nickel is included,
Unlike the case not including this, the state of shrinkage cavities caused by volume shrinkage during solidification becomes one large depression and the surface becomes smooth, similar to the characteristics of Sn-Pb eutectic solder. Observed visually. Therefore, by adding a relatively small amount of nickel to tin, it is possible to suppress the generation of a compound in the solder alloy and further suppress the formation of needle-like crystals during solidification of the solder. In addition, it is possible to ensure excellent aging stability and to ensure high reliability and workability without lowering the mechanical strength of the joint.
【0004】ところで、ニッケルは上述したように融点
が1453℃であるために、はんだ母材中に投入する添
加量が少ない場合であっても、はんだ合金の融点は高く
なるほうに推移する。また、ニッケルが錫を主とする合
金に対して他の金属との間で化合物を構成することを回
避する作用があるのであれば、予めはんだ合金中に溶解
させるばかりでなく、溶融しているはんだ槽に別個に添
加物として投入することによっても、使用中のはんだを
改良することができる。発明者はこの点に着目して、は
んだ合金の組成として好適であるニッケルを溶解はんだ
槽に対する添加物とすることとした。Since the melting point of nickel is 1453 ° C. as described above, the melting point of the solder alloy tends to be higher even if the amount of nickel added is small. In addition, if nickel has an effect of avoiding the formation of a compound between another alloy and a tin-based alloy, the alloy is not only melted in the solder alloy in advance but also melted. Solder in use can also be improved by separately adding it as an additive to the solder bath. Focusing on this point, the inventor has decided to use nickel, which is suitable as a composition of the solder alloy, as an additive to the molten solder tank.
【0005】本発明ではこのように溶解はんだ槽に添加
することによってはんだを改良することができる無鉛は
んだ用添加合金を開示することを目的とするものであ
る。[0005] It is an object of the present invention to disclose an additive alloy for lead-free solder which can improve the solder by being added to the molten solder bath as described above.
【0006】[0006]
【課題を解決するための手段】本発明では、上述した目
的を達成するために、Ni0.1〜10重量%およびS
n残部とし、Snを主成分とする溶解無鉛はんだ中に投
入拡散する無鉛はんだ用添加合金を構成した。また、よ
り好ましいNiの含有量として、さらに1〜3重量%の
範囲で特定することとした。According to the present invention, in order to achieve the above-mentioned object, 0.1 to 10% by weight of Ni and S
An n-remainder was used to form an additive alloy for lead-free solder that was introduced and diffused into a molten lead-free solder containing Sn as a main component. Further, as a more preferable Ni content, it is specified in the range of 1 to 3% by weight.
【0007】さらにまた、はんだ合金のより有効な作用
を高めるために、ニッケルに加えてさらにGe、Ga又
はPからなる群から選ばれた1又は複数をそれぞれ0.
1〜5重量%加えた無鉛はんだ用添加合金を構成した。
また、これら微量金属のより好ましい含有量として、
0.1〜1重量%の範囲に限定することとした。Furthermore, in order to enhance the more effective action of the solder alloy, one or more elements selected from the group consisting of Ge, Ga and P in addition to nickel are each added to 0.1.
An additive alloy for lead-free solder added at 1 to 5% by weight was constituted.
Further, as a more preferable content of these trace metals,
The range is limited to 0.1 to 1% by weight.
【0008】これらの手段において、錫ははんだ母材の
主金属と同一のものであり、濡れ性が高く、電子回路を
構成するリード線などとの接合性が非常に高い。本発明
の添加合金においても錫を主成分としたのは、次の理由
による。ニッケルは融点が錫と比較して非常に高く、は
んだに投入する添加量がごくわずかであっても、240
〜250℃程度の比較的低い温度で溶解しているはんだ
中では短時間で均一に溶解して拡散することが困難であ
る。そこで、本発明では元来溶解性がよく、またはんだ
槽に溶解中の無鉛はんだの主成分である錫にニッケルを
予め配合し、添加合金自体の融点を下げることによっ
て、溶解はんだ中への敏速な均一拡散を行わしめるもの
である。[0008] In these means, tin is the same as the main metal of the solder base material, has high wettability, and has very high bondability with a lead wire constituting an electronic circuit. The main reason for using tin in the additive alloy of the present invention is as follows. Nickel has a very high melting point compared to tin, and even if the amount added to the solder is very small, 240
It is difficult to uniformly dissolve and diffuse in a short time in a solder melted at a relatively low temperature of about 250 ° C. Therefore, in the present invention, nickel is preliminarily blended with tin, which is a main component of the lead-free solder being melted in a soldering bath, or by lowering the melting point of the added alloy itself, so that the molten alloy can be rapidly melted. This is to perform uniform diffusion.
【0009】無鉛はんだにおけるニッケル含有量は、実
験の結果から0.01〜0.1重量%によってある程度
の期待する効果を奏することができる。また、溶解はん
だ中に新たな錫が投入されることによる成分変化を極力
防ぐ必要があることを考慮すれば、投入する添加合金中
のニッケル濃度は添加合金自体の融点があまり高くなり
すぎない範囲で極力高いほうが好ましい。このことか
ら、本発明ではニッケル含有量を0.1〜10重量%と
した。また、溶解はんだに投入後の濃度調整を考慮し
て、より好ましい範囲として1〜3重量%に特定した。
そして、この添加合金を溶解無鉛はんだ槽に投入して、
はんだ自体のニッケル量を調整する。例えば、錫98重
量%、ニッケル2重量%の添加合金を、融点が227℃
である錫99.3重量%、銅0.7重量%の溶解はんだ
を250℃まで昇温して投入したところ、添加合金はス
ムーズに溶解し、短時間で均一に拡散し、Sn−Cu−
Niの3元はんだを構成する。添加合金の融点よりも低
い温度で溶解する理由は、錫の溶解性および添加物との
同質性、さらにははんだ槽の膨大な熱エネルギーによる
ものである。そして、上記無鉛はんだ99kgに対して上
記含有量の添加合金を1kg投入すると、ニッケル含有量
が0.02重量%に調整されることになる。これらの無
鉛はんだと添加合金との重量比は、上記「無鉛はんだに
おけるニッケル含有量」として示した0.01〜0.1
重量%の範囲で適宜調整することになる。ただし、この
範囲は本発明においては絶対的なものではなく、あくま
でも添加合金中の重量比が発明の本質であることはいう
までもない。From the results of experiments, the nickel content in the lead-free solder is 0.01 to 0.1% by weight. Also, considering that it is necessary to minimize the component change due to the introduction of new tin into the molten solder, the nickel concentration in the added alloy is within the range where the melting point of the added alloy itself does not become too high. Is preferably as high as possible. For this reason, in the present invention, the nickel content is set to 0.1 to 10% by weight. Further, in consideration of the concentration adjustment after being put into the molten solder, a more preferable range is specified as 1 to 3% by weight.
And this added alloy is put into a molten lead-free solder bath,
Adjust the nickel content of the solder itself. For example, an alloy containing 98% by weight of tin and 2% by weight of nickel is melted at 227 ° C.
When the molten solder containing 99.3% by weight of tin and 0.7% by weight of copper was heated to 250 ° C. and put therein, the added alloy was melted smoothly, diffused uniformly in a short time, and Sn—Cu—
A ternary solder of Ni is formed. The reason for melting at a temperature lower than the melting point of the additive alloy is due to the solubility of tin and the homogeneity with the additive, and further, the enormous heat energy of the solder bath. Then, when 1 kg of the additive alloy having the above content is added to 99 kg of the lead-free solder, the nickel content is adjusted to 0.02% by weight. The weight ratio between these lead-free solders and the additive alloys was 0.01 to 0.1, which was indicated as the “nickel content in the lead-free solders”.
It will be adjusted appropriately within the range of weight%. However, this range is not absolute in the present invention, and it goes without saying that the weight ratio in the added alloy is the essence of the present invention.
【0010】ゲルマニウムGe、ガリウムGa、および
燐Pはそれぞれはんだ槽表面に浮遊する滓の発生を防止
する機能があるが、個々に溶解はんだ中において0.0
01〜0.01重量%で効果を発揮する。例えば、上記
のように99:1の割合で添加合金を投入するのであれ
ば、添加合金中の配分は0.1〜1重量%で十分である
が、投入割合には幅があるので、0.1〜5重量%の範
囲で調整する。[0010] Germanium Ge, gallium Ga, and phosphorus P each have the function of preventing the generation of slag floating on the surface of the solder bath.
The effect is exerted at a content of from 0.01 to 0.01% by weight. For example, if the additive alloy is introduced at a ratio of 99: 1 as described above, 0.1 to 1% by weight is sufficient for the distribution in the additive alloy. Adjust in the range of 1 to 5% by weight.
【0011】なお、一般に使用されている自動はんだ槽
のはんだ容量を基本として考えれば、適切な添加量を得
るためには添加合金の形状は1個で数百グラム〜数キロ
グラムのインゴット形状や、棒状にするほうがよい。た
だし、計算で算出した重量を正確に投入するためには調
整用の補助物として小型のペレットや粉末、あるいはワ
イヤにすることもある。また、短時間で均一な拡散を要
望するときには、却ってこれらの構造が有効に作用す
る。[0011] Considering the solder capacity of a commonly used automatic soldering bath as a basis, in order to obtain an appropriate amount of addition, the shape of the added alloy can be several hundred grams to several kilograms in an ingot shape, It is better to make it stick-shaped. However, in order to accurately input the calculated weight, small pellets, powders, or wires may be used as adjustment aids. In addition, when uniform diffusion is required in a short time, these structures work rather effectively.
【0012】[0012]
【実施例】(実施例1)予め作成したNi2重量%(以
下の比率も全て重量%である)、残部Snの添加合金1
kgの塊を、Sn99.3%、Cu0.7%の組成からな
り、融点が227℃の無鉛はんだを250℃雰囲気で溶
解させた99kgのはんだ槽中に投入し、2分待った後に
ステンレス製のへらでゆっくりと撹拌した。確認したと
ころ、投入した添加合金の塊は既に溶解していた。この
場合、Ni含有量は0.02%であった。このはんだ合
金を用いて、リード間隔が0.65mmピッチの表面実装
用IC付きのプリント基板をRAタイプのフラックスを
使用して250℃ではんだ付けを行ったところ、ブリッ
ジやツララ現象は発生しなかった。また、接合部を20
倍程度に拡大して観察したところ、はんだ表面は滑らか
であり、異常な結晶は見当たらなかった。さらに、はん
だ槽が冷え固まったときのはんだ合金表面も滑らかであ
り、表面に針状結晶などが生成していないことも確認す
ることができた。(Example 1) 2% by weight of Ni prepared in advance (all of the following ratios are also% by weight), and an additive alloy 1 with the balance being Sn
A lump of kg was put into a 99 kg solder bath having a composition of 99.3% Sn and 0.7% Cu and having a melting point of 227 ° C. and a lead-free solder having a melting point of 227 ° C. melted in a 250 ° C. atmosphere. Stir slowly with a spatula. It was confirmed that the lump of the added alloy had already been melted. In this case, the Ni content was 0.02%. Using this solder alloy, when a printed circuit board with a surface mounting IC with a lead interval of 0.65 mm was soldered at 250 ° C. using an RA type flux, no bridging or glaring phenomenon occurred. Was. In addition, the joint is 20
When observed at about twice magnification, the solder surface was smooth and no abnormal crystals were found. Furthermore, it was also confirmed that the surface of the solder alloy when the solder bath was cooled and solidified was smooth, and that no needle-like crystals were formed on the surface.
【0013】(実施例1の強度試験)実施例1で添加合
金を投入拡散した後のはんだ合金の強度を引っ張り試験
機で検査した。試験片ははんだ槽からステンレス製のし
ゃもじで汲み出して、鉄の鋳型に注入して放冷凝固さ
せ、取り出してからヤスリなどを使用して整形した。引
っ張り試験機にセットし、室温で引っ張り速度10mm/
秒の条件にて測定した。その結果、強度が3.3kg/平
方ミリメートルであった。ちなみに、添加合金を投入す
る前のはんだでは、同様に試験を行ったところ、強度が
3.2kg/平方ミリメートルであった。(Strength Test of Example 1) The strength of the solder alloy after the addition alloy was injected and diffused in Example 1 was inspected by a tensile tester. The test piece was pumped out of the solder bath with a stainless steel scoop, poured into an iron mold, allowed to cool and solidify, taken out, and shaped using a file or the like. Set in a tensile tester, and at room temperature, tensile speed 10mm /
It was measured under the condition of seconds. As a result, the strength was 3.3 kg / mm 2. Incidentally, the same test was conducted on the solder before adding the additive alloy, and the strength was 3.2 kg / mm 2.
【0014】(実施例2)Sn99.3%、Cu0.7
%の組成からなる融点が227℃の無鉛はんだ合金に、
10%のNiを含む本発明の添加合金を投入して、Ni
濃度が1%になるように調整したはんだ合金を、実施例
1と同様に検査したところ、はんだ合金表面は非常に滑
らかであった。また、実施例1と同様に強度試験を行っ
たところ、強度は実施例1と同じように3.3kg/平方
ミリメートルであった。Example 2 99.3% of Sn, 0.7 of Cu
% Lead-free solder alloy with a melting point of 227 ° C.
The additive alloy of the present invention containing 10% Ni is charged, and Ni is added.
When the solder alloy adjusted to have a concentration of 1% was inspected in the same manner as in Example 1, the solder alloy surface was very smooth. When a strength test was performed in the same manner as in Example 1, the strength was 3.3 kg / mm 2 as in Example 1.
【0015】(実施例3)予め作成したNi2%、Ga
0.5%、残部Snの添加合金1kgの塊を、Sn99.
3%、Cu0.7%の組成からなり、融点が227℃の
無鉛はんだを250℃雰囲気で溶解させた99kgのはん
だ槽中に投入し、2分待った後にステンレス製のへらで
ゆっくりと撹拌した。確認したところ、投入した添加合
金の塊は既に溶解していた。この場合、Ni含有量は
0.02%、Gaは0.005%となる。このはんだ合
金は、上記添加合金の投入直後からはんだ表面の色が金
属的な白色を増し、それまで発生していた表面の滓の発
生が激減した。なお、GeおよびPの添加であっても同
じ効果を期待することが可能である。(Embodiment 3) Ni 2%, Ga
A lump of 1 kg of an alloy containing 0.5% and a balance of Sn was added to Sn99.
A lead-free solder having a composition of 3% and Cu of 0.7% and having a melting point of 227 ° C. was put into a 99 kg solder bath in which an atmosphere of 250 ° C. was melted. After waiting for 2 minutes, the mixture was slowly stirred with a stainless steel spatula. It was confirmed that the lump of the added alloy had already been melted. In this case, the Ni content is 0.02% and the Ga content is 0.005%. Immediately after the addition of the additive alloy, the color of the solder surface of the solder alloy became metallic white, and the generation of slag on the surface, which had occurred up to that time, was drastically reduced. Note that the same effect can be expected even when Ge and P are added.
【0016】(比較例)Sn99.3%、Cu0.7%
の組成からなる融点227℃の無鉛はんだ合金を用いて
リード間隔が0.65mmピッチの表面実装用IC付きの
プリント基板をRAタイプのフラックスを使用して25
0℃ではんだ付けを行ったところ、ブリッジがリードの
間に多数発生した。これらのブリッジは、リード間だけ
でなくリードを数本またぐようにして発生していたもの
も認められた。また、リード間隔が2.5mmピッチのコ
ネクタ付きのプリント基板に同様にしてはんだ付けした
ところ、やはりブリッジやツララが多数発生した。接合
部を20倍程度に拡大して観察したところ、はんだ表面
はザラザラとして異常な結晶が見られた。これらはSn
−Cu金属化合物による針状結晶であった。また、IC
リード間のブリッジ中には非常に細い針状のマイクロブ
リッジが見られ、これらは融点が高く、活性の高いフラ
ックスでも容易に除去することができないため、はんだ
付け品質の向上は困難であると推測される。はんだ槽が
冷え固まったときのはんだ合金表面には針状結晶が発生
し、凹凸が見られただけでなく、場所によっては大きい
われが発生して、段差もあることが観察された。これ
は、はんだ内部にひずみが発生しているためと考えられ
る。(Comparative Example) Sn 99.3%, Cu 0.7%
Using a lead-free solder alloy having a melting point of 227 ° C. and a lead pitch of 0.65 mm, a printed circuit board with a surface mounting IC having a composition of
When soldering was performed at 0 ° C., many bridges were generated between the leads. Some of these bridges occurred not only between the leads but also across several leads. Further, when soldering was similarly performed on a printed board with a connector having a lead interval of 2.5 mm pitch, a large number of bridges and icicles also occurred. When the joint was observed at a magnification of about 20 times, an abnormal crystal was observed as a rough surface on the solder. These are Sn
-Needle-like crystals of a Cu metal compound. Also, IC
Very thin needle-like microbridges are found in the bridge between the leads, which have a high melting point and cannot be easily removed even with highly active flux, so it is presumed that improving the soldering quality is difficult. Is done. Needle-like crystals were formed on the surface of the solder alloy when the solder bath was cooled and solidified, and not only irregularities were observed, but also large cracks were generated in some places, and it was observed that there were steps. This is considered to be due to the occurrence of distortion inside the solder.
【0017】[0017]
【発明の効果】本発明は、上述したようにはんだ合金母
材に直接添加物を入れるのではなく、別途製造した塊状
やペレット状の添加合金を構成したので、錫を主成分と
した溶解はんだに非常によく混ざり合い、短時間のうち
に均一に拡散するので、計算通りのはんだ組成を、はん
だの溶解槽中で達成することができる。As described above, the present invention does not directly add an additive to the solder alloy base material, but instead forms a separately manufactured bulk or pellet-shaped additive alloy. It mixes very well and diffuses evenly in a short time, so that a calculated solder composition can be achieved in the solder melting bath.
Claims (4)
し、Snを主成分とする溶解無鉛はんだ中に投入拡散す
る無鉛はんだ用添加合金。1. An additive alloy for lead-free solder which contains 0.1 to 10% by weight of Ni and the balance of Sn and is introduced and diffused into a molten lead-free solder containing Sn as a main component.
した請求項1記載の無鉛はんだ用添加合金。2. The additive alloy for lead-free solder according to claim 1, wherein the content of Ni is preferably 1 to 3% by weight.
Pからなる群から選ばれた1又は複数をそれぞれ0.1
〜5重量%加えた無鉛はんだ用添加合金。3. The method according to claim 1, wherein one or more members selected from the group consisting of Ge, Ga and P are each 0.1%.
Additive alloy for lead-free solders added by up to 5% by weight.
ましくは0.1〜1重量%である無鉛はんだ用添加合
金。4. The additive alloy for lead-free solder according to claim 3, wherein Ge, Ga or P is preferably 0.1 to 1% by weight.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15860198A JP4039594B2 (en) | 1998-05-22 | 1998-05-22 | Lead-free solder additive alloy |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15860198A JP4039594B2 (en) | 1998-05-22 | 1998-05-22 | Lead-free solder additive alloy |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH11333589A true JPH11333589A (en) | 1999-12-07 |
JP4039594B2 JP4039594B2 (en) | 2008-01-30 |
Family
ID=15675271
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---|---|---|---|
JP15860198A Expired - Lifetime JP4039594B2 (en) | 1998-05-22 | 1998-05-22 | Lead-free solder additive alloy |
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JP (1) | JP4039594B2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003059564A1 (en) | 2002-01-10 | 2003-07-24 | Senju Metal Industry Co., Ltd. | Soldering method and solder alloy for additional supply |
WO2007013433A1 (en) * | 2005-07-26 | 2007-02-01 | Nihon Superior Sha Co., Ltd. | METHOD OF DEPOSITING COPPER IN LEAD-FREE SOLDER, METHOD OF GRANULATING (CuX)6Sn5 COMPOUND AND METHOD OF SEPARATING THE SAME, AND METHOD OF RECOVERING TIN |
JP2007038228A (en) * | 2005-07-29 | 2007-02-15 | Nihon Almit Co Ltd | Solder alloy |
JP2008142721A (en) * | 2006-12-06 | 2008-06-26 | Nihon Superior Co Ltd | Lead-free solder alloy |
WO2009104271A1 (en) * | 2008-02-22 | 2009-08-27 | 株式会社日本スペリア社 | Method of regulating nickel concentration in lead-free solder containing nickel |
JP2012509992A (en) * | 2008-11-28 | 2012-04-26 | ▲広▼州▲瀚▼源▲電▼子科技有限公司 | Lead-free solder dross reduction method |
-
1998
- 1998-05-22 JP JP15860198A patent/JP4039594B2/en not_active Expired - Lifetime
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003059564A1 (en) | 2002-01-10 | 2003-07-24 | Senju Metal Industry Co., Ltd. | Soldering method and solder alloy for additional supply |
US7628308B2 (en) | 2002-01-10 | 2009-12-08 | Senju Metal Industry Co., Ltd. | Method of replenishing an oxidation suppressing element in a solder bath |
WO2007013433A1 (en) * | 2005-07-26 | 2007-02-01 | Nihon Superior Sha Co., Ltd. | METHOD OF DEPOSITING COPPER IN LEAD-FREE SOLDER, METHOD OF GRANULATING (CuX)6Sn5 COMPOUND AND METHOD OF SEPARATING THE SAME, AND METHOD OF RECOVERING TIN |
US7591873B2 (en) | 2005-07-26 | 2009-09-22 | Nihon Superior Sha Co., Ltd. | Method of copper precipitation in lead-free solder, granulation and separation of (CuX)6Sn5 compounds and recovery of tin |
US8163061B2 (en) | 2005-07-26 | 2012-04-24 | Nihon Superior Sha Co., Ltd. | Method of copper precipitation in lead-free solder, granulation and separation of (CuX)6Sn5 compounds and recovery of tin |
JP5006787B2 (en) * | 2005-07-26 | 2012-08-22 | 株式会社日本スペリア社 | Method for depositing copper in lead-free solder, method for granulating and separating (CuX) 6Sn5-based compound, and method for recovering tin |
JP2007038228A (en) * | 2005-07-29 | 2007-02-15 | Nihon Almit Co Ltd | Solder alloy |
JP2008142721A (en) * | 2006-12-06 | 2008-06-26 | Nihon Superior Co Ltd | Lead-free solder alloy |
WO2009104271A1 (en) * | 2008-02-22 | 2009-08-27 | 株式会社日本スペリア社 | Method of regulating nickel concentration in lead-free solder containing nickel |
JP5249958B2 (en) * | 2008-02-22 | 2013-07-31 | 株式会社日本スペリア社 | Ni concentration adjustment method for lead-free solder containing Ni |
US8557021B2 (en) | 2008-02-22 | 2013-10-15 | Nihon Superior Sha Co., Ltd. | Method of regulating nickel concentration in lead-free solder containing nickel |
JP2012509992A (en) * | 2008-11-28 | 2012-04-26 | ▲広▼州▲瀚▼源▲電▼子科技有限公司 | Lead-free solder dross reduction method |
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