JPH0413078B2 - - Google Patents

Info

Publication number
JPH0413078B2
JPH0413078B2 JP56135562A JP13556281A JPH0413078B2 JP H0413078 B2 JPH0413078 B2 JP H0413078B2 JP 56135562 A JP56135562 A JP 56135562A JP 13556281 A JP13556281 A JP 13556281A JP H0413078 B2 JPH0413078 B2 JP H0413078B2
Authority
JP
Japan
Prior art keywords
solder
copper
soldering
printed circuit
tin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56135562A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5838693A (ja
Inventor
Kenichi Kita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pioneer Corp
Original Assignee
Pioneer Electronic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pioneer Electronic Corp filed Critical Pioneer Electronic Corp
Priority to JP13556281A priority Critical patent/JPS5838693A/ja
Publication of JPS5838693A publication Critical patent/JPS5838693A/ja
Publication of JPH0413078B2 publication Critical patent/JPH0413078B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP13556281A 1981-08-31 1981-08-31 プリント基板の半田付方法 Granted JPS5838693A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13556281A JPS5838693A (ja) 1981-08-31 1981-08-31 プリント基板の半田付方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13556281A JPS5838693A (ja) 1981-08-31 1981-08-31 プリント基板の半田付方法

Publications (2)

Publication Number Publication Date
JPS5838693A JPS5838693A (ja) 1983-03-07
JPH0413078B2 true JPH0413078B2 (cs) 1992-03-06

Family

ID=15154708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13556281A Granted JPS5838693A (ja) 1981-08-31 1981-08-31 プリント基板の半田付方法

Country Status (1)

Country Link
JP (1) JPS5838693A (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013108421A1 (ja) * 2012-05-10 2013-07-25 千住金属工業株式会社 音響用はんだ合金

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5332533U (cs) * 1976-08-26 1978-03-22
JPS5436751A (en) * 1977-08-29 1979-03-17 Toshiba Corp Display device

Also Published As

Publication number Publication date
JPS5838693A (ja) 1983-03-07

Similar Documents

Publication Publication Date Title
JPH09216089A (ja) はんだ合金、クリームはんだ、及びはんだ付け方法
US3210182A (en) Selective removal of excess solder
KR100671394B1 (ko) Ｐｂ프리 땜납 합금을 이용한 리플로우 납땜 방법 및 혼재실장 방법 및 혼재 실장 구조체
JP3643008B2 (ja) はんだ付け方法
JPH0413078B2 (cs)
JP2004154864A (ja) 鉛フリーはんだ合金
TWI812401B (zh) 焊料合金及焊料接頭
JP4338854B2 (ja) スズ−ビスマス系無鉛はんだ
US20040144829A1 (en) Method of soldering lead-free solder, and joined object soldered by the soldering method
JP3963501B2 (ja) 電子部品の実装方法
JPH0521260A (ja) チツプ部品およびその製造方法と実装構造
US3607252A (en) Solder alloy composition
JPH11333589A (ja) 無鉛はんだ用添加合金
TW202106434A (zh) 焊料合金、鑄造物、形成物及焊料接頭
KR100560708B1 (ko) 납땜방법
JPH06177514A (ja) プリント配線板の製造方法
HK40082316A (en) Soft solder alloy and solder joint
JPH01230213A (ja) 電子部品
KR920007930B1 (ko) 용융납땜중의 동(Cu) 제거방법
JP2003179345A (ja) Ｐｂフリー半田付け物品
JP2580889B2 (ja) 高温はんだ
JPS601937B2 (ja) 耐酸化性鉛錫半田用母合金
JPS63224291A (ja) 半田付け方法
US20040155097A1 (en) Soldering method and method for manufacturing component mounting board
JP2002178140A (ja) 鉛フリーはんだ用のリフロー方法