JPH0412696Y2 - - Google Patents

Info

Publication number
JPH0412696Y2
JPH0412696Y2 JP1985036315U JP3631585U JPH0412696Y2 JP H0412696 Y2 JPH0412696 Y2 JP H0412696Y2 JP 1985036315 U JP1985036315 U JP 1985036315U JP 3631585 U JP3631585 U JP 3631585U JP H0412696 Y2 JPH0412696 Y2 JP H0412696Y2
Authority
JP
Japan
Prior art keywords
drive circuit
light emitting
module
optical transmission
circuit section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985036315U
Other languages
English (en)
Japanese (ja)
Other versions
JPS61153356U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985036315U priority Critical patent/JPH0412696Y2/ja
Publication of JPS61153356U publication Critical patent/JPS61153356U/ja
Application granted granted Critical
Publication of JPH0412696Y2 publication Critical patent/JPH0412696Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Optical Communication System (AREA)
JP1985036315U 1985-03-14 1985-03-14 Expired JPH0412696Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985036315U JPH0412696Y2 (enExample) 1985-03-14 1985-03-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985036315U JPH0412696Y2 (enExample) 1985-03-14 1985-03-14

Publications (2)

Publication Number Publication Date
JPS61153356U JPS61153356U (enExample) 1986-09-22
JPH0412696Y2 true JPH0412696Y2 (enExample) 1992-03-26

Family

ID=30541375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985036315U Expired JPH0412696Y2 (enExample) 1985-03-14 1985-03-14

Country Status (1)

Country Link
JP (1) JPH0412696Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0625694B2 (ja) * 1989-10-26 1994-04-06 日本電気株式会社 光受信モジュール

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5916435A (ja) * 1982-07-20 1984-01-27 Hitachi Ltd 光送信モジユ−ル

Also Published As

Publication number Publication date
JPS61153356U (enExample) 1986-09-22

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