JPH0412688Y2 - - Google Patents

Info

Publication number
JPH0412688Y2
JPH0412688Y2 JP1987049156U JP4915687U JPH0412688Y2 JP H0412688 Y2 JPH0412688 Y2 JP H0412688Y2 JP 1987049156 U JP1987049156 U JP 1987049156U JP 4915687 U JP4915687 U JP 4915687U JP H0412688 Y2 JPH0412688 Y2 JP H0412688Y2
Authority
JP
Japan
Prior art keywords
heat
semiconductor
concentration
chips
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1987049156U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63155646U (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987049156U priority Critical patent/JPH0412688Y2/ja
Publication of JPS63155646U publication Critical patent/JPS63155646U/ja
Application granted granted Critical
Publication of JPH0412688Y2 publication Critical patent/JPH0412688Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1987049156U 1987-03-31 1987-03-31 Expired JPH0412688Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987049156U JPH0412688Y2 (enrdf_load_stackoverflow) 1987-03-31 1987-03-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987049156U JPH0412688Y2 (enrdf_load_stackoverflow) 1987-03-31 1987-03-31

Publications (2)

Publication Number Publication Date
JPS63155646U JPS63155646U (enrdf_load_stackoverflow) 1988-10-12
JPH0412688Y2 true JPH0412688Y2 (enrdf_load_stackoverflow) 1992-03-26

Family

ID=30871345

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987049156U Expired JPH0412688Y2 (enrdf_load_stackoverflow) 1987-03-31 1987-03-31

Country Status (1)

Country Link
JP (1) JPH0412688Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS63155646U (enrdf_load_stackoverflow) 1988-10-12

Similar Documents

Publication Publication Date Title
JPH02306656A (ja) 樹脂封止型半導体装置
JPH0492462A (ja) 半導体装置
JPS6149446A (ja) 樹脂封止型半導体装置
JPH0412688Y2 (enrdf_load_stackoverflow)
JPS6042620B2 (ja) 半導体装置の封止体
US7768104B2 (en) Apparatus and method for series connection of two die or chips in single electronics package
JP2828358B2 (ja) 半導体放熱構造
JPH09283667A (ja) テープ接着形ヒートシンク
JPH03280453A (ja) 半導体装置及びその製造方法
JPH09139444A (ja) 樹脂封止型半導体装置
TWI355723B (en) Heat spreader chip scale package and method for ma
JPH05160304A (ja) 半導体装置
TWI750054B (zh) 晶片封裝方法以及晶片封裝單元
JP2812372B2 (ja) 半導体装置
JPH04219966A (ja) 半導体素子
JP2532843B2 (ja) 電子装置
JPS61144834A (ja) 樹脂封止型半導体装置
JPS6223088Y2 (enrdf_load_stackoverflow)
JPH06244334A (ja) 樹脂封止型半導体装置
KR20050051806A (ko) 방열특성이 개선된 반도체 패키지 및 그 제조방법
JPH03101256A (ja) 半導体装置
CN202549934U (zh) Led封装结构
JPH11168161A (ja) パワーモジュール及びそのヒートシンクへの取付け方法
JPH06326230A (ja) 樹脂封止型半導体装置
JPH0625007Y2 (ja) 多電源素子用パツケージ